| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | Method and transfer plate for applying solder to component leads | US936574 | 1986-12-01 | US4722470A | 1988-02-02 | Ajay Johary |
| A method and a solder transfer member for applying discrete bodies of solder of predetermined size to the leads of a component for subsequent surface mounting to a substrate. The transfer member is a plate having a non-wetted surface, for example titanium, with an array of cavities matching the component lead pattern, each having a volume corresponding to the desired amount of solder to be applied to the corresponding lead. The method includes placing solder paste on the transfer member and filling the cavities by wiping the plate surface. The component is placed on the transfer member with the leads contacting the solder paste in the cavities. Reflow of the solder paste bonds to each lead a discrete body of solder having a precisely determined size. To limit wicking of solder on the leads, selective masking may be performed by applying a water soluble mask coating to the leads and removing the mask from selected areas by placing the component against a surface charged with water before placing the component on the transfer member. | ||||||
| 142 | Chip carrier mounting device | US610077 | 1984-05-14 | US4705205A | 1987-11-10 | Leslie J. Allen; Gabe Cherian; Stephen H. Diaz |
| A chip carrier mounting device which is hereinafter also referred to as an "interconnection preform placement device" includes a retaining member having a predetermined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatique. A method of forming resilient interconnections comprises placing the interconnection retaining member device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer. | ||||||
| 143 | Method and apparatus for dispensing solder paste | US687886 | 1984-12-31 | US4636406A | 1987-01-13 | John L. Leicht |
| A solder paste dispensing assembly provides for the controlled application of a predetermined solder paste pattern to a surface. The surface can be on a printed circuit board, prior to or after the board is mounted onto an assembled product or it can be a portion of the product itself. The surface can be a planar or non-planar surface. | ||||||
| 144 | Method and apparatus for dispensing viscous materials | US829889 | 1986-02-18 | US4622239A | 1986-11-11 | David Schoenthaler; Thaddeus Wojcik |
| An apparatus (28) for dispensing solder paste into openings (26-26) in a stencil (24) comprises a housing (30) having a piston (60) slidably mounted therein. A manifold (70), having a successively increasing cross-sectional area, is attached to a side wall (42) of the housing for admitting a viscous material, such as solder paste therein through successively larger sized openings (76-76) so the paste is distributed evenly beneath the piston. A pair of elastomeric blades (50-50) are secured to, and depend from the housing on opposite sides of a slot (46) to contact the stencil (24). Upon the application of a fluid pressure against the piston, paste will be expelled from the slot within a working region (96) between the blades. The blades force paste into the openings in the stencil when the housing is moved thereacross. | ||||||
| 145 | Method and apparatus for batch solder bumping of chip carriers | US668973 | 1984-11-07 | US4558812A | 1985-12-17 | Alred S. Bailey; John R. Fisher, Jr. |
| Chip carriers (10--10) are released from an end of a dispensing means (38) drawn across a holder (22) having a plurality of apertures (28--28) therein, to place a carrier in each aperture. Small solder spheres (58--58) are located in a plurality of dimples (56--56) of a planar plate (40) in arrays that are substantially the same as a plurality of bonding pad arrays (18--18) on the bottom surface of a plurality of chip carriers. A vacuum is applied to the holder (22) to hold the chip carriers (10--10) in the apertures (28--28) as the holder rotates to place the bonding pads (18--18) in contact with the solder spheres (68--68). The solder spheres (58--58) are reflowed by applying heat to form a solder "bump" (68) on each pad (18). The chip carriers (10--10) are then cooled and loaded into a plurality of the tubular members (39--39). | ||||||
| 146 | Solder delivery system | US328762 | 1981-12-08 | US4484704A | 1984-11-27 | Willie K. Grassauer; William M. Robinson |
| A solder delivery system has a continuous element of solder material adjacent to at least one polymeric layer, which is provided with window means to control the flow of solder. The layers, if there are more than one, may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed adjacent to corresponding terminals of a substrate and the system placed in contact with and perpendicular to the conductors, with the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals. | ||||||
| 147 | Handling bodies containing bonding material | US287971 | 1981-07-29 | US4421266A | 1983-12-20 | Anne B. Bock |
| Bodies (22) containing bonding material are applied in a substantially simultaneous manner to each of an array of bonding sites (18). A member (50) holds the bodies (22) in an array corresponding to the array of bonding sites (18). A pickup head (40) holds an array of pickup pins (42) such that pickup ends thereof correspond to the array of bodies (22) and sites (18). A mechanism (31) manipulates the head (40) and the array of pins (42) in steps, to substantially simultaneously engage each of the bodies (22) in the member (50) with a corresponding pickup end of a pin (42), to substantially simultaneously contact each of the bodies (22) to a corresponding bonding site (18) and to substantially simultaneously disengage the pins (42) from the bodies (22). In a preferred embodiment, the bodies (22) contain solder which is readily conductive and frictionally engageable by pressure of the pins (42) upon the bodies (22). | ||||||
| 148 | Adapting contacts for connection thereto | US295043 | 1981-08-21 | US4402450A | 1983-09-06 | Bruce C. Abraham; Charles R. Fegley |
| Contact pads (18) of a device (12) are adapted for bonding components such as contacts of a circuit assembly thereto. At least two of the pads (18) are interconnected with a member (34) containing bonding material. Portions of the member (34) lying adjacent the pads (18) are then removed to form isolated bodies (42) containing bonding material on the pads (18). The member (37) may be of a composite structure containing bonding material associated with a hard element (61). The bodies (42) formed therefrom contain a hard element portion (62) having dimensions which remain substantially unchanged to define a desired minimum distance between respective pads (18) and contacts when they are bonded together. | ||||||
| 149 | Solder delivery system | US158034 | 1980-06-09 | US4354629A | 1982-10-19 | Willie K. Grassauer; William M. Robinson |
| A solder delivery system has a continuous element of solder material disposed between two polymeric layers, one of which is provided with window means to control the flow of solder. The layers may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed on corresponding terminals of a connector body and the system placed in contact with and perpendicular to the conductors, with the side having the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals. | ||||||
| 150 | Method of screening paste solder onto leaded hybrid substrates | US211953 | 1980-12-01 | US4311267A | 1982-01-19 | Linda W. Lim |
| Paste solder is contact printed onto lead and component pads of a leaded hybrid substrate through holes that are arranged in a plate in the pattern of the pads, a first recess in the solder or top side of the plate extending over the area containing component holes. In order to accommodate lead frames of single in-line packages (SIP), a second recess is formed in the bottom or substrate side of the plate adjacent lead holes that are defined by a plate thickness that is slightly greater than the height of lead tines located on lead pads. In a printing operation, the bottom of the plate is moved into contact with the padded side of the substrate of a SIP, with lead tines on lead pads being located in associated lead holes and the lead frame in the second recess. Paste solder is then squeegeed over the top of the plate for printing solder onto the component and lead pads of the substrate in a single printing operation. The paste is then moved away from the substrate so that components may be placed into paste solder prior to passing the leaded substrate and components thereon through a reflow solder operation for simultaneously soldering component leads and tines to associated pads. | ||||||
| 151 | Apparatus for applying solder rings to terminal posts | US587750 | 1975-06-17 | US3978569A | 1976-09-07 | Robert Franklin Cobaugh; James Ray Coller; Attalee Snarr Taylor |
| An apparatus consisting of a pair of rollers with tangentially meeting perimeters for crimping successive portions of a continuous strip of solder into rings around a strip of terminal posts carried in parallel manner upon a common carrier strip. The roller perimeters each contain a circumferential track of crimping ridges which are both axially and angularly positioned to coincide with corresponding ridges on the other roller to crimp said solder strip around each post on the strip of terminal posts, both strips being simultaneously passed between the crimping tracks on said rollers. Each roller also comprises a circumferential track of spur-type gear teeth, the two tracks being axially offset on opposite sides of said crimping tracks and having bottom lands (the troughs of the teeth) which coincide when the teeth pass through the common tangential or pitch plane of the rollers. | ||||||
| 152 | Method and apparatus for precrimping solder rings on electrical terminal posts | US46632274 | 1974-05-02 | US3886650A | 1975-06-03 | COBAUGH ROBERT FRANKLIN; COLLER JAMES RAY |
| A strip of heated terminal posts are attached to a common carrier and a vertically positioned ribbon of solder are supplied simultaneously to a first pair of rollers which presses the heated terminal posts into the edge of, but not through, the vertically positioned solder ribbon. Next, the strip of terminal posts, with the solder ribbon attached, is passed through a second set of rollers which crimp the solder ribbon together midway between terminal posts to force the solder further around the terminal posts, thereby ensuring that the same amount of solder will flow around each terminal post when the terminal posts are gang inserted in a printed circuit board and the solder melted.
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| 153 | Apparatus for attaching solder rings to work pieces | US3791005D | 1973-04-23 | US3791005A | 1974-02-12 | MOYER R; KARANDY F |
| By the method and apparatus herein disclosed, solder rings, formed of solder material capable of taking a permanent set upon deformation, are fixed on work pieces for subsequent soldering to other work pieces. The perimeter of a solder ring, positioned at a predetermined location on a work piece, is engaged at two points spaced apart less than 180*. The solder ring is engaged by projections on forming blades or jaws moved toward a plane extending transversely of the ring. Sufficient force is applied at the points of engagement to bow a portion of the ring intermediate the points of engagement outwardly from the work piece and to draw the remainder of the ring in tight engagement about the work piece. Preferably the forming blades are each provided with a pair of projections for engaging opposite sides of the ring to bow the intermediate portions of the ring outwardly at each side thereof.
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| 154 | Method of making lead and solder preform assembly | US3731368D | 1971-06-01 | US3731368A | 1973-05-08 | DIETEMAN F; CODA N |
| Leads for electronic components are provided with solder preforms by a method and apparatus which first cuts off a length of solder wire and then forms the wire into a preform and cold welds it to the lead.
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| 155 | Solder device | US45489665 | 1965-05-11 | US3396894A | 1968-08-13 | ELLIS ROGER H |
| 156 | Solder feeding iron | US26945263 | 1963-04-01 | US3172383A | 1965-03-09 | EMANUS RUPERT W |
| 157 | Apparatus for applying liquid alloys | US82625759 | 1959-07-10 | US3034478A | 1962-05-15 | SCHWARTZ ROBERT S |
| 158 | Implement for use in applying alpha coating of solder to cylindrical objects | US53701431 | 1931-05-13 | US1851837A | 1932-03-29 | PHILIP HOGAN |
| 159 | Apparatus for soldering and welding joints. | US9703316 | 1916-05-12 | US1203465A | 1916-10-31 | BELL JOHN MONTGOMERY |
| 160 | Soldering-machine. | US1907393492 | 1907-09-18 | US996374A | 1911-06-27 | SWAN ALFRED |
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