| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | 마이크로 릴레이 및 그 제조 방법 | KR1019997001582 | 1997-08-26 | KR1020000035875A | 2000-06-26 | 사카타미노루; 나카지마다쿠야; 세키도모노리; 후지와라데루히코; 다케우치마사시 |
| PURPOSE: An extremely small micro relay having such a mechanical contact mechanism is provided for smaller resistance when the contact is turned on and for an excellent vibration resistance, frequency characteristic. CONSTITUTION: The property is constituted in such a way that a piezoelectric element (24)or heater layer (27) is provided on a thin plate like single crystal substrate (21) and a mobile piece (20) carrying a traveling contact (25) on one surface is supported on a base (11) while both ends of the piece (20) are fixed to the base (11) so that the traveling contact (25) can be brought into contact with or separated from a pair of fixed contacts (38 and 39) faced to the contact (25) when the piece (20) is bent by the action of the piezoelectric element (24) or the heater layer (27). | ||||||
| 142 | Metallic device having mobile element in a cavity of the BEOL of an integrated circuit | US15477876 | 2017-04-03 | US09875870B2 | 2018-01-23 | Christian Rivero; Pascal Fornara; Sebastian Orellana |
| In order, for example, to improve the ohmic contact between two metal pieces located at a metallization level, these two metal pieces are equipped with two offset vias located at the metallization level and at least partially at the via level immediately above. Each offset via comprises, for example, a nonoxidizable or substantially nonoxidizable compound, such as a barrier layer of Ti/TiN. | ||||||
| 143 | ELECTROMECHANICAL SWITCHING DEVICE WITH ELECTRODES HAVING 2D LAYERED MATERIALS WITH DISTINCT FUNCTIONAL AREAS | US15485835 | 2017-04-12 | US20170217758A1 | 2017-08-03 | Urs T. Duerig; Armin W. Knoll; Elad Koren; Emanuel Loertscher |
| An electromechanical switching device includes a first electrode, comprising layers of a first 2D layered material, which layers exhibit a first surface; a second electrode, comprising layers of a second 2D layered material, which layers exhibit a second surface opposite the first surface; and an actuation mechanism; wherein each of the first and second 2D layered materials has an anisotropic electrical conductivity, which is lower transversely to its layers than in-plane with the layers; the first electrode includes two distinct areas alongside the first surface, which areas differ in at least one structural, electrical and/or magnetic property; and at least one of the first and second electrodes is actuatable by the actuation mechanism, such that actuation thereof for modification of an electrical conductance transverse to each of the first surface and the second surface to enable current modulation between the first electrode and the second electrode. | ||||||
| 144 | Method of and Apparatus for Protecting a Switch, Such as a MEMS Switch, and to a MEMS Switch Including Such a Protection Apparatus | US14743396 | 2015-06-18 | US20160006241A1 | 2016-01-07 | Padraig L. Fitzgerald; Eric James Carty |
| A method of and apparatus for protecting a MEMS switch is provided. The method and apparatus improve the integrity of MEMS switches by reducing their vulnerability to current flow through them during switching of the MEMS switch between on and off or vice versa. The protection circuit provides for a parallel path, known as a shunt, around the MEMS component. However, components within the shunt circuit can themselves be removed from the shunt when they are not required. This improves the electrical performance of the shunt when the switch is supposed to be in an off state. | ||||||
| 145 | CMOS-MEMS SWITCH STRUCTURE | US13160742 | 2011-06-15 | US20120279838A1 | 2012-11-08 | You-Liang LAI; Ying-Zong JUANG; Hann-Huei TSAI; Sheng-Hsiang TSENG; Chin-Fong CHIU |
| A CMOS-MEMS switch structure is disclosed. The CMOS-MEMS switch structure includes a first substrate, a second substrate, a first cantilever beam, and a second cantilever beam. The first and second substrates are positioned opposite each other. The first cantilever beam is provided on the first substrate, extends from the first substrate toward the second substrate, and bends downward. Likewise, the second cantilever beam is provided on the second substrate, extends from the second substrate toward the first substrate, and bends downward. The first and second substrates are movable toward each other to connect a first top surface of the first cantilever beam and a second top surface of the second cantilever beam, and away from each other so that the first top surface of the first cantilever beam and the second top surface of the second cantilever beam are disconnected, thereby closing or opening the CMOS-MEMS switch structure. | ||||||
| 146 | Method of manufacturing a hysteretic MEMS two-dimensional thermal device | US12588060 | 2009-10-02 | US08245391B2 | 2012-08-21 | Paul J. Rubel |
| A MEMS hysteretic thermal device may be formed having two passive beam segments driven by a current-carrying loop coupled to the surface of a substrate. The first beam segment is configured to move in a direction having a component perpendicular to the substrate surface, whereas the second beam segment is configured to move in a direction having a component parallel to the substrate surface. By providing this two-dimensional motion, a single MEMS hysteretic thermal device may by used to close a switch having at least one stationary contact affixed to the substrate surface. | ||||||
| 147 | Micro-actuator and locking switch | US11519142 | 2006-09-11 | US08120133B2 | 2012-02-21 | Flavio Pardo |
| A micro-electromechanical actuator employs metal for the hot arm and silicon for at least the flexible portion of the cold arm. The cold arm made of silicon is coupled to a metal wire that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches. | ||||||
| 148 | Hysteretic MEMS thermal device and method of manufacture | US12318634 | 2009-01-05 | US07944113B2 | 2011-05-17 | Paul J. Rubel |
| A MEMS hysteretic thermal actuator may have a plurality of beams disposed over a heating element formed on the surface of the substrate. The plurality of beams may be coupled to a passive beam which is not disposed over the heating element. One of the plurality of beams may be formed in a first plane parallel to the substrate, whereas another of the plurality of beams may be formed in a second plane closer to the surface of the substrate. When the heating element is activated, it heats the plurality of beams such that they move the passive beam in a trajectory that is neither parallel to nor perpendicular to the surface of the substrate. When the beams are cooled, they may move in a different trajectory, approaching the substrate before moving laterally across it to their initial positions. By providing one electrical contact on the distal end of the passive beam and another stationary electrical contact on the substrate surface, the MEMS hysteretic actuator may form a reliable electrical switch that is relatively simple to manufacture and operate. | ||||||
| 149 | MEMS ACTUATORS WITH STRESS RELEASING DESIGN | US12839708 | 2010-07-20 | US20110012705A1 | 2011-01-20 | Stéphane Ménard; Nicolas Gonon |
| The micro-electromechanical (MEMS) actuator comprises a hot arm member and a cold arm member. The cold arm member comprises at least two longitudinally spaced-apart flexors. The actuators may also be constructed with at least one among the hot arm member and the cold arm member comprising at least one spring section. The stress in this improved MEMS actuator is more uniformly distributed, thereby reducing the mechanical creep and improving its reliability as well as its operation life. | ||||||
| 150 | MICROMECHANICAL ACTUATOR | US12919618 | 2009-02-23 | US20110006874A1 | 2011-01-13 | Mike Becker; Dietmar Lütke-Notarp; Klaus Froehner |
| A micromechanical actuator includes a movable first spring element having metal and/or silicon. The first spring element is fitted at a first point and can move freely at a second point. A second spring element connected to the first spring element has silicon and is partially arranged on an electrically insulating material which is applied to a substrate. The second spring element is arranged at a distance from the substrate above the substrate on a first plane, and the first spring element is arranged above the second spring element on a second plane which is at a distance from the first plane such that the first and second spring elements can move with respect to the substrate. The actuator has a third spring element which is mechanically coupled to the first spring element. The elastic deformation of the second spring element can be induced by a length change of the third spring element. | ||||||
| 151 | SELF-LOCKING MICRO ELECTRO MECHANICAL DEVICE | US12376311 | 2007-07-24 | US20100263997A1 | 2010-10-21 | Achim Hilgers |
| The proposed invention application describes a novel configuration of an extremely small self-locking switching component, based on micro-electromechanical systems (MEMS) technology. Conventional MEMS switches need a continual control signal in order to obtain the wanted active (switching) state. The proposed invention needs only a short control signal (non-locking key) such as e.g. a pulse in order to switch the component on and/or off. RF-noise (ripples) on the de-control signal or bouncing effects can be neglected according to the proposed extension of the MEMS devices. This contributes to an easier and especially more robust design of electronic circuitries and allows for enhanced functionalities. | ||||||
| 152 | MEMS DEVICE WITH BI-DIRECTIONAL ELEMENT | US12732752 | 2010-03-26 | US20100182120A1 | 2010-07-22 | Arman Gasparyan; John VanAtta Gates, II; Maria Elina Simon |
| The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature. | ||||||
| 153 | MEMS thermal actuator and method of manufacture | US12382142 | 2009-03-10 | US07759152B2 | 2010-07-20 | Gregory A. Carlson; John S. Foster; Christopher S. Gudeman; Paul J. Rubel |
| A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap. | ||||||
| 154 | Micro-switching device and method of manufacturing the same | US12007630 | 2008-01-14 | US07755459B2 | 2010-07-13 | Anh Tuan Nguyen; Tadashi Nakatani; Satoshi Ueda; Yu Yonezawa; Naoyuki Mishima |
| A micro-switching device includes a fixing portion, a movable portion, a first electrode with first and second contacts, a second electrode with a third contact contacting the first contact, and a third electrode with a fourth contact opposing the second contact. In manufacturing the micro-switching device., the first electrode is formed on a substrate, and a sacrifice layer is formed on the substrate to cover the first electrode. Then, a first recess and a shallower second recess are formed in the sacrifice layer at a position corresponding to the first electrode. The second electrode is formed to have a portion opposing the first electrode via the sacrifice layer, and to fill the first recess. The third electrode is formed to have a portion opposing the first electrode via the sacrifice layer; and to fill the second recess. Thereafter the sacrifice layer is removed. | ||||||
| 155 | Self-assembling MEMS devices having thermal actuation | US10558469 | 2004-06-02 | US07749792B2 | 2010-07-06 | Gary K. Fedder; Altug Oz |
| The present disclosure is broadly directed to a method for designing new MEMS micro-movers, particularly suited for, but not limited to, CMOS fabrication techniques, that are capable of large lateral displacement for tuning capacitors, fabricating capacitors, self-assembly of small gaps in CMOS processes, fabricating latching structures and other applications where lateral micro-positioning on the order of up to 10 μm, or greater, is desired. Principles of self-assembly and electro-thermal actuation are used for designing micro-movers. In self-assembly, motion is induced in specific beams by designing a lateral effective residual stress gradient within the beams. The lateral residual stress gradient arises from purposefully offsetting certain layers of one material versus another material. For example, lower metal layers may be side by side with dielectric layers, both of which are positioned beneath a top metal layer of a CMOS-MEMS beam. In electro-thermal actuation, motion is induced in specific beams by designing a lateral gradient of temperature coefficient of expansion (TCE) within the beams. The lateral TCE gradient is achieved in the same manner as with self-assembly, by purposefully offsetting the lower metal layers with layers of dielectric with respect to the top metal layer of a CMOS-MEMS beam. A heater resistor, usually made from a CMOS polysilicon layer, is embedded into the beam or into an adjacent assembly to heat the beam. When heated, the TCE gradient will cause a stress gradient in the beam, resulting in the electro-thermal actuation. Because of the rules governing abstracts, this abstract should not be used to construe the claims. | ||||||
| 156 | Thin, flexible actuator array to produce complex shapes and force distributions | US11078195 | 2005-03-11 | US07665300B2 | 2010-02-23 | S. James Biggs; R. Dodge Daverman |
| An actuator includes a bistable mechanism having a tension beam and a compression beam defined by a relief slit in a flexible substrate; and a first shape memory element that upon heating actuates the actuator from a first position to a second position. A heat source can be thermally coupled to actuate the first shape memory element, or the first shape memory element can be heated by passing current through the element. The actuators can be formed in an array. Such arrays can be useful for tactile displays, massagers, and the like. Also included are methods of operation and manufacturing. | ||||||
| 157 | Hysteretic MEMS two-dimensional thermal device and method of manufacture | US12588060 | 2009-10-02 | US20100018021A1 | 2010-01-28 | Paul J. Rubel |
| A MEMS hysteretic thermal device may be formed having two passive beam segments driven by a current-carrying loop coupled to the surface of a substrate. The first beam segment is configured to move in a direction having a component perpendicular to the substrate surface, whereas the second beam segment is configured to move in a direction having a component parallel to the substrate surface. By providing this two-dimensional motion, a single MEMS hysteretic thermal device may by used to close a switch having at least one stationary contact affixed to the substrate surface. | ||||||
| 158 | MEMS thermal actuator and method of manufacture | US12382142 | 2009-03-10 | US20090181488A1 | 2009-07-16 | Gregory A. Carlson; John S. Foster; Christopher S. Gudeman; Paul J. Rubel |
| A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap. | ||||||
| 159 | LATERAL SNAP ACTING MEMS MICRO SWITCH | US11952794 | 2007-12-07 | US20090146773A1 | 2009-06-11 | Joon Won Kang |
| A MEMS micro-switch with a lateral snap action includes a laterally bowed beam and an electro thermal actuator. The electro thermal actuator can be activated in response to the application of an actuation voltage and a push rod pushes the laterally bowed beam to a transition point through a push-pull connector. The bowed beam can be snapped to an opposite position at the transition point and a moving electrode makes strong contact to fixed electrodes, which makes the switch turn on with strong contact force. The actuator can be deactivated and the push rod pulls the bowed beam back to the transition point and snapped back to an original position, which makes the switch turn off. The switch can be fabricated utilizing glass and SOI wafer bonding technique. | ||||||
| 160 | Doubly-anchored thermal actuator having varying flexural rigidity | US11849378 | 2007-09-04 | US07508294B2 | 2009-03-24 | Antonio Cabal; Stephen F. Pond |
| A doubly-anchored thermal actuator for a micro-electromechanical device such as a liquid drop emitter or a fluid control microvalve is disclosed. The thermal actuator is comprised of a base element formed with a depression having opposing anchor. A deformable element, attached to the base element at the opposing anchor edges, is constructed as a planar lamination including a first layer of a first material having a low coefficient of thermal expansion and a second layer of a second material having a high coefficient of thermal expansion. The deformable element has anchor portions adjacent the anchor edges and a central portion between the anchor portions wherein the flexural rigidity of the anchor portions is substantially less than the flexural rigidity of the central portion. The doubly-anchored thermal actuator further comprises apparatus adapted to apply a heat pulse to the deformable element that causes a sudden rise in the temperature of the deformable element. The deformable element bows outward in a direction toward the second layer, and then relaxes to a residual shape as the temperature decreases. The doubly-anchored thermal actuator is configured with a liquid chamber having a nozzle or a fluid flow port to form a liquid drop emitter or a fluid control microvalve, or to activate an electrical microswitch. Heat pulses are applied to the deformable element by resistive heating or by light energy pulses. | ||||||
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