| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 121 | METHOD OF PROTECTING AN ARTICLE HAVING A COMPLEX SHAPE | US15533829 | 2015-12-01 | US20170326587A1 | 2017-11-16 | Atanu SAHA; Gopi Chandran RAMACHANDRAN; Mamatha NAGESH; Shalini THIMMEGOWDA; Bala Srinivasan PARTHASARATHY |
| A silicone bond coat composition having a viscosity of less than 1,600 centistokes is applied to substantially all external surfaces of the article and then cured. A liquid silicone elastomer outer coat composition comprising a high viscosity first liquid silicone elastomer formulation and a low viscosity second liquid silicone elastomer formulation is then applied and cured to provide a protected article having a complex shape. Optimal coatings result from a careful balancing of component viscosities. In an embodiment, the first formulation has a viscosity greater than 300,000 centistokes, and the second formulation has a viscosity less than 6,000 centistokes, and the liquid silicone elastomer outer coat composition comprises from about 60 to about 40 percent by weight of the first formulation and from about 40 to about 60 percent by weight of the second liquid silicone elastomer formulation. | ||||||
| 122 | Composite articles and methods of producing same | US13814183 | 2011-08-02 | US09764529B2 | 2017-09-19 | Warrick James David Allen; James Leonard Rolfe; Nicholas Horrocks; Paul Edward Young Milne |
| According to the invention there is provided a composite article including: a textile layer having a first and a second face, each of the first and second faces having a polymeric coating thereon; a first polymeric layer adhered to the polymeric coating on the first face of the textile layer; and a second polymeric layer adhered to the polymeric coating on the second face of the textile layer; in which the polymeric coatings on the first and second faces of the textile layer are each formed by polymerizing a polymeric precursor which includes a group of sub-formula (I) where R2 and R3 are independently selected from (CR7R8)n, or a group CR9R10, CR7R8CR9R10 or CR9R10CR7R8 where n is 0, 1 or 2, R7 and R8 are independently selected from hydrogen, halo or hydrocarbyl, and either One of R9 or R10 is hydrogen and the other is an electron withdrawing group, or R9 and R10 together form an electron withdrawing group, and R4 and R5 are independently selected from CH or CR11 where R11 is an electron withdrawing group, the dotted lines indicate the presence or absence of a bond, X1 is a group CX2X3 where the dotted line bond to which it is attached is absent and a group CX2 where the dotted line bond to which it is attached is present, Y1 is a group CY2Y3 where the dotted line bond to which it is attached is absent and a group CY2 where the dotted line bond to which it is attached is present, and X2, X3, Y2 and Y3 are independently selected from hydrogen, fluorine or other substituents, R1 is selected from hydrogen, halo, nitro, hydrocarbyl, optionally substituted or interposed with functional groups, or formula (II), and R13 is C(0) or S(0)2. | ||||||
| 123 | Method for the production of a wafer with a carrier unit | US14888927 | 2014-05-05 | US09754810B2 | 2017-09-05 | Lukas Lichtensteiger |
| The invention relates to a method for the production of layers of solid material, in particular for use as wafers, comprising the following steps: providing a workpiece for the separation of layers of solid material, the workpiece having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material, the carrier unit being made in a number of layers, the carrier unit having a stabilisation layer and the stabilisation layer being overlapped at least partially by a receiving layer, the receiving layer being made to hold the layer of solid material, and the stabilisation layer being formed, at least partially, such that it has an E modulus that is greater than the E modulus of the receiving layer, connecting the receiving layer to the exposed surface of the workpiece, thus forming a composite structure, exposing the composite structure to an inner and/or outer stress field such that the layer of solid material is separated along a plane of the workpiece extending within the workpiece. | ||||||
| 124 | ADHESIVE MEMBER FOR AN ELECTRONIC DEVICE | US15387044 | 2016-12-21 | US20170177028A1 | 2017-06-22 | FUMITAKE MIZOGUCHI; TAKEHITO YAMAUCHI; YOSHIHISA ISHIHARA; KEITA ISHIKAWA |
| An adhesive member is disclosed. The adhesive member includes a first release element, a second release element and a body. The body includes a first adhesive surface and a second adhesive surface. The body also includes a first end face and a second end face. The first end face forms an acute angle with the first release element located on the body. The second end face faces the first end face and forms an obtuse angle with the second release element of the body. | ||||||
| 125 | VACUUM INSULATION PANEL COMPRISING AN ORGANIC AEROGEL | US15118346 | 2014-02-12 | US20170165946A1 | 2017-06-15 | Nadine POUPA PARSIGNEAU; Benjamin SWOBOBA; Cedric HUILLET; Christophe DOMINIAK |
| The present invention relates to a vacuum insulation board (1) comprising: a hermetically closed covering (3) in which the pressure is lower than atmospheric pressure, a core material (5) made of organic aerogel placed inside said covering (3), said organic aerogel being based on a resin resulting at least in part from polyhydroxybenzene(s) R and formaldehyde(s) F, said organic aerogel being a polymeric monolithic organic gel comprising at least one water-soluble cationic polyelectrolyte, or said organic aerogel being a pyrolysate of said gel in the form of a porous carbon monolith comprising the product of the pyrolysis of said at least one water-soluble cationic polyelectrolyte P, said organic aerogel exhibiting a specific thermal conductivity of between 10 and 40 mW·m−1·K−1 at atmospheric pressure. | ||||||
| 126 | COMPOSITION FOR REMOVING SILICONE RESINS AND METHOD OF THINNING SUBSTRATE BY USING THE SAME | US15369859 | 2016-12-05 | US20170158888A1 | 2017-06-08 | In-goo KANG; Sung-bae KIM; Baik-soon CHOI; Sue-ryeon KIM; Young-taek HONG; Sang-tae KIM; Kyong-ho LEE; Hyung-pyo HONG; Seong-min KIM |
| Disclosed herein are compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins. More particularly, disclosed herein are compositions for removing silicone resins, the compositions including a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F−, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like. | ||||||
| 127 | Microfluidic chips with optically transparent glue coating and a method of manufacturing microfluidic chips with optically transparent glue coating for a microfluidic device | US14934794 | 2015-11-06 | US09636674B2 | 2017-05-02 | Tej Patel; Ryan Revilla; Matthew D'Ooge |
| A microfluidic chip for a microfluidic system includes a PDMS substrate having a first thickness, at least one microfluidic pathway in the substrate, a coating along the microfluidic pathway, and a glass layer having a second thickness on the substrate and above the microfluidic pathway, wherein the coating contains an optically transparent material, and the first thickness is greater than the second thickness. The coating includes cyanoacrylates, an UV curable epoxy adhesive, a gel epoxy or epoxy under trade name of EPO-TEK OG175, MasterBond EP30LV-1 or Locite 0151. | ||||||
| 128 | BROADBAND REFLECTORS, CONCENTRATED SOLAR POWER SYSTEMS, AND METHODS OF USING THE SAME | US15384011 | 2016-12-19 | US20170097174A1 | 2017-04-06 | Timothy J. Hebrink; Susannah C. Clear; Laurence R. Gilbert; Michael F. Weber; Ta-hua Yu; Daniel T. Chen; Audrey A. Sherman |
| Broadband reflectors include a UV-reflective multilayer optical film and a VIS/IR-reflective layer. In various embodiments, the VIS/IR reflective layer may be a reflective metal layer or a multilayer optical film. Concentrated solar power systems and methods of harnessing solar energy using the broadband reflectors and optionally comprising a celestial tracking mechanism are also disclosed. | ||||||
| 129 | Label for use on store shelves in a retail environment | US15189096 | 2016-06-22 | US09607531B2 | 2017-03-28 | Jeffrey Weidauer; Michael Wilkinson |
| A label for use on store shelves in a retail environment. The label include adhesive strips applied to a bottom surface of each label and a top laminate layer with a release coating applied to the top surface of each label. | ||||||
| 130 | Composite adhesive tape | US14373549 | 2013-01-18 | US09598613B2 | 2017-03-21 | Shawn Bruce Joseph Daley |
| The specification discloses a composite adhesive tape, containing a thermally reflective and insulative adhesive tape layer; and a rigid adhesive tape layer. Also disclosed is a method of manufacturing a composite adhesive tape, containing the step of laminating a thermally reflective and insulative tape layer with a rigid adhesive tape layer. Further disclosed is a method of applying a flooring material, containing the steps of placing the composite adhesive tape as described herein on a surface; and positioning the flooring material on the tape. | ||||||
| 131 | Method of Applying Labels on Store Shelves in a Retail Environment | US15358336 | 2016-11-22 | US20170072673A1 | 2017-03-16 | Jeffrey Weidauer; Michael Wilkinson; David Adler |
| A method of applying labels to a store shelf in a retail environment. The method includes applying labels with adhesive strips applied to a bottom surface of each label and a top laminate layer with a release coating applied to the top surface of each label. The labels in the pad are sequenced according to a store's planogram. | ||||||
| 132 | Method and system for manufacturing integrated fluidic chips | US13813625 | 2009-07-23 | US09579830B2 | 2017-02-28 | David S. Cohen |
| An integrated fluidic chip includes a substrate defined by a lateral surface area greater than 28 square inches. The integrated fluidic chip also includes a first elastomeric layer having a mold surface and a top surface. The mold surface of the first elastomeric layer is joined to a portion of the substrate. The first elastomeric layer includes a plurality of first channels extending normally from the substrate to a first dimension inside the first elastomeric layer. The integrated fluidic chip further includes a second elastomeric layer having a mold surface and a top surface. The mold surface of the second elastomeric layer is joined to at least a portion of the top surface of the first elastomeric layer. | ||||||
| 133 | METHODS OF USING NANOSTRUCTURED TRANSFER TAPE AND ARTICLES MADE THEREFROM | US15257099 | 2016-09-06 | US20160375666A1 | 2016-12-29 | Michael Benton Free; Martin B. Wolk; Terry O. Collier; Mieczyslaw H. Mazurek; Evan L. Schwartz |
| A method of making patterned structured solid surfaces is disclosed that includes filling a structured template with backfill material to produce a structured transfer film, patternwise curing the backfill material to produce cured areas and uncured areas in the structured transfer film, and laminating the structured transfer film to a receptor substrate. The structured template is capable of being removed to form structured and unstructured backfill layers. The structured and unstructured backfill layers may then be blanket cured. The backfill layer can include at least two different materials, one of which can be an adhesion promotion layer. In some embodiments the backfill layer includes a silsesquioxane such as polyvinyl silsesquioxane. The structured transfer film is a stable intermediate that can be covered temporarily with a release liner for storage and handling. | ||||||
| 134 | Substrate or panel with releasable core | US14135168 | 2013-12-19 | US09522514B2 | 2016-12-20 | Ravi Shankar; Ching-Ping Janet Shen |
| Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil. | ||||||
| 135 | Method of Making a Pad of Labels and Labels for Use on Store Shelves in a Retail Environment | US15233368 | 2016-08-10 | US20160347022A1 | 2016-12-01 | Jeffrey Blackwell; Gene Bethards; Scott Aten |
| A method of making a pad of labels and labels for use on store shelves in a retail environment. The pad of labels include labels with adhesive strips applied to a bottom surface of each label and a top laminate layer with a release coating applied to the top surface of each label. The labels in the pad are sequenced according to a store's planogram. | ||||||
| 136 | Fluorosilicone-based dielectric elastomer and method for its production | US13795543 | 2013-03-12 | US09478727B2 | 2016-10-25 | Holger Böse; Detlev Uhl; Raman Rabindranath |
| A dielectric elastomer has a film that contains a fluorinated silicone elastomer and has two faces. A coating of a stretchable electrode material is applied to each one of the two faces. The fluorinated silicone elastomer has a modulus of elasticity of maximally 450 kPa. The fluorinated silicone elastomer is a three-dimensionally crosslinked, fluorinated, alkyl group-containing polysiloxane in combination with a fluorinated silicone oil. Alternatively, or in addition, the fluorinated silicone elastomer is a three-dimensional wide-mesh crosslinked, fluorinated, alkyl-group containing polysiloxane whose wide mesh property has been effected by a chain length extension by addition of a chain-shaped silicone molecule containing two Si—H groups to an alkenyl group-containing polysiloxane molecule. | ||||||
| 137 | Label for Use on Store Shelves in a Retail Environment | US15189096 | 2016-06-22 | US20160307472A1 | 2016-10-20 | Jeffrey Weidauer; Michael Wilkinson |
| A label for use on store shelves in a retail environment. The label include adhesive strips applied to a bottom surface of each label and a top laminate layer with a release coating applied to the top surface of each label. | ||||||
| 138 | FLEXIBLE THERMAL-CONTROL MATERIAL | US14904727 | 2014-08-26 | US20160159501A1 | 2016-06-09 | Naoki KUSABA; Hidetaka KAFUKU; Kenji NAJIMA |
| This flexible thermal-control material (10A) is obtaining by stacking: a reflective layer (12) which reflects sunlight; and an infrared-ray emission layer (13) which emits infrared rays. The infrared-ray emission layer (13) is configured from a silicone material. Accordingly, a flexible thermal-control material is achieved which exhibits excellent optical characteristics such as solar absorption (α). | ||||||
| 139 | Method of Manufacturing Heat Conductive Sheet, Heat Conductive Sheet, and Heat Dissipation Member | US14898858 | 2014-06-27 | US20160150680A1 | 2016-05-26 | Keisuke ARAMAKI; Atsuya YOSHINARI; Takuhiro ISHII; Shinichi UCHIDA; Masahiko ITO |
| Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet. | ||||||
| 140 | SILICONE RESIN, RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND MAKING METHOD | US14918080 | 2015-10-20 | US20160122586A1 | 2016-05-05 | Kazunori KONDO; Yoichiro ICHIOKA; Hideto KATO |
| A silicone resin comprising constitutional units represented by formula (1) and having a Mw of 3,000-500,000 contains 10-50 wt % of (A-1) a first silicone resin having a silicone content of 10-40 wt % and (A-2) a second silicone resin having a silicone content of 50-80 wt %. A resin composition comprising the silicone resin can be formed in film form, and it possesses satisfactory covering or encapsulating performance to large size/thin wafers. The resin composition or resin film ensures satisfactory adhesion, low warpage, and wafer protection. The resin film is useful in wafer-level packages. | ||||||
QQ群二维码
意见反馈
意见反馈