| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 抗静电性剥离薄膜 | CN201380039382.2 | 2013-07-25 | CN104507671B | 2017-06-09 | 长岛稔 |
| 在基底薄膜的至少一面形成抗静电层、在该抗静电层上进一步形成硅酮类剥离层而成的抗静电性剥离薄膜的该抗静电层含有：成分(a)使硅酸烷基酯的水解物与偶联剂发生缩合反应而得到的缩合反应物、成分(b)水溶性成膜用树脂和成分(c)抗静电剂。硅酸烷基酯具有式(1)的结构，偶联剂具有式(2)的结构：。 | ||||||
| 2 | 装饰成型用层叠膜、聚氨酯树脂和装饰成型体的制造方法 | CN201280061801.8 | 2012-12-25 | CN103998241B | 2016-11-09 | 蓑毛克弘; 森健太郎; 松井洋辅 |
| 装饰成型用层叠膜，其具有下述层叠结构：保护层和着色层和粘合层依次配置，在任意的层之间、或在保护层的与着色层相反的面上配置有成型用膜，其中，保护层含有聚氨酯树脂(U)，该聚氨酯树脂(U)至少由活性氢成分(A)和有机异氰酸酯成分(B)形成、并且具有聚碳酸酯骨架，所述聚碳酸酯骨架具有脂环式烃基，该装饰成型用层叠膜至少满足条件(1)和条件(2)中的任一者。提供仅利用成型时的热，固化反应终止，具有良好的装饰成型时的对模的随行性和表面保护性的装饰成型用叠层膜，和使用其的装饰成型体。条件(1)：聚氨酯树脂(U)的分子内具有烷氧基甲硅烷基和/或硅醇基，条件(2)：保护层含有具有缩水甘油醚基以及烷氧基甲硅烷基和/或硅醇基的化合物(X)，聚氨酯树脂(U)具有羧基和/或其盐。 | ||||||
| 3 | 双面粘合带 | CN201480030434.4 | 2014-04-22 | CN105246996A | 2016-01-13 | 山上晃; 武井秀晃; 小川优纪; 上川由美; 岩崎刚 |
| 本发明所要解决的课题在于提供一种双面粘合带，所述双面粘合带在具有适当的耐冲击性的同时，在施加一定的力时能够拆卸，且能够容易地将残留在被粘物表面的胶糊等残留物剥离。本发明为一种双面粘合带，其为在发泡体基材的一个面层叠有树脂膜、且在树脂膜的表面和发泡体基材的另一个面层叠有粘合剂层的双面粘合带，其中，发泡体基材的密度为0.45g/cm3以下、层间强度为10N/cm以上，剥离速度为300mm/min时的180°剥离粘接力为10N/20mm以上，所述180°剥离粘接力的测定条件为：将厚度25μm的粘合剂层形成于厚度25μm的PEG基材而得的成粘合带，在温度23℃、相对湿度65％RH的环境下，通过使用2kg辊进行一次往返而使所形成的粘合带压接于铝板，并在温度23℃和相对湿度50％RH的环境下静置1小时后进行测定。 | ||||||
| 4 | 抗静电性剥离薄膜 | CN201380039382.2 | 2013-07-25 | CN104507671A | 2015-04-08 | 长岛稔 |
| 在基底薄膜的至少一面形成抗静电层、在该抗静电层上进一步形成硅酮类剥离层而成的抗静电性剥离薄膜的该抗静电层含有：成分(a)使硅酸烷基酯的水解物与偶联剂发生缩合反应而得到的缩合反应物、成分(b)水溶性成膜用树脂和成分(c)抗静电剂。硅酸烷基酯具有式(1)的结构，偶联剂具有式(2)的结构：。 | ||||||
| 5 | 装饰成型用层叠膜、聚氨酯树脂和装饰成型体的制造方法 | CN201280061801.8 | 2012-12-25 | CN103998241A | 2014-08-20 | 蓑毛克弘; 森健太郎; 松井洋辅 |
| 装饰成型用层叠膜，其具有下述层叠结构：保护层和着色层和粘合层依次配置，在任意的层之间、或在保护层的与着色层相反的面上配置有成型用膜，其中，保护层含有聚氨酯树脂(U)，该聚氨酯树脂(U)至少由活性氢成分(A)和有机异氰酸酯成分(B)形成、并且具有聚碳酸酯骨架，所述聚碳酸酯骨架具有脂环式烃基，该装饰成型用层叠膜至少满足条件(1)和条件(2)中的任一者。提供仅利用成型时的热，固化反应终止，具有良好的装饰成型时的对模的随行性和表面保护性的装饰成型用叠层膜，和使用其的装饰成型体。条件(1)：聚氨酯树脂(U)的分子内具有烷氧基甲硅烷基和/或硅醇基，条件(2)：保护层含有具有缩水甘油醚基以及烷氧基甲硅烷基和/或硅醇基的化合物(X)，聚氨酯树脂(U)具有羧基和/或其盐。 | ||||||
| 6 | 両面粘着テープ | JP2014552409 | 2014-04-22 | JPWO2014192460A1 | 2017-02-23 | 晃 山上; 秀晃 武井; 優紀 小川; 由美 上川; 剛 岩崎 |
| 本発明が解決しようとする課題は、好適な耐衝撃性を有すると共に、一定の力が加わった際に解体可能で、被着体の表面に残存した糊などの残存物を容易に剥離できる両面粘着テープを提供することにある。本発明は、発泡体基材の一方の面に、樹脂フィルムが積層され、樹脂フィルムの表面及び発泡体基材の他方の面に粘着剤層が積層された両面粘着テープであり、発泡体基材が、密度0.45g/cm3以下、層間強度10N/cm以上であり、厚さ25μmのPET基材に厚さ25μmの粘着剤層を形成した粘着テープを、温度23℃、相対湿度65%RHの環境下でアルミニウム板に2kgローラーを使用して圧着回数一往復で圧着し、温度23℃、相対湿度50%RHの環境下に1時間静置した後の剥離速度300mm/minでの180°引き剥がし接着力が10N/20mm以上の両面粘着テープである。 | ||||||
| 7 | Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same | US287089 | 1988-12-21 | US4913960A | 1990-04-03 | Hideo Kuroda; Masao Taniguchi |
| A pressure sensitive adhesive film reducible in the adhesive force by the application thereto of ultraviolet light which comprises: (a) a base film permeable to ultraviolet light; and (b) a layer of a pressure sensitive adhesive formed on one side of the base film, the adhesive comprising: (i) at least one elastic polymer selected from the group consisting of a polymer mainly composed of an acrylic acid ester copolymer and a saturated copolyester mainly composed of dibasic carboxylic acids and dihydroxy alcohols; (ii) an ultraviolet light polymerizable acrylic acid ester having not less than two acryloyl or methacryloyl groups in the molecule and having a molecular weight of not more than about 1000, in amounts of about 15-200 parts by weight in relation to 100 parts by weight of the elastic polymer; and (iii) a photopolymerization initiator in amounts sufficient to induce the photopolymerization of the ultraviolet light polymerizable acrylic acid ester.The film is especially suitable for use as a dicing film in dicing a semiconductor wafer to dices in which the wafer is fixed on the film with a relatively large adhesive force and thereafter the film is irradiated by ultraviolet light from the other side thereof to substantially reduce the adhesive force of the film so that the dice is loosely adhered onto the film. | ||||||
| 8 | Pressure sensitive adhesives with reducible adhesive force using radiation, and films therewith | US829818 | 1986-02-14 | US4818621A | 1989-04-04 | Hideo Kuroda; Masao Taniguchi |
| A pressure sensitive adhesive film reducible in the adhesive force by the application thereto of ultraviolet light which comprises:(a) a base film permeable to ultraviolet light; and(b) a layer of a pressure sensitive adhesive formed on one side of the base film, the adhesive comprising:(i) at least one elastic polymer selected from the group consisting of a polymer mainly composed of an acrylic acid ester copolymer and a saturated copolyester mainly composed of dibasic carboxylic acids and dihydroxy alcohols;(ii) an ultraviolet light polymerizable acrylic acid ester having not less than two acryloyl or methacryloyl groups in the molecule and having a molecular weight of not more than about 1000, in amounts of about 15-200 parts by weight in relation to 100 parts by weight of the elastic polymer; and(iii) a photopolymerization initiator in amounts sufficent to induce the photopolymerization of the ultraviolet light polymerizable acrylic acid ester;The film is especially suitable for use as a dicing film in dicing a semiconductor wafer to dices in which the wafer is fixed on the film with a relatively large adhesive force and thereafter the film is irradiated by ultraviolet light from the other side thereof to substantially reduce the adhesive force of the film so that the dice is loosely adhered onto the film. | ||||||
| 9 | Pressure sensitive adhesive film with barrier layer | US108202 | 1987-10-14 | US4968559A | 1990-11-06 | Hideo Kuroda; Masao Taniguchi |
| A pressure sensitive adhesive film reducible in the adhesive force by the application thereto of the ultraviolet light which comprises:(a) a base film permeable to the ultraviolet light; and(b) a layer of a pressure sensitive adhesive formed on one side of the base film, the adhesive comprising:(i) at least one elastic polymer selected from the group consisting of a polymer mainly composed of acrylic acid ester copolymers and a saturated copolyester mainly composed of dibasic carboxylic acids and dihydroxy alcohols;(ii) an ultraviolet light polymerizable acrylic acid ester having not less than two acryloyl or methacryloyl groups in the molecule in amounts of about 15-200 parts by weight in relation to 100 parts by weight of the elastic polymer; and(iii) a photopolymerization initiator in amounts sufficent to induce the photopolymerization of the ultraviolet light polymerizable acrylic acid ester;The film is especially suitable for use as a dicing film in dicing a semiconductor wafer to dices in which the wafer is fixed on the film with a relatively large adhesive force and thereafter the film is irradiated by the ultraviolet light from the other side thereof to substantially reduce the adhesive force of the film so that the dice is loosely adhered onto the film. | ||||||
| 10 | Method for dicing a semiconductor wafer | US829814 | 1986-02-14 | US4720317A | 1988-01-19 | Hideo Kuroda; Masao Taniguchi |
| A method for dicing a semiconductor wafer to dice which comprises:(a) placing and fixing the wafer on a dicing film which comprises a base film permeable to ultraviolet light and a layer of a pressure sensitive adhesive formed on one side of the base film to fix thereon the wafer, the adhesive comprising:(i) at least one elastic polymer selected from the group consisting of polyacrylic acid ester copolymers and saturated copolyesters;(ii) an ultraviolet light polymerizable acrylic acid ester having not less than two acryloyl or methacryloyl groups in the molecule and having a molecular weight of not more than about 1000, in amounts of about 15-200 parts by weight in relation to 100 parts by weight of the elastic polymer; and(iii) a photopolymerization initiator in a sufficient amount to induce the photopolymerization of the ultraviolet light polymerizable acrylic acid ester;(b) dicing the wafer;(c) applying the ultraviolet light to the other side of the dicing film to substantially reduce the adhesive force of the dicing film; and then(d) removing the resultant dice from the dicing film. | ||||||
| 11 | ２層の接着層を含むオーバーテープを用いる経皮治療システム | JP2017547957 | 2016-03-14 | JP2018512400A | 2018-05-17 | シューラート,ビョルン; ゴーザウ,マリエケ |
| 本発明は、活性成分の投与のための経皮治療システム、およびその調製方法に関する。経皮治療システムは、2層の接着層を有するオーバーテープを含む。 | ||||||
| 12 | 両面粘着テープ | JP2014552409 | 2014-04-22 | JP5700180B1 | 2015-04-15 | 山上 晃; 武井 秀晃; 小川 優紀; 上川 由美; 岩崎 剛 |
| 本発明が解決しようとする課題は、好適な耐衝撃性を有すると共に、一定の力が加わった際に解体可能で、被着体の表面に残存した糊などの残存物を容易に剥離できる両面粘着テープを提供することにある。本発明は、発泡体基材の一方の面に、樹脂フィルムが積層され、樹脂フィルムの表面及び発泡体基材の他方の面に粘着剤層が積層された両面粘着テープであり、発泡体基材が、密度0.45g/cm3以下、層間強度10N/cm以上であり、厚さ25μmのPET基材に厚さ25μmの粘着剤層を形成した粘着テープを、温度23℃、相対湿度65%RHの環境下でアルミニウム板に2kgローラーを使用して圧着回数一往復で圧着し、温度23℃、相対湿度50%RHの環境下に1時間静置した後の剥離速度300mm/minでの180°引き剥がし接着力が10N/20mm以上の両面粘着テープである。 | ||||||
| 13 | Antistatic release film | JP2012164389 | 2012-07-25 | JP2014024206A | 2014-02-06 | NAGASHIMA MINORU |
| PROBLEM TO BE SOLVED: To make adhesion level between an antistatic layer and a silicone-based release layer excellent even when being left under an atmosphere of high temperature and high humidity even though a satisfactory peel force and a surface resistance value are exhibited, in an antistatic release film in which the antistatic layer is formed at a single-side of a substrate film, and the silicone-based release layer is further formed on the antistatic layer.SOLUTION: An antistatic layer of an antistatic release film in which the antistatic layer is formed at a single-side of a substrate film, and a silicone-based release film is further formed on the antistatic layer, includes: a component (a) that is a condensation reaction object obtained by performing condensation reaction between a hydrolysate of an alkyl silicate and a coupling agent; a component (b) that is a water soluble film-forming resin; and a component (c) that is an antistatic agent. The alkyl silicate has a structure of formula (1), and the coupling agent has a structure of formula (2). | ||||||
| 14 | 帯電防止性剥離フィルム | JP2012164389 | 2012-07-25 | JP5874561B2 | 2016-03-02 | 長島 稔 |
| 15 | 加飾成形用積層フィルム、ポリウレタン樹脂および加飾成形体の製造方法 | JP2013506374 | 2012-12-25 | JPWO2013099829A1 | 2015-05-07 | 克弘 蓑毛; 森 健太郎; 健太郎 森; 洋輔 松井 |
| 保護層と着色層と接着層とがこの順で配され、いずれかの層間または保護層の着色層とは反対の面上に成形用フィルムが配された積層構造を有し、少なくとも活性水素成分(A)と有機イソシアネート成分(B)とから形成され、脂環式炭化水素基を有するポリカーボネート骨格を有するポリウレタン樹脂(U)を保護層が含有してなり、少なくとも条件(1)および条件(2)のいずれかを満たす加飾成形用積層フィルム。成形時の熱のみで硬化反応が終了し、良好な加飾成形時の型への追従性と表面保護性を有する加飾成形用積層フィルムと、これを用いた加飾成形体を提供する。条件(1):ポリウレタン樹脂(U)が分子内にアルコキシシリル基および/またはシラノール基を有する。条件(2):保護層がグリシジルエーテル基ならびにアルコキシシリル基および/またはシラノール基を有する化合物(X)を含有し、ポリウレタン樹脂(U)がカルボキシル基および/またはその塩を有する。 | ||||||
| 16 | Adhesive tape and the solar cell assembly, as well as created from them article | JP2013554484 | 2012-02-08 | JP2014512668A | 2014-05-22 | チンボ リ; チエ チョウ; ルイ パン; チャユン チュー; チシェン パン; シャンフェン チ; シー．クレア スザンナ; エー．シップ グレゴリー; インキュ ワン |
| 本発明は、光エネルギー変換器を含むフレームのない光エネルギー組立体を提供し、該光エネルギー変換器の縁部は、接着及び緩衝のための接着層と耐老化保護層とを含む接着テープによって封止される。 接着層は、物品の縁部と接触して用いられ、基材層と、任意に、基材層の両側に対向して位置する第１の接着剤層及び第２の接着剤層と、を含み、第１の接着剤層は、該物品が接触するように用いられる。 耐老化保護層は接着層の上に位置し、接着層の上に位置する任意のプライマー層と、プライマー層若しくは基材又は第２の接着剤層のいずれかの上に位置するフィルム層と、を含む。 本発明は更に、物品の縁部を封止するための接着テープ、及び組立体で作成される物品を提供する。 | ||||||
| 17 | Method of manufacturing a decorative molding laminated film, polyurethane resin and the decorative molding body | JP2013506374 | 2012-12-25 | JP5314216B1 | 2013-10-16 | 克弘 蓑毛; 健太郎 森; 洋輔 松井 |
| A multilayer film for decorative molding, which has a multilayer structure wherein a protective layer, a color layer and an adhesive layer are arranged in this order and a film for molding is arranged between any two of the layers or on a surface of the protective layer, said surface being on the reverse side of the color layer-side surface. The protective layer contains a polyurethane resin (U) which is formed from at least an active hydrogen component (A) and an organic isocyanate component (B) and which has a polycarbonate skeleton having an alicyclic hydrocarbon group. In addition, the multilayer film for decorative molding satisfies condition (1) and/or condition (2). Provided are: a multilayer film for decorative molding, the curing reaction of which is completed merely by the heat during the molding, and which exhibits good followability to the mold during decorative molding, while having good surface protective properties; and a decorative molded body which uses the multilayer film for decorative molding. Condition (1): The polyurethane resin (U) has an alkoxysilyl group and/or a silanol group in each molecule. Condition (2): The protective layer contains a compound (X) that has a glycidyl ether group and an alkoxysilyl group and/or a silanol group, and the polyurethane resin (U) has a carboxyl group and/or a salt thereof. | ||||||
| 18 | Dicing method for semiconductor wafer | JP2803185 | 1985-02-14 | JPS61187248A | 1986-08-20 | KURODA HIDEO; TANIGUCHI MASAO |
| PURPOSE:To dice an silicon wafer with high precision by bonding and fixing the semiconductor wafer to a dicing film by comparatively strong adhesive force, diving the wafer and reducing the adhesive force of the dicing film. CONSTITUTION:A semiconductor wafer is placed, bonded and fixed onto a dicing film, in which the layer of a pressure-sensitive adhesive composition containing an acrylic group adhesive mass and an ultraviolet cross-linking acrylic acid ester is formed onto a base material sheet through which ultraviolet rays can be transmitted, and diced, ultraviolet rays are projected from the back of the dicing film, the adhesive force of a pressure-sensitive adhesive is reduced, and a dice is picked up. Acrylic group adhesive mass itself used in the pressure-sensitive adhesive composition substantially consists of an acrylic acid ester copolymer. Ultraviolet cross-linking acrylic acid ester represents acrylic acid ester or methacrylic acid ester as an oligomer or a monomer cross- linked by the irradiation of ultraviolet rays, and has at least two acryloyl groups or methacryloyl groups in a molecule. | ||||||
| 19 | 양면 점착 테이프 | KR1020157022115 | 2014-04-22 | KR1020160011614A | 2016-02-01 | 야마카미아키라; 다케이히데아키; 오가와유키; 가미카와유미; 이와사키다케시 |
| 본발명이해결하려고하는과제는, 호적(好適)한내충격성을가짐과함께, 일정한힘이가해졌을때에해체가능하며, 피착체의표면에잔존한풀 등의잔존물을용이하게박리할수 있는양면점착테이프를제공하는것에있다. 본발명은, 발포체기재의한쪽의면에, 수지필름이적층되며, 수지필름의표면및 발포체기재의다른쪽의면에점착제층이적층된양면점착테이프이며, 발포체기재가, 밀도 0.45g/㎤이하, 층간강도 10N/㎝이상이고, 두께 25㎛의 PET 기재에두께 25㎛의점착제층을형성한점착테이프를, 온도 23℃, 상대습도 65% RH의환경하에서알루미늄판에 2㎏롤러를사용하여압착횟수 1왕복으로압착하고, 온도 23℃, 상대습도 50% RH의환경하에 1시간정치한후의박리속도 300㎜/min으로의 180° 벗겨내기접착력이 10N/20㎜이상인양면점착테이프이다. | ||||||
| 20 | 장식 성형용 적층 필름, 폴리우레탄 수지 및 장식 성형체의 제조 방법 | KR1020147014632 | 2012-12-25 | KR1020140110846A | 2014-09-17 | 미노모,가츠히로; 모리,겐타로; 마츠이,요스케 |
| 본 발명은 보호층과 착색층과 접착층이 이 순서대로 배치되고, 어느 하나의 층간, 또는 보호층의 착색층과는 반대의 면 위에, 성형용 필름이 배치된 적층 구조를 갖고, 적어도 활성 수소 성분(A)과 유기 이소시아네이트 성분(B)으로 형성되고, 지환식 탄화수소기를 갖는 폴리카보네이트 골격을 갖는 폴리우레탄 수지(U)를 보호층이 함유하여 이루어지고, 적어도 조건 (1) 및 조건 (2) 중 어느 하나를 만족시키는 장식 성형용 적층 필름에 관한 것이다. 또한, 본 발명은 성형시의 열만으로 경화 반응이 종료하여, 양호한 장식 성형시의 형(型)에 대한 추종성과 표면 보호성을 갖는 장식 성형용 적층 필름과, 이것을 이용한 장식 성형체를 제공한다.
조건 (1): 폴리우레탄 수지(U)가 분자 내에 알콕시실릴기 및/또는 실라놀기를 갖는다. 조건 (2): 보호층이 글리시딜에테르기 및 알콕시실릴기 및/또는 실라놀기를 갖는 화합물(X)을 함유하고, 폴리우레탄 수지(U)가 카르복실기 및/또는 그의 염을 갖는다. |
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