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One transistor dynamic memory cell

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专利汇可以提供One transistor dynamic memory cell专利检索,专利查询,专利分析的服务。并且A dynamic memory storage cell requires only one field effect transistor to store binary data. The data is represented in the form of stored charge utilizing the inherent metal-insulatorsemiconductor capacitance and P-N junction capacitance at the source node of the field-effect transistor. An extended portion of the source diffusion in combination with overlying thin oxide and metal layers form a capacitor that further enhances charge storage. A matrix of the memory cells form an extremely high density random access memory.,下面是One transistor dynamic memory cell专利的具体信息内容。

1. A dynamic data storage cell comprising: a. a semiconductor substrate of one conductivity type; b. a first elongated diffused region of opposite conductivity type extending to the surface of said substrate; c. a second diffused region of said opposite conductivity spaced from said first diffused region and substantially parallel thereto, said second diffused region also extending to the surface of said substrate; d. a third diffused region underlying said second diffused region, of said one conductivity type and having a lower resistivity than said substrate, formed within at least a portion of the area occupied by said second diffused region, forming a P-N junction therewith; e. an insulating layer covering the surface of said substrate, said insulating layer having a first thin region overlying an area of said substrate bridging said first and second diffused regions thereby defining a channel of a FET, and a second thin region overlying a portion of said second diffused region; f. a first elongated conductive region extending over said first thin insulating region, thereby forming a gate of said FET, said conductive region substantially orthogonal to said first diffused region; g. a second elongated conductive region spaced from and substantially parallel to said first elongated conductive region, extending over said second thin region to form a capacitor; and h. means for connecting said second conductive region to said substrate.
2. A dynamic data storage cell according to claim 1 wherein said substrate comprises silicon doped to a level on the order of 1015 atoms/cm3 and said third diffused region has an impurity concentration on the order of 1017 atoms/cm3.
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