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Method of chemically polishing metallic oxides

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专利汇可以提供Method of chemically polishing metallic oxides专利检索,专利查询,专利分析的服务。并且A composition for forming a molten salt used as a chemical polishing flux and a polishing sequence employing the flux. In an exemplary embodiment, a method of polishing a metallic oxide substrate comprises the steps of forming a molten flux from approximately a 30:1 to 50:1 weight ratio of lead monoxide and boric anhydride at a temperature within the approximate range 1,100*-1,200*C; bringing the flux to thermal equilibrium at a predetermined temperature suitable for establishing a desired rate of dissolution of the substrate material; moving the substrate at a controlled rate toward the molten flux; and immersing the substrate in the molten flux for a sufficient time to strip a predetermined thickness of material from the surfaces of the substrate. The dissolution rate may be varied by changing the temperature of the flux and/or by adding one or more constituents to the flux to vary the saturation point thereof. A controlled rate of withdrawal of the substrate from the flux may be used to form a protective coating on the stripped substrate surfaces. Because the coating can be removed by compatible liquid phase epitaxy systems, liquid phase epitaxy maybe used to grow films on the substrate without intermediate cleaning steps. Alternatively, the flux may be formed by combining boric anhydride (B2O3) with one or more of lead monoxide (PbO), lead fluoride (PbF2), barium oxide (BaO) barium fluoride (BaF2), iron oxide (Fe2O3), vanadium pentoxide (V2O5) and lithium carbonate (Li2CO3).,下面是Method of chemically polishing metallic oxides专利的具体信息内容。

1. A METHOD OF CHEMICALLY POLISHING METALLIC OXIDE SUBSTRATES COMPRISING THE STEPS OF: FORMING A MOLTEN FLUX FROM CONSITUTENTS SUITABLE FOR DISSOLVING METALLIC OXIDES WHEREIN THE CONSITUENTS ARE BORIC ANHYDRIDE AND ONE OR MORE OF THE GROUP CONSISTING OF LEAD MONOXIDE, LEAD FLOURIDE, BARIUM OXIDE, BARIUM FLOURIDE, IRON OXIDE, LITHIUM CARBONATE AND VANADIUM PENTOXIDE AND WHEREIN FORMING THE MOLTEN FLUX COMPRISES MIXING THE CONSTITUENTS OF THE FLUX AT A FIRST TEMPERATURE SUITABLE FOR ESTABLISHING A MOLTEN HOMOGENEROUS SOLUTION AND BRINGING THE MOLTEN SOLUTION TO THERMAL EQUILIBRIUM AT A SECOND TEMPERATURE SUITABLE FOR PROVIDING A DESIRED DISSOLUTION RATE OF THE SUBSTRATE MATERIAL; MOVING THE SUBSTRATE AT A CONTROLLED RATE TOWARD THE MOLTEN FLUX TO HEAT THE SUBSTRATE WITHOUT THERMAL SHOCK; IMMERSING THE SUBSTRATE IN THE MOLTEN FLUX OF A SUFFICIENT TIME TO STRIP A PREDETERMINED THICKNESS OF MATERIAL FROM THE SUBSTRATE; AND WITHDRAWING THE SUBSTRATE FROM THE FLUX AT A CONTROLLED RATE TO COOL THE SUBSTRATE WITHOUT THERMAL SHOCK.
2. A method of chemically polishing a metallic oxide substrate as defined in claim 1, wherein the constItuents are boric anhydride and lead monoxide.
3. A method of chemically polishing a metallic oxide substrate as defined in claim 1, wherein the constituents are boric anhydride, iron oxide, lead monoxide and lithium carbonate.
4. A method of chemically polishing a metallic oxide substrate as defined in claim 2, wherein the step of withdrawing the substrate from the molten flux at a controlled rate causes vaporized lead monoxide to be deposited on the cooling substrate surface.
5. A method of polishing metallic oxide substrates, comprising the steps of: mixing a molten salt flux of lead monoxide and boric anhydride in weight ratios within the range 30:1 to 50:1 at a temperature above approximately 800*C; bringing the molten salt flux to thermal equilibrium at a temperature above about 860*C; advancing metallic oxide substrates at a controlled rate to a position proximate the molten salt flux; immersing the substrates in the molten salt flux to strip a predetermined thickness of material from the surfaces thereof; and withdrawing the substrates from the molten salt flux at a controlled rate to cool the substrates without thermal shock and to deposit vaporized lead monoxide on the cooling substrate surfaces.
6. A method of polishing metallic oxide substrates as defined in claim 5, wherein the flux is mixed at a temperature within the approximate range 1,100*-1,200*C.
7. A method of polishing metallic oxide substrates as defined in claim 5, wherein the molten salt flux is brought to equilibrium at a temperature within the approximate range 885*-955*C.
8. A method of polishing metallic oxide substrates as defined in claim 5, wherein the flux contains a constituent selected from Gd3Ga5O12 and (EuEr2) (Ga0.7Fe4.3)O12 for increasing the saturation temperature of the flux to decrease the substrate dissolution rate.
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