Dicing method for semiconductor wafer |
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| 申请号 | JP2803185 | 申请日 | 1985-02-14 | 公开(公告)号 | JPS61187248A | 公开(公告)日 | 1986-08-20 |
| 申请人 | Bando Chem Ind Ltd; | 发明人 | KURODA HIDEO; TANIGUCHI MASAO; | ||||
| 摘要 | PURPOSE:To dice an silicon wafer with high precision by bonding and fixing the semiconductor wafer to a dicing film by comparatively strong adhesive force, diving the wafer and reducing the adhesive force of the dicing film. CONSTITUTION:A semiconductor wafer is placed, bonded and fixed onto a dicing film, in which the layer of a pressure-sensitive adhesive composition containing an acrylic group adhesive mass and an ultraviolet cross-linking acrylic acid ester is formed onto a base material sheet through which ultraviolet rays can be transmitted, and diced, ultraviolet rays are projected from the back of the dicing film, the adhesive force of a pressure-sensitive adhesive is reduced, and a dice is picked up. Acrylic group adhesive mass itself used in the pressure-sensitive adhesive composition substantially consists of an acrylic acid ester copolymer. Ultraviolet cross-linking acrylic acid ester represents acrylic acid ester or methacrylic acid ester as an oligomer or a monomer cross- linked by the irradiation of ultraviolet rays, and has at least two acryloyl groups or methacryloyl groups in a molecule. | ||||||
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| 说明书全文 | |||||||
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