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Vacuum plating method and metal evaporating device

阅读:624发布:2023-01-27

专利汇可以提供Vacuum plating method and metal evaporating device专利检索,专利查询,专利分析的服务。并且PURPOSE:To carry out plating of prescribed patterns on a base plate and improve the yield of evaporating metal by providing a sleeve having a through- hole at the top end of a crucible, maintaining the sleeve at high temp. thereby evaporating the metal from the crucible. CONSTITUTION:A sleeve 7 having a through-hole 8 in a vertical direction is fitted to the top end of a crucible 2 provided with a heater 3 on the outside circumference. A heater 9 is provided on the outside of this sleeve 7, and both heaters 3, 9 are regulated to maintain the temp. of the sleeve 7 at temp. higher by >=50 deg.C than the temp. of the crucible 2. The metal 4 in the crucible 2 is heated to evaporate by using such metal evaporating device. Thereby, the sticking of the metal vapor evaporating in the crucible 2 on the inside wall of the through- hole 8 is prevented, and the stuck metal vapor evaporates instantaneously. The plating of the shape resembling to the sectional shape of the through-hole 8 is obtained on the base plate. Further, when the base plate is moved, the linear partial plating is obtained.,下面是Vacuum plating method and metal evaporating device专利的具体信息内容。

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