| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 3D TSV ASSEMBLY METHOD FOR MASS REFLOW | US14413121 | 2013-08-29 | US20150165537A1 | 2015-06-18 | Koenraad Alexander Gieskes |
| Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating. | ||||||
| 2 | 3D TSV assembly method for mass reflow | US14413121 | 2013-08-29 | US10052705B2 | 2018-08-21 | Koenraad Alexander Gieskes |
| Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating. | ||||||
| 3 | Method of forming an electrical connection to an electronic module | US14596914 | 2015-01-14 | US09936580B1 | 2018-04-03 | Patrizio Vinciarelli; Robert Joseph Balcius; Steven P. Sadler; Mark Andrew Thompson |
| Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses. | ||||||
| 4 | プリント回路板の製造方法及びプリント回路板 | JP2013260254 | 2013-12-17 | JP2015118988A | 2015-06-25 | 樋口 哲 |
| 【課題】半導体パッケージとプリント配線板を接合する際に、はんだを分離させずに、接合部内のボイドを減少させる製造方法およびプリント回路板を提供する。 【解決手段】ボイド低減のために、はんだペーストをプリント配線板の電極パッドからずらして供給し、はんだの溶融時に流動させ、また、はんだペーストを供給するプリント配線板の電極パッドと隣接する外周領域に、ソルダーレジストで覆わない領域を形成し、半導体パッケージとプリント配線板の間隔を広げ、はんだの分離を防ぐ、プリント回路板の製造方法。 【選択図】図1 |
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| 5 | 電子装置及び電子装置の製造方法 | JP2013254372 | 2013-12-09 | JP2015115363A | 2015-06-22 | 清水 浩三; 作山 誠樹 |
| 【課題】電子部品間の接合信頼性に優れる電子装置を実現する。 【解決手段】電子装置1は、端子11を備える電子部品10と、その端子11に対向する端子21を備える電子部品20と、それらの端子11と端子21を接合する接合部30とを含む。接合部30は、端子11と端子21の対向方向に延在された柱状の化合物31を含有する。柱状の化合物31が含有されることで、接合部30の強度の向上が図られる。柱状の化合物31は、端子11と端子21を接合する際に、電子部品10と電子部品20のうちの一方を他方よりも高温にした状態で、接合材を冷却し凝固させることで形成される。 【選択図】図1 |
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