Holding method for wafer in dry honing work
专利汇可以提供Holding method for wafer in dry honing work专利检索，专利查询，专利分析的服务。并且PURPOSE:To rapidly discharge static electricity generated on a semiconductor wafer to be machined at the time of dry honing it by placing the wafer on a working base, and holding the wafer by a conductive rubber pressed onto one side surface of the wafer and electrically contacted at the opposite side surface with the ground. CONSTITUTION:A conductive rubber sheet 4 opened with a hole 5 is bonded to the flat upper surface of a working base 1, and a wafer 10 to be machined is placed on the base 1 exposed within the hole 5. Then, the wafer 10 is pressed at one side surface by a spring 6, and is pressed at the opposite side surface to the inner wall of the hole 5, thereby effectively holding the wafer 10. Thus, preferably electrical contact is produced between the wafer 10 and the sheet 4 by utilizing the elasticity of the sheet 4. When atomizing abrasive 2 is thereafter sprayed, the static electricity produced on the wafer 10 can be escaped rapidly to the ground, no discharge occurs between the base 1 and the wafer 10, and no damage occurs at the wafer 10.，下面是Holding method for wafer in dry honing work专利的具体信息内容。
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