| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | Soldering apparatus. | US1902128359 | 1902-10-22 | US767465A | 1904-08-16 | WIRTH JOHN A; BEECH JACOB |
| 162 | Can-soldering machine. | US1899715952 | 1899-05-08 | US658176A | 1900-09-18 | HOLDEN EDWARD P |
| 163 | METHOD FOR FILLING A WAFER VIA WITH SOLDER | US15423602 | 2017-02-03 | US20180301377A9 | 2018-10-18 | Sehoon Yoo; Chang Woo LEE; Jun Ki KIM; Jeong Han KIM; Young Ki KO |
| A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via. | ||||||
| 164 | Method for connecting at least two components of an endoscope, components of an endoscope and endoscope | US15088414 | 2016-04-01 | US10004383B2 | 2018-06-26 | Steffen Bruesehaber; Andreas Deutschendorf; Siegfried Hoefig; Bernd Krause |
| In the case of a method according to the invention for connecting at least two components of an endoscope, at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, the at least two components are held in relation to one another in such a way that at least one brazing gap that is in capillary connection with the at least one brazing solder reservoir is formed between joining regions of the at least two components that are assigned to one another, and the arrangement (1, 22) comprising the at least two components and the at least one brazing preform is heated to a brazing temperature of the high-temperature brazing solder. The invention also relates to a component of an endoscope and to an endoscope. | ||||||
| 165 | Method of manufacturing semiconductor device, substrate processing apparatus and recording medium | US14805506 | 2015-07-22 | US09974191B2 | 2018-05-15 | Yasutoshi Tsubota |
| Manufacturing quality of a semiconductor device can be improved, and manufacturing throughput can be improved. A method of manufacturing a semiconductor device includes (a) placing a substrate on a substrate supporting unit installed in a processing chamber, the substrate having thereon a solder with an oxygen-containing film on a surface thereof, (b) reducing the oxygen-containing film by supplying a reducing gas into the processing chamber while maintaining a thermal conductivity of an inner atmosphere of the processing chamber at a first thermal conductivity, and (c) melting the solder by supplying a thermally conductive gas into the processing chamber while maintaining the thermal conductivity of the inner atmosphere of the processing chamber at a second thermal conductivity higher than the first thermal conductivity. | ||||||
| 166 | SOLDER PROCESSING DEVICE | US15561488 | 2016-03-25 | US20180065201A1 | 2018-03-08 | Mitsuo EBISAWA |
| In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5). | ||||||
| 167 | Solder supply device including a nozzle with a piston and a demarcating member that demarcates an air chamber in which air is supplied to move the piston relative to a solder container | US15100499 | 2013-12-05 | US09883597B2 | 2018-01-30 | Akihiro Senga; Shoji Fukakusa; Ritsuo Hirukawa; Yoji Fujita; Yoshimune Yokoi |
| A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like. | ||||||
| 168 | Method for Forming Solder Deposits | US15658084 | 2017-07-24 | US20170320155A1 | 2017-11-09 | Ghassem Azdasht |
| A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place. | ||||||
| 169 | BALL GRID ARRAY SOLDER ATTACHMENT | US14974807 | 2015-12-18 | US20170179069A1 | 2017-06-22 | Jonathon R. Carstens; Michael S. Brazel; Russell S. Aoki; Laura S. Mortimer |
| Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package. | ||||||
| 170 | VISCOUS FLUID COATING DEVICE | US15122113 | 2014-02-28 | US20170066072A1 | 2017-03-09 | Nobuyuki ISHIKAWA; Katsunori TANAKA; Mitsuhiro NISHIBORI |
| Solder housed in flow tank 20 is ejected from nozzle 22 by a pump provided inside flow tank 20. Jet motor 26 that drives the pump is provided outside flow tank 20, and cooling device 30 is provided between flow tank 20 and jet motor 26. Cooling device 30 includes cooling pipe 52 that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe 52, flows along cooling pipe 52, and flows out of a lower end of cooling pipe 52 so as to be supplied to flow tank 20. The temperature of the nitrogen gas increases due to heat dissipated from jet motor 26, thus lowering the temperature of jet motor 26. Heat is transferred from jet motor 26 to the nitrogen gas, and jet motor 26 is cooled satisfactorily. | ||||||
| 171 | REEL-TO-REEL MANUFACTURING PLANT FOR INTERLINKED CONTINUOUS AND DISCONTINUOUS PROCESSING STEPS | US14881382 | 2015-10-13 | US20160107253A1 | 2016-04-21 | Jochen KUHN; Helmut Oettl |
| A continuous manufacturing plant (100) for processing a strip-like substrate (101). A first drive moves the substrate in a direction of transport (x) and passes through process zones (110, 120, 130), so that different regions of the substrate are processed simultaneously. The process zones comprise a first process zone (110, 120) for a discontinuous process and a second process zone (130) for a continuous process. The continuous process is a reflow soldering process. The reflow soldering process (130) comprises a source of heat (W) and a second drive for moving the source of heat relative to the first process zone along the substrate. The second drive moves the source of heat (W) relative to the first process zone (110, 120) along the substrate (101) opposed to the direction of transport (X) of the substrate (101), even if the first drive is standing still. | ||||||
| 172 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM | US14805506 | 2015-07-22 | US20150334849A1 | 2015-11-19 | Yasutoshi TSUBOTA |
| Manufacturing quality of a semiconductor device can be improved, and manufacturing throughput can be improved. A method of manufacturing a semiconductor device includes (a) placing a substrate on a substrate supporting unit installed in a processing chamber, the substrate having thereon a solder with an oxygen-containing film on a surface thereof, (b) reducing the oxygen-containing film by supplying a reducing gas into the processing chamber while maintaining a thermal conductivity of an inner atmosphere of the processing chamber at a first thermal conductivity, and (c) melting the solder by supplying a thermally conductive gas into the processing chamber while maintaining the thermal conductivity of the inner atmosphere of the processing chamber at a second thermal conductivity higher than the first thermal conductivity. | ||||||
| 173 | PASTE SUPPLY APPARATUS AND SCREEN PRINTING MACHINE | US14638566 | 2015-03-04 | US20150258773A1 | 2015-09-17 | Hideki UCHIDA; Masaaki TOKUNAGA |
| A paste supply apparatus includes: a pot holder which holds a paste pot including an inner lid movable in a container; an ejecting member; an annular protruding portion protruding downward from a lower surface of the ejecting member; a suction power generating mechanism which generates suction power in an internal space surrounded by the annular protruding portion; and an ejecting member lifting unit which moves up and down the ejecting member, The ejecting member lifting unit causes the ejecting member to press down the inner lid of the paste pot held by the pot holder to eject the paste from the through hole, and thereafter lifts the ejecting member which holds the inner lid by the suction power generated within the internal space of the annular protruding portion by the suction power generating mechanism. | ||||||
| 174 | Circuit board including mask for controlling flow of solder | US13035127 | 2011-02-25 | US08853550B2 | 2014-10-07 | Arun Virupaksha Gowda; Kevin Matthew Durocher; James Wilson Rose; Paul Jeffrey Gillespie; Richard Alfred Beaupre; David Richard Esler |
| A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board. | ||||||
| 175 | Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board | US13522547 | 2011-01-18 | US08752754B2 | 2014-06-17 | Takashi Shoji; Takekazu Sakai |
| Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container. | ||||||
| 176 | REMOTE MELT JOINING METHODS AND REMOTE MELT JOINING SYSTEMS | US13453097 | 2012-04-23 | US20130277416A1 | 2013-10-24 | Laurent Cretegny; Ann Melinda Ritter; Lyle Timothy Rasch; Robert John Zabala; Jeffrey Jon Schoonover; Mark Kevin Meyer |
| Remote melt joining methods include melting a filler material to produce a molten filler material, wherein melting the filler material occurs at a remote distance away from a target site of a substrate material such that melting the filler material maintains the target site of the substrate material below its solidus temperature, and, delivering the molten filler material to the target site of the substrate material in a continuous stream. | ||||||
| 177 | Method and Device for Forming Solder Deposits | US13641497 | 2011-04-13 | US20130087539A1 | 2013-04-11 | Ghassem Azdasht |
| The invention relates to a method for forming solder deposits (34) on elevated contact metallizations (24) of terminal faces (23) of a substrate (19) formed in particular as a semiconductor component, in which wetting surfaces (26) of the contact metallizations are brought into physical contact with a solder material layer (15) arranged on a solder material carrier (13), at least for the duration of the physical contact a heating of the substrate and a tempering of the solder material layer takes place, and subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place. | ||||||
| 178 | CIRCUIT BOARD INCLUDING MASK FOR CONTROLLING FLOW OF SOLDER | US13035127 | 2011-02-25 | US20110139495A1 | 2011-06-16 | Arun Virupaksha Gowda; Kevin Matthew Durocher; James Wilson Rose; Paul Jeffrey Gillespie; Richard Alfred Beaupre; David Richard Esler |
| A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board. | ||||||
| 179 | MIM braze preforms | US11421353 | 2006-05-31 | US07845549B2 | 2010-12-07 | David Edwin Budinger |
| A method of making a braze preform includes: providing a mixture of a brazing alloy in metallic powder form and a binder; melting the binder and forming the mixture into a preform having a preselected shape; removing a majority of the binder from the preform; and heating the preform to remove the remainder of the binder and to sinter the metallic powder together. The preform may include a wear-resistant material therein. Such preforms may be used to form a braze joint between two metallic components, or to produce a metallic component with a wearcoated surface. | ||||||
| 180 | Dual additive soldering | US12658951 | 2010-02-16 | US20100273022A1 | 2010-10-28 | Erik J. Severin |
| Soldering with lead-free alloys is enhanced by use of two additives to a molten solder bath. One additive is an oxygen barrier fluid that floats on or envelops a bath. Another additive is an oxygen or metal oxide scavenger in the bath. Exemplary scavengers include metals with a higher free energy of oxide formation than oxide of tin, reducing gas, or an electrode immersed in the bath. The oxygen barrier may be an organic liquid, preferably polar in nature, which forms at least a monomolecular film over static surfaces of the bath. An exemplary soldering process is wave soldering of printed circuit boards. | ||||||
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