Manufacture of composite integrated circuit
专利汇可以提供Manufacture of composite integrated circuit专利检索，专利查询，专利分析的服务。并且PURPOSE:To improve a close adhesion strength of a substrate and resist film by a method wherein an external connected terminal fixing means of a glaze protecting ground film which is formed on a partially glazed alumina substrate is removed. CONSTITUTION:The ground film 3 of beta-Ta is spattered on the alumina substrare 2 on which the glaze means 1 is formed. Then, the ground film 12 at a portion where the external connected terminal is to be fixed is eclipse-removed, and heat-treated to form the ground film 4 of Ta2O5. Thereafter, as in conventional, a resist film 6 is formed with Ta2N as a spatter, an upper electrode 9 formed on An and Ni-Cr is faced and the external connected terminal 10 is heat-pressurized. In the thus composed IC, the part of the clumina substrate where the glaze is not formed is not corroded by a mixed liquid of hydrofluoric acid and nitric acid on applying etching to a condenser film. Accordingly, when the resist film 6 is formed, an adhesive force between the resist film 6 and the substrate 2 is excellent and high in separation strength.，下面是Manufacture of composite integrated circuit专利的具体信息内容。
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