Apparatus with 3D wirewound inductor integrated within a substrate |
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| 申请号 | US15160776 | 申请日 | 2016-05-20 | 公开(公告)号 | US10026546B2 | 公开(公告)日 | 2018-07-17 |
| 申请人 | QUALCOMM Incorporated; | 发明人 | Changhan Hobie Yun; Chengjie Zuo; Daeik Daniel Kim; Mario Francisco Velez; Niranjan Sunil Mudakatte; Jonghae Kim; David Francis Berdy; | ||||
| 摘要 | An apparatus includes a substrate and a three-dimensional (3D) wirewound inductor integrated within the substrate. The apparatus further includes a capacitor coupled to the 3D wirewound inductor. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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