专利汇可以提供Manufacture of semiconductor device专利检索,专利查询,专利分析的服务。并且PURPOSE: To form the 2nd rsistance wiring through the insulator thin film by forming the island-shaped poly Si layer on the insulator thick and thin films on the Si substrate and changing the island-shaped layer into the 1st resistance wiring via injection of the ion.
CONSTITUTION: SiO
2 thick film 2 and thin film 3 are formed selectively on p-type Si substrate 1 and then covered with the poly Si, and island layer 4 is formed through the selective etching. Then the phosphorus ion is injected to form high- resistance gate 4a', n
- -type high-resistance layer 5a and 5b, high-resistance wiring 4b' and 4c', and high-resistance layer 5c and 5d respectively. Then CVDSiO
2 mask 6a and 6b are formed selectively, and the n
+ -layer is formed through the phosphorus diffusion. At the same time, the phosphorus is added partially to the high- resistance poly Si layer to obtain n-channel FET at region I, resistance layer 4b' of about 30Ω/cm
2 and high-resistance layer 4c' of several GΩ/cm
2 at resion II, and diffusion resistance 5c' of about 15Ω/cm
2 and high resistance 5d of KΩ/cm
2 at region III respectively. Thus, the four types of resistance are obtained in this constitution, which is advantageous for the layout of the circuit design.
COPYRIGHT: (C)1979,JPO&Japio,下面是Manufacture of semiconductor device专利的具体信息内容。
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