Manufacturing light particle board
专利汇可以提供Manufacturing light particle board专利检索，专利查询，专利分析的服务。并且PURPOSE:To manufacture a particle board as light in weight as usual wood at one process by a method wherein wooden chips are bonded by foaming resin adhesive agent to provide a particle board with densities 0.1-0.6g/cm . CONSTITUTION:For the surface layer are used needle-leaf tree chips passing through 2mm. sieve openings and having a moisture content of 5wt% and for the core are used needle-leaf tree chips which are 5-30mm. long, 1-5mm. wide, 0.5-2 thick and have a moisture content of 5wt%. For adhesive agent is used urethane resin of 100 parts of EGH-400 and 100 parts of MD1-CR-200 manufactured by the Mitsui-Nisso Urethane 1nc., and for foam stabilizer is used a mixture of 1 part of silicone L-5340 manufactured by the Nippon Yunker (lnc.) and 100 parts of water. A particle board having a density 0.3g/cm and a thickness 2.0mm. is obtained at thermal compression temperature 150 deg.C, in thermal compression time 5min, by normal pressure molding.，下面是Manufacturing light particle board专利的具体信息内容。
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