四方扁平無引腳封裝製程
专利汇可以提供四方扁平無引腳封裝製程专利检索，专利查询，专利分析的服务。并且A manufacturing process for a Quad Flat Non-leaded (QFN) package is provided. First, a conductive layer having a plurality of recesses and a patterned solder resist layer on the conductive layer are provided, wherein the patterned solder resist layer covers the recesses of the conductive layer. A plurality of chips are bonded onto the patterned solder resist layer such that the patterned solder resist layer is between the chips and the conductive layer. The chips are electrically connected to the conductive layer by a plurality of bonding wires. At least one molding compound is formed to encapsulate the conductive layer, the patterned solder resist layer, the chips and the bonding wires. A part of the conductive layer uncovered by the patterned solder resist layer is removed so as to form a patterned conductive layer. Then, the molding compound and the patterned conductive layer are separated.，下面是四方扁平無引腳封裝製程专利的具体信息内容。
| 标题 | 发布/更新时间 | 阅读量 |
|---|---|---|
| 具有经改进接触引脚的扁平无引线封装 | 2020-05-16 | 800 |
| 四方扁平无引脚的功率MOSFET封装体 | 2020-05-20 | 799 |
| 神经网络处理器板卡及相关产品 | 2020-05-11 | 959 |
| 半导体器件 | 2020-05-25 | 911 |
| 封装结构及三维封装结构 | 2020-05-17 | 299 |
| 导线架及四方扁平无外引脚封装结构 | 2020-05-20 | 900 |
| LEAD-FREE SOLDER ALLOY COMPRISING SN, BI AND AT LEAST ONE OF MN, SB, CU AND ITS USE FOR SOLDERING AN ELECTRONIC COMPONENT TO A SUBSTRATE | 2020-05-15 | 695 |
| 先進四方扁平無引腳封裝結構及其製造方法 | 2020-05-16 | 596 |
| 單一分流反相器電路中的功率四方扁平無引腳（ＰＱＦＮ）封裝 | 2020-05-19 | 140 |
| 單一分流反相器電路中的功率四方扁平無引腳（ＰＱＦＮ）封裝 | 2020-05-25 | 278 |
高效检索全球专利专利汇是专利免费检索,专利查询,专利分析-国家发明专利查询检索分析平台，是提供专利分析，专利查询，专利检索等数据服务功能的知识产权数据服务商。
我们的产品包含105个国家的1.26亿组数据，免费查、免费专利分析。
专利汇分析报告产品可以对行业情报数据进行梳理分析，涉及维度包括行业专利基本状况分析、地域分析、技术分析、发明人分析、申请人分析、专利权人分析、失效分析、核心专利分析、法律分析、研发重点分析、企业专利处境分析、技术处境分析、专利寿命分析、企业定位分析、引证分析等超过60个分析角度，系统通过AI智能系统对图表进行解读，只需1分钟，一键生成行业专利分析报告。
