子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 41 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME | US16031481 | 2018-07-10 | US20180322999A1 | 2018-11-08 | Hironobu KUBOTA; Mitsunori INOUE; Tomohiko MORI; Gota SHINOHARA; Kenji NISHIYAMA |
| An electronic component includes a main body composed of an insulator, a coating film covering the main body, a circuit element located inside the main body, and outer electrodes. The insulator contains a metal magnetic powder. The coating film is composed of a resin and a cationic element contained in the insulator. | ||||||
| 42 | LC filter | US15849938 | 2017-12-21 | US10122340B2 | 2018-11-06 | Hiroshi Masuda |
| An LC filter includes a laminate including insulating layers laminated in a lamination direction, an inductor having a spiral or helical shape around an axis parallel or substantially parallel to the lamination direction, and a capacitor in which capacitor conductors face each other. The inductor and the capacitor do not overlap as viewed from the lamination direction and all directions orthogonal or substantially orthogonal to the lamination direction. | ||||||
| 43 | Thin film coil and electronic device having the same | US15654092 | 2017-07-19 | US10122183B2 | 2018-11-06 | Dae Ki Lim; Tae Sung Kim; Hyeon Gil Nam; Chan Gwang An; Hyun Seok Lee; Ki Won Chang; Chang Mok Han; Sang Woo Bae; Sung Eun Cho; Jae Suk Sung |
| There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates. | ||||||
| 44 | Semiconductor package and method for fabricating base for semiconductor package | US14663772 | 2015-03-20 | US10115604B2 | 2018-10-30 | Wen-Sung Hsu; Ta-Jen Yu |
| A method for fabricating a base for a semiconductor package is provided. The method operates by providing a carrier with conductive seed layers on the top surface and the bottom surface of the carrier, forming radio-frequency (RF) devices respectively on the conductive seed layers, laminating a first base material layer and a second base material layer respectively on the conductive seed layers, covering the RF devices, and separating the first base material layer the second base material layer, which contain the RF devices thereon, from the carrier to form a first base and a second base. | ||||||
| 45 | SURFACE MOUNT COIL COMPONENT, METHOD OF MANUFACTURING THE SAME, AND DC-DC CONVERTER USING THE SAME | US16016726 | 2018-06-25 | US20180308627A1 | 2018-10-25 | Noboru KATO; Satoshi ISHINO; Mitsuyoshi NISHIDE; Shinichiro BANBA; Masahiro OZAWA |
| A surface mount coil component includes an element body with a first surface, a second surface that opposes the first surface, and a third surface connecting the first surface and the second surface, the element body being defined by a compact including magnetic particles; a first conductor pattern provided at the first surface of the element body; a second conductor pattern provided at the second surface of the element body; input/output terminals provided at the third surface of the element body; and metal pins embedded in the element body, ends of each metal pin being connected to the first and second conductor patterns. The first conductor pattern, the second conductor pattern, and the metal pins define a coil conductor. The input/output terminals are defined by a pair of metal pins exposed at the third surface. | ||||||
| 46 | COMMON MODE NOISE FILTER | US15544647 | 2016-01-12 | US20180286563A1 | 2018-10-04 | Atsushi SHINKAI; Kenji UENO |
| A common mode noise filter of the present disclosure includes: a first insulating layer; a second insulating layer formed under the first insulating layer; a first coil including a first coil conductor and a second coil conductor, the first coil conductor being electrically connected to the second coil conductor; a second coil including a third coil conductor and a fourth coil conductor, the third coil conductor being electrically connected to the fourth coil conductor; and a third coil including a fifth coil conductor and a sixth coil conductor, the fifth coil conductor being electrically connected to the sixth coil conductor. Further, the first coil conductor, the third coil conductor, and the fifth coil conductor are sequentially formed on the first insulating layer from the outer side. The sixth coil conductor, the fourth coil conductor, and the second coil conductor are sequentially formed on second insulating layer from the outer side. | ||||||
| 47 | COIL-INCORPORATED COMPONENT | US15973560 | 2018-05-08 | US20180254139A1 | 2018-09-06 | Hirokazu YAZAKI |
| A coil-incorporated component includes a first coil element including a first coil pattern and a second coil pattern, and a second coil element including a third coil pattern and a fourth coil pattern. The first coil pattern and the third coil pattern are provided in a first base material layer, the second coil pattern and the fourth coil pattern are provided in a second base material layer. When a coil-incorporated component is viewed from a lamination direction, the first coil pattern and the fourth coil pattern at least partially overlap with each other, the second coil pattern and the third coil pattern at least partially overlap with each other. An intermediate layer having a low magnetic permeability is provided between the first coil pattern and the fourth coil pattern and between the second coil pattern and the third coil pattern. | ||||||
| 48 | ESD protection device and common mode choke coil with built-in ESD protection device | US15236619 | 2016-08-15 | US10062501B2 | 2018-08-28 | Satoshi Shigematsu |
| An ESD protection device includes a multilayer body including base material layers, a hollow portion inside the multilayer body, a ground electrode exposed at the hollow portion, first and second discharge electrodes exposed at the shared hollow portion and opposing the common ground electrode, and an auxiliary discharge electrode including conductive particles dispersed in the base material layer and extending along an inner surface of the hollow portion. At least the auxiliary discharge electrode in an adjacent region between the first discharge electrode and the second discharge electrode is divided into a portion on the first discharge electrode side and a portion on the second discharge electrode side by a non-formation section where the auxiliary discharge electrode is not provided in the hollow portion. | ||||||
| 49 | MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTAGE REGULATOR | US15911958 | 2018-03-05 | US20180197845A1 | 2018-07-12 | Yongki Min; Reynaldo A. Olmedo; William J. Lambert; Kaladhar Radhakrishnan; Leigh E. Wojewoda; Venkat Anil K. Magadala; Clive R. Hendricks |
| An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module. | ||||||
| 50 | CHIP INDUCTOR | US15788843 | 2017-10-20 | US20180166206A1 | 2018-06-14 | Hiroya UEYAMA; Akihiro ONO |
| In a multilayer body including a plurality of laminated insulating material layers on which a plurality of coil patterns are provided, the plurality of coil patterns are connected to each other to form a coil having a coil axis parallel to a lamination direction. A pair of outer electrodes connected to the coil are disposed at both ends in the lamination direction. When a direction orthogonal to the lamination direction is defined in an up-down direction, the coil patterns are disposed within the multilayer body so as to be shifted to an upper side. At least a portion of a vertical projection image of the coil on a virtual plane orthogonal to the lamination direction does not overlap a vertical projection image of the outer electrodes on the virtual plane. | ||||||
| 51 | METHOD OF MANUFACTURING COIL COMPONENT | US15846742 | 2017-12-19 | US20180108475A1 | 2018-04-19 | Akinori HAMADA; Kenji NISHIYAMA; Shinji YASUDA |
| A method of manufacturing a coil component includes the steps of disposing a dummy metal layer on a base; laminating a base insulating resin on the dummy metal layer; exposing the dummy metal layer by disposing an opening part in the base insulating resin; disposing a spiral wiring on the base insulating resin and disposing a sacrificial conductor on the dummy metal layer in the opening part of the base insulating resin; enlarging the sacrificial conductor by plating by energizing the dummy metal layer; covering the spiral wiring and the sacrificial conductor with an insulating resin; exposing the sacrificial conductor by disposing an opening part in the insulating resin; forming a hole part by removing the sacrificial conductor by etching from the opening part of the insulating resin; and constructing the inner magnetic path of a magnetic resin by filling the hole part with the magnetic resin. | ||||||
| 52 | Semiconductor package and method for fabricating base for semiconductor package | US14205836 | 2014-03-12 | US09922844B2 | 2018-03-20 | Wen-Sung Hsu; Ta-Jen Yu |
| The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface. | ||||||
| 53 | Magnetic small footprint inductor array module for on-package voltage regulator | US14974978 | 2015-12-18 | US09911723B2 | 2018-03-06 | Yongki Min; Reynaldo A. Olmedo; William J. Lambert; Kaladhar Radhakrishnan; Leigh E. Wojewoda; Venkat Anil K. Magadala; Clive R. Hendricks |
| An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module. | ||||||
| 54 | Multilayer electronic component | US14869205 | 2015-09-29 | US09893703B2 | 2018-02-13 | Young Ghyu Ahn; Byoung Hwa Lee; Min Cheol Park |
| A multilayer electronic component includes a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body. The body includes a first capacitor part and a second capacitor part having different levels of capacitance. The first and second capacitor parts each include at least two among the plurality of internal electrodes and at least one of the ceramic layers or magnetic layers is interposed therebetween. | ||||||
| 55 | THIN FILM COIL AND ELECTRONIC DEVICE HAVING THE SAME | US15653725 | 2017-07-19 | US20170317505A1 | 2017-11-02 | Dae Ki LIM; Tae Sung KIM; Hyeon Gil NAM; Chan Gwang AN; Hyun Seok LEE; Ki Won CHANG; Chang Mok HAN; Sang Woo BAE; Sung Eun CHO; Jae Suk SUNG |
| There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates. | ||||||
| 56 | Carbon nanotube-based integrated power inductor for on-chip switching power converters | US13464783 | 2012-05-04 | US09793039B1 | 2017-10-17 | Jaber A. Abu Qahouq |
| An inductor has a substrate and at least one coil of carbon nanotubes. A trench is formed in the substrate, and the carbon nanotubes are grown in the trench in order to form a coil for the inductor. In some embodiments, multiple coils may be formed in the trench as may be desired. | ||||||
| 57 | COMPOSITE ELECTRONIC COMPONENT | US15274528 | 2016-09-23 | US20170236640A1 | 2017-08-17 | Ho Yoon KIM; Soo Hwan SON; Man Su BYUN |
| A composite electronic component includes: a body part including a dielectric portion; first and second external electrodes disposed on outer surfaces of the body part; a plurality of first and second electrodes disposed inside of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; third and fourth electrodes disposed on an upper portion of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; a gap provided between the third and fourth electrodes; a groove disposed below the gap; and an electrostatic discharge (ESD) layer disposed in the gap. | ||||||
| 58 | Electronic component | US15131123 | 2016-04-18 | US09634633B2 | 2017-04-25 | Hiroshi Masuda |
| An electronic component includes a device body and first through n-th LC parallel resonators connected in series with each other. The first through n-th LC parallel resonators respectively include first through n-th inductors and first through n-th capacitors. The first through n-th inductors are disposed in the device body such that they are arranged in a first direction in this order. The first and n-th inductors are provided with a spiral shape such that they turn around respective winding axes extending along the first direction. At least one of the second through (n−1)-th inductors is provided with a helical shape such that it turns around a winding axis extending along the first direction. | ||||||
| 59 | Vertically integrated systems | US14966920 | 2015-12-11 | US09513246B2 | 2016-12-06 | Alan J. O'Donnell; Santiago Iriarte; Mark J. Murphy; Colin G. Lyden; Gary Casey; Eoin Edward English |
| Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | ||||||
| 60 | ELECTRONIC COMPONENT | US15134505 | 2016-04-21 | US20160233845A1 | 2016-08-11 | Hiroshi MASUDA; Tomoshiro ISOSHIMA |
| An electronic component includes a device body and first through n-th LC parallel resonators connected in series with each other. The first through n-th LC parallel resonators respectively include first through n-th inductors and first through n-th capacitors. The first through n-th inductors are disposed in a first direction in the device body in this order. The first and n-th inductors are provided with a spiral shape or a helical shape such that they turn around respective winding axes extending along a second direction which is perpendicular or substantially perpendicular or substantially perpendicular or substantially perpendicular to the first direction. At least one of the second through (n−1)-th inductors is provided with a helical shape such that it turns around a winding axis extending along the first direction. | ||||||
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