SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE |
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| 申请号 | US15893527 | 申请日 | 2018-02-09 | 公开(公告)号 | US20180166297A1 | 公开(公告)日 | 2018-06-14 |
| 申请人 | MediaTek Inc.; | 发明人 | Wen-Sung Hsu; Ta-Jen Yu; | ||||
| 摘要 | The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface. | ||||||
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| 说明书全文 | |||||||
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