子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 181 | Soldering iron | JP14586399 | 1999-05-26 | JP2000334563A | 2000-12-05 | MATSUBARA YOSHIMASA |
| PROBLEM TO BE SOLVED: To stabilize a temp. of a heating gas flow, to improve thermal efficiency, to eliminate temp. variance of a soldering face and to stabilize soldering by opening a nozzle part at its front by encircling the surrounding of a tip and arranging an orifice part of a prescribed dimension between a heating gas generation chamber and the nozzle part. SOLUTION: A diameter dimension of an orifice part 21 is decided so that the gas supplied in following a heating gas injected from an orifice part 21 to a nozzle part 19 is preheated by convection with the heating gas. By energizing a ceramic heater (heat generating means) 12 and heating, a nitrogen gas is supplied from a nitrogen gas supply tube 13. A tip 14 is temp. raised to a prescribed temp. The nitrogen gas is temp. raised/expanded in a heating gas flow generating chamber 23 but a back pressure B is generated by preventing jetting due to the orifice part 21. The back pressure B is balanced to a supply pressure A, part C of a temp. raised gas is passed through the orifice part 21, is injected from the nozzle part 19 to the surrounding of the tip 14 and heats a soldering face. COPYRIGHT: (C)2000,JPO | ||||||
| 182 | Pattern writing method and apparatus | JP15448894 | 1994-07-06 | JP2692781B2 | 1997-12-17 | アントン・コルビン; ジャック・フォール; ピエール・シュトラウド; フィリップ・デモンシィ |
| 183 | Pattern-writing method and pattern-writing device | JP15448894 | 1994-07-06 | JPH07235515A | 1995-09-05 | ANTON KORUBIN; FUIRITSUPU DEMONSHII; JIYATSUKU FUOORU; PIEERU SHIYUTORAUDO |
| PURPOSE: To provide a method and a device by which patterns made of multifarious conductive of nonconductive materials can be formed on various types of substrates. CONSTITUTION: A method and a device by which required patterns made of multifarious conductive of nonconductive materials can be formed on various types of substrates are provided. The fundamental component of the method and device is a pen 10, consisting of a basically heat-resistant chip 11, wetted by a material in melted state. The chip 11 is welded to heaters 12. After the welding points have been heated to the melting point of the material for writing, the welding points are dipped into the material in a melted state in a crucible. A reservoir is formed by forming the core of the melted material, and the whole surface of the chip 11 is wetted. The wetted chip 11 is placed so as to be brought into contact with the substrate gently, and the pen 10 and the substrate placed on a stage are relatively moved in proper X-, Y- and Z- directions to apply the melted material to the substrate for forming the required patterns. | ||||||
| 184 | Soldering device and solder dispenser | JP35361192 | 1992-12-14 | JPH05329634A | 1993-12-14 | ERUNESUTO SHIYUPIRITSUHI |
| PURPOSE: To enable automatized soldering by preparing chambers which are supported in correlation with a working bed during use and a slidable hollow tube which extends through the chamber and delivers a source of heat energy through one side of end part of the hollow tube. CONSTITUTION: This device is provided with chambers 6, 7 which are supported in correlation with a working bed during use. Also, the device is provided with a hollow tube 1 which extends through the chamber, delivers a source of heating energy through one side of end part 4 of the hollow tube 1 and is slidable in correlation with the chambers 6, 7 in order to move the end part of the tube. Heating energy is supplied by a gas flare means. Further, a piston 5 which is pneumatically and hydraulically slidable in the chambers is provided as a means for moving the hollow tube 1. Thus, the soldering device capable of precisely soldering is obtained. | ||||||
| 185 | Heating equipment using liquefied gas | JP16032084 | 1984-07-31 | JPS6138319A | 1986-02-24 | NAKAJIMA MASAHIKO |
| PURPOSE: To permit easily to control an out-put power for valve handling and flow control under a series of processing by a method where in a valve needle is slidable in its tipend side and a control valve is rotatable to its shaft centre, which makes a flow control member rotatable. CONSTITUTION: A controlling member 13 is slidable in a tip end side of a handle. When a disk plate 27 is abutter against E ring 26 mounted on the valve needle 22 of the control valve 7, the valve needle 22 slides toward its tip end side by overcoming pre-load of a return spring 40, causing rotation of the controlling member 13 in its circumferential direction acting its peripheral port unit as guid, and also an actuating member 25 and a flow controlling member are pivotally connected with the rotating shaft, therefore the flow controlling member 18 is rotated in a direction to an increase of discharging volume, consequently, the gas volume in proportianal to its actual rotational quantum is blown-off from the tip end of valve needle 22. Thus, the control valve is controllable by its processing mechanism, both handling for the valve and flow control may be performed under a series of processing system, causing the easy control of the out-put power. COPYRIGHT: (C)1986,JPO&Japio | ||||||
| 186 | Soldering iron | JP19780983 | 1983-10-21 | JPS6092070A | 1985-05-23 | SHIBATA TERUYUKI |
| PURPOSE:To reduce the solidifying time of solder after soldering by constituting a soldering iron in such a way that high-pressure air is blown to the tip of said iron. CONSTITUTION:An air tube 1 is connected to a high-pressure air source then electricity is conducted to the soldering iron via a power source cord 11 to heat thoroughly the tip 9 thereof. Yarn solder is then supplied to the tip through a feed pipe 10 for the yarn solder to build up the molten solder to the place of electronic parts and lead wires to be soldered. When the operator pushes the knob of a small-sized valve 4, the high-pressure air is supplied through a pipe 3 to a pipe 5 and the high pressure air is ejected from the top end of the pipe 5 to solidify instantaneously the molten solder. | ||||||
| 187 | JPS5316602Y2 - | JP1044674 | 1974-01-25 | JPS5316602Y2 | 1978-05-02 | |
| 188 | JPS5242735B1 - | JP5000871 | 1971-07-08 | JPS5242735B1 | 1977-10-26 | |
| 189 | ELECTROCONDUCTIVE BONDING MATERIAL | EP13834216.7 | 2013-08-30 | EP2891538B1 | 2018-10-10 | UESHIMA Minoru; OSAWA, Isamu |
| An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1 - 15 %, In: 2 - 16 %, Sb: greater than 0 % to at most 2 %, optionally one or both of Ag: at most 2 % and Cu: at most 1 %, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01 - 0.15 %, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused. | ||||||
| 190 | INTEGRATED SOLDERING DEVICE | EP15159671.5 | 2015-03-18 | EP2921247B1 | 2018-05-09 | Cocklin, Thomas; Tarr, Tony; Romey, Samuel; Heltborg, Andy; Braunberger, Jason; Brown, Stephen; Klecker, Glenn; Carcia, Anthony |
| An integrated soldering device comprising a wire feed mechanism, a heater configured to heat the wire, and an air recirculation system. The heated wire is fed from the device functions as the soldering tip as the device is used. The air recirculation system collects fumes and smoke generated by the soldering process. | ||||||
| 191 | SOLDERING DEVICE | EP16768920 | 2016-03-25 | EP3275584A4 | 2018-05-02 | EBISAWA MITSUO |
| In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5). | ||||||
| 192 | SOLDERING PROCESS DEVICE | EP16764956.5 | 2016-03-15 | EP3272449A1 | 2018-01-24 | EBISAWA, Mitsuo |
A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Whl) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip. |
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| 193 | HEATER/SENSOR SUB-ASSEMBLY AND SOLDER CARTRIDGE | EP15790437 | 2015-05-21 | EP2987579A4 | 2016-07-13 | MOCHIZUKI TOSHIKAZU; MATSUZAKI KENJI; TAKEUCHI HITOSHI |
| The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the sub-assembly to segregate the coil from the thermocouple temperature sensor. The soldering cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle. | ||||||
| 194 | ELECTROCONDUCTIVE BONDING MATERIAL | EP13834216 | 2013-08-30 | EP2891538A4 | 2016-05-04 | UESHIMA MINORU; OSAWA ISAMU |
| An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1 - 15 %, In: 2 - 16 %, Sb: greater than 0 % to at most 2 %, optionally one or both of Ag: at most 2 % and Cu: at most 1 %, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01 - 0.15 %, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused. | ||||||
| 195 | HEATER/SENSOR SUB-ASSEMBLY AND SOLDER CARTRIDGE | EP15790437.6 | 2015-05-21 | EP2987579A1 | 2016-02-24 | MOCHIZUKI, Toshikazu; MATSUZAKI, Kenji; TAKEUCHI, Hitoshi |
The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the sub-assembly to segregate the coil from the thermocouple temperature sensor. The soldering cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle. |
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| 196 | INTEGRATED SOLDERING DEVICE | EP15159671.5 | 2015-03-18 | EP2921247A2 | 2015-09-23 | Cocklin, Thomas; Tarr, Tony; Romey, Samuel; Heltborg, Andy; Braunberger, Jason; Brown, Stephen; Klecker, Glenn; Carcia, Anthony |
An integrated soldering device comprising a wire feed mechanism, a heater configured to heat the wire, and an air recirculation system. The heated wire is fed from the device functions as the soldering tip as the device is used. The air recirculation system collects fumes and smoke generated by the soldering process.
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| 197 | Gerät, insbesondere ein Haarstylinggerät | EP13166470.8 | 2013-05-03 | EP2661983A1 | 2013-11-13 | Altmann, Berthold; Blischke, Daniela; Copitzky, Thomas |
Die vorliegende Erfindung betrifft ein Gerät (1), insbesondere ein Haarstylinggerät mit einem Griffbereich (2) und einem erhitzbaren Arbeitsbereich (3). Erfindungswesentlich ist dabei, dass das Gerät (1) hinsichtlich seiner äußeren Form und seiner Schwerpunktlage derart ausgebildet ist, dass es bei einem beliebigen Ablegen auf einer Unterlage (5) eine selbststabilisierende und selbstaufrichtende Lage einnimmt, in welcher der erhitzbare Arbeitsbereich (3) nicht mit der Unterlage (5) in Kontakt steht, sondern sogar eine möglichst große Distanz zu dieser einnimmt. Hierdurch lässt sich eine sichere Handhabung des Geräts (1) erreichen.
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| 198 | VERBINDUNGSEINRICHTUNG UND VERFAHREN ZUR VERSCHALTUNG VON SOLARZELLEN | EP07855997.8 | 2007-10-19 | EP2201612A1 | 2010-06-30 | FISCHER, Heiko; TSCHOGE,Florian; MÜNCH, Markus |
| The invention relates to a method for interconnecting solar cells for solar modules by means of connecting elements using a connecting device, comprising a transport device, and a feed and joining head (1) to which a holding device (2) and an energy source (3) are connected. The connection is established by way of thermally joinable cable connectors (5). In the direction toward the solar cell, a recess (4) is provided on the feed and joining head (1), the shape of said recess corresponding to the shape of the cable connector (5) and being used to position the cable connector (5). With the method according to the invention, the feed and joining head (1) and the holding device (2) are moved and controlled in a clocked manner by means of a handled connecting device. | ||||||
| 199 | CORDLESS SOLDERING IRON | EP01990183 | 2001-12-14 | EP1463600A4 | 2007-03-21 | AXINTE DRAGOS; AXINTE GRIGORE |
| A soldering iron comprises a graphite tip having two separate halves (9, 10) that are electrically isolated from each other. When both halves of the tip are applied to an electrically conductive material, such as the material to be soldered, an electrical circuit between the tip halves (9, 10) and an electrical power source (8) is completed. Therefore, the tip can reach operating temperatures quickly. When the tip is removed from the joint, the electric circuit is broken and the tip material may quickly cool to a safe temperature. The tip material permits higher power outputs than other batter y operated portable soldering irons. | ||||||
| 200 | Verfahren und Vorrichtung zum Reinigen und zum Beschichten und/oder Befüllen einer Lötspitze durch Tauchen in eine heisse fliessende Lotwelle | EP05008846.7 | 2005-04-22 | EP1591185A1 | 2005-11-02 | Hohnerlein, Ernst |
Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Reinigen und zum Beschichten und /oder Befüllen einer an einem Lötgerät (3) befindlichen Lötspitze (2) mit frischem sowie flüssigem Lot (21). Der Kern der Erfindung besteht darin, daß die Lötspitze (2) zum Reinigen und zum Beschichten und/oder Befüllen mit frischem, verarbeitbarem Lot (21), in eine heiße, fließende Lotwelle (14) getaucht und zum Löten wieder entnommen wird. |
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