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Apparatus for compressing chipboards

阅读:927发布:2022-09-04

专利汇可以提供Apparatus for compressing chipboards专利检索,专利查询,专利分析的服务。并且Improved apparatus for the production of chipboard wherein the gap width between two heated pressing members at the commencement of the pressing operation is smaller than the thickness of the chipboard to be manufactured.,下面是Apparatus for compressing chipboards专利的具体信息内容。

1. In an apparatus for producing chipboard from a layer of wood chips and binders, said chipboard having a predetermined thickness, said apparatus including a first and second heated pressure member and a steel band, said steel band carrying said layer between said first and second heated pressure members, the improvement comprising means for producing high chip density outer regions and a low chip density intermediate region in said chipboard, said producing means including means for positioning said first heated pressure member relative to said second heated pressure member to initially compress said layer to a thickness less than said predetermined thickness.
2. An improvement as claimed in claim 1 wherein said first heated pressure member is a first pressure cylinder and said second heated pressure member is a second pressure cylinder, said first and second pressure cylinders defining a gap therebetween, said gap being less than said predetermined thickness.
3. An improvement as claimed in claim 2 wherein said steel band wraps around a portion of said first pressure cylinder to define a second gap between said steel band and said portion of said second pressure cylinder and downstream from said gap between said first and second pressure cylinders, said second gap being substantially equal to said predetermined thickness.
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