子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | System comprising a multi-layer-multi-turn structure for high efficiency wireless communication | US13233624 | 2011-09-15 | US08653927B2 | 2014-02-18 | Vinit Singh; Christine A. Frysz |
| A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. | ||||||
| 142 | VERTICALLY INTEGRATED SYSTEMS | US14041804 | 2013-09-30 | US20140035630A1 | 2014-02-06 | Alan J. O'DONNELL; Santiago IRIARTE; Mark J. MURPHY; Colin G. LYDEN; Gary CASEY; Eoin Edward ENGLISH |
| Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | ||||||
| 143 | VERTICALLY INTEGRATED SYSTEMS | US14041780 | 2013-09-30 | US20140026649A1 | 2014-01-30 | Alan J. O'DONNELL; Santiago IRIARTE; Mark J. MURPHY; Colin G. LYDEN; Gary CASEY; Eoin Edward ENGLISH |
| Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | ||||||
| 144 | MRI compatible implantable medical lead and method of making same | US12262047 | 2008-10-30 | US08634931B2 | 2014-01-21 | Xiaoyi Min; J. Christopher Moulder; Yong D. Zhao; Virote Indravudh; Ingmar Viohl |
| An implantable medical lead is disclosed herein. In one embodiment, the lead includes a body and an electrical pathway. The body may include a distal portion with an electrode and a proximal portion with a lead connector end. The electrical pathway may extend between the electrode and lead connector end and include a coiled inductor including a first portion and a second portion at least partially magnetically decoupled from the first portion. The first portion may include a first configuration having a first SRF. The second portion may include a second configuration different from the first configuration. The second configuration may have a second SRF different from the first SRF. For example, the first SRF may be near 64 MHz and the second SRF may be near 128 MHz. | ||||||
| 145 | Multi-layer-multi-turn structure for tunable high efficiency inductors | US13797437 | 2013-03-12 | US08610530B2 | 2013-12-17 | Vinit Singh; Jacob Babcock; Christine A. Frysz |
| A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater. | ||||||
| 146 | Method of manufacture of multi-layer wire structure | US13233686 | 2011-09-15 | US08567048B2 | 2013-10-29 | Vinit Singh; Christine A. Frysz; Matthew Geary; Eitan Babcock; Justin Derbas |
| A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. | ||||||
| 147 | SYSTEMS USING MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDUCTORS | US13797629 | 2013-03-12 | US20130208390A1 | 2013-08-15 | Vinit SINGH; Jacob BABCOCK; Christine A. FRYSZ |
| A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater. | ||||||
| 148 | METHOD FOR MANUFACTURE OF MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDUCTORS WITH CAVITY | US13797478 | 2013-03-12 | US20130205582A1 | 2013-08-15 | Vinit SINGH; Jacob BABCOCK; Christine A. FRYSZ |
| A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater. | ||||||
| 149 | METHOD FOR MANUFACTURE OF MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDUCTORS | US13797459 | 2013-03-12 | US20130199027A1 | 2013-08-08 | Vinit SINGH; Jacob BABCOCK; Christine A. FRYSZ |
| A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater. | ||||||
| 150 | Method for Manufacture of Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Communication | US13233735 | 2011-09-15 | US20130067738A1 | 2013-03-21 | Vinit Singh; Christine A. Frysz; Matthew Geary; Eitan Babcock; Justin Derbas |
| A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. | ||||||
| 151 | Electromagnetic interference filter | US13018366 | 2011-01-31 | US08098495B2 | 2012-01-17 | Ho Yan Ho |
| A differential mode and common mode combination choke (DCCC) includes: a theta-shaped magnetic core including an essentially round magnetic ring and a magnetic plate engaged with magnetic ring across the area surrounded by the magnetic ring; and two common mode coils with the same number of turns and the same winding direction being wound around the magnetic ring. An EMI (electromagnetic interference) filter and an EMI filter module including the DCCC are also provided. | ||||||
| 152 | IMPLANTABLE LEAD FOR AN ACTIVE MEDICAL DEVICE HAVING AN INDUCTOR DESIGN MINIMIZING EDDY CURRENT LOSSES | US13042177 | 2011-03-07 | US20110230943A1 | 2011-09-22 | Robert Shawn Johnson; Warren S. Dabney; Holly Noelle Moschiano; Robert A. Stevenson |
| A shielded component or network for an active medical device (AMD) implantable lead includes an implantable lead having a length extending from a proximal end to a distal end, all external of an AMD housing, and a passive component or network disposed somewhere along the length of the implantable lead. The passive component or network including at least one inductive component having a primary magnetic field line axis. A conductive shield or housing having a primary longitudinal axis substantially surrounds the inductive component or the passive network. The inductive component's magnetic field line axis is oriented substantially orthogonally to the primary longitudinal axis of the conductive shield or housing. | ||||||
| 153 | MRI COMPATIBLE IMPLANTABLE MEDICAL LEAD AND METHOD OF MAKING SAME | US12262047 | 2008-10-30 | US20100114276A1 | 2010-05-06 | Xiaoyi Min; J. Christopher Moulder; Yong D. Zhao; Virote Indravudh; Ingmar Viohl |
| An implantable medical lead is disclosed herein. In one embodiment, the lead includes a body and an electrical pathway. The body may include a distal portion with an electrode and a proximal portion with a lead connector end. The electrical pathway may extend between the electrode and lead connector end and include a coiled inductor including a first portion and a second portion at least partially magnetically decoupled from the first portion. The first portion may include a first configuration having a first SRF. The second portion may include a second configuration different from the first configuration. The second configuration may have a second SRF different from the first SRF. For example, the first SRF may be near 64 MHz and the second SRF may be near 128 MHz. | ||||||
| 154 | Filtering induction device | US10127288 | 2002-04-22 | US20020158738A1 | 2002-10-31 | Han-Cheng Hsu; Wen-Te Ko |
| A filtering induction device is provided to improve the filter effect via the increase of an insertion loss resulting from stray capacitance. The induction device includes at least one core structure, and first and second flat coils that interlacing with each other. The first flat coil is used as an inductor, and the second flat coil is used as an electrode belonging to a capacitor formed between the circles of the first flat coil. | ||||||
| 155 | Method for creating on-package inductors for use with integrated circuits | US890855 | 1997-07-10 | US5839184A | 1998-11-24 | Peter Chi-Ming Ho; D. Douglas Baumann; Sang S. Lee |
| A method is described for creating an inductor in the package for an integrated circuit. The inductor is formed by utilizing one or more of the bond leads as the core of the inductor and by winding a series of coils about the core in connection either with the bond pads of the integrated circuit itself or to other bond leads for connection outside the integrated circuit chip. | ||||||
| 156 | Inductor winding apparatus and method | US796180 | 1991-11-22 | US5321965A | 1994-06-21 | Donald R. Baird |
| There are provided low profile inductor and transformer windings, and methods for fabricating the same. An elongate conductive ribbon is wound in one continuous direction on a generally hourglass shaped mandrel to form the ribbon into a double conical helix having a plurality of spaced apart coils. A sheet of dielectric material having an orifice therethrough is threaded to the midpoint of the double conical helix. The two sides of the helix are then compressed into planes such that the coils in each side lie flat and engage the adjacent side of the sheet of dielectric material. A compound inductor winding can be fabricated from a continuous conductive ribbon wound into a plurality of double conical helixes joined end-to-end. After compression, the compound winding consists of a low profile stack of spiraled windings connected in series, but constituting only one continuous ribbon having no internal connections. | ||||||
| 157 | Wire coil assembly for an electrical circuit | US54094 | 1979-07-02 | US4229722A | 1980-10-21 | Perry C. Olsen |
| A wire coil assembly including a form for supporting a wire wound thereon, a base for the wire form, and terminals attached to the base and to which the ends of the wire are respectively connected. The base includes a number of exposed grooves through which the wire ends are routed from the wire form to the terminals. The grooves are configured to contain the wire ends, thereby eliminating exposed wire ends which would otherwise be susceptible of stress breakage when the coil assembly is handled. | ||||||
| 158 | Magnetic packaging module | US3614629D | 1969-08-13 | US3614629A | 1971-10-19 | SUES LAWRENCE B |
| A radio frequency module employing a segmented magnetic structure for packaging a ferrimagnetic tuned circuit. The planar electronic circuitry is packaged in the center section of a three part magnetic structure. Connector pins positioned on the bottom of the module serve to conduct the output signals from the electronic circuitry and to control the magnetic field intensity by means of solenoids located in the outer sections of the module.
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| 159 | Inductance coil with symmetrical windings and low capacitance between windings | US1106960 | 1960-02-25 | US3181096A | 1965-04-27 | PAUL RAUB WERNER |
| 160 | Radio frequency choke | US44057354 | 1954-06-30 | US3052860A | 1962-09-04 | WALTERS III FRANCIS M |
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