| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 物品的钎焊装置 | CN86104933 | 1986-07-30 | CN1006612B | 1990-01-31 | 近藤权士 |
| 一种用于钎焊制品的盐浴钎焊装置，在该装置的加热槽中，以一种新的氟素惰性液作为热转移液。所述的热转移液对于金属是非活性的，而且，虽然在常温下呈液态，但具有足够高的沸点，在钎焊所需的温度也不沸腾。 | ||||||
| 2 | 一种铝合金的盐浴钎焊工艺过程 | CN201510998938.1 | 2015-12-25 | CN105499728A | 2016-04-20 | 李姗姗 |
| 本发明涉及一种钎焊工艺过程，尤其是一种铝合金的盐浴钎焊工艺过程。其步骤包括焊前准备、加热、保温、冷却、焊后处理。用此工艺焊接的铝合金制件具有良好的机械性能和力学性能。它操作步骤简单、方便、易于掌握，温度为恒温控制，加热均匀、迅速，焊缝质量高，而且一次能完成大量钎缝焊接，生产效率高，是一种品质优良的铝合金的盐浴钎焊工艺过程。 | ||||||
| 3 | 物品的热粘合装置 | CN86104933 | 1986-07-30 | CN86104933A | 1987-03-18 | 近藤权士 |
| 本发明是锡焊印刷电路板和配置在其上面的电子零件的装置。其把化学上稳定的高沸点液体保持在软钎料的熔点以上，把钎焊膏涂在印刷电路板上并在上面暂时固定电子零件，然后浸入上述高沸点液体致使软钎料熔化，提升经冷却凝固使电子零件粘合在印刷电路板上。也可用输送链来输送印刷电路板。 | ||||||
| 4 | 一种6063铝合金的盐浴钎焊工艺过程 | CN201310611596.4 | 2013-11-28 | CN103639560A | 2014-03-19 | 郇文杰; 王海伟 |
| 本发明涉及一种钎焊工艺过程，尤其是一种6063铝合金的盐浴钎焊工艺过程。其步骤包括焊前准备、加热、保温、冷却、焊后处理。用此工艺焊接的6063铝合金制件具有良好的机械性能和力学性能。它操作步骤简单、方便、易于掌握，温度为恒温控制，加热均匀、迅速，焊缝质量高，而且一次能完成大量钎缝焊接，生产效率高，是一种品质优良的6063铝合金的盐浴钎焊工艺过程。 | ||||||
| 5 | 双层金属管的连续高速焊接方法以及实施该方法的焊接炉 | CN01806639.9 | 2001-03-16 | CN1193854C | 2005-03-23 | 野村幸人 |
| 本发明的目的是制造一种用于汽车闸管等的双层金属管，方法是将其在与制管速度相适应的一个过程中连续制造。本发明特征在于使用具有高热容量的高温还原熔盐作为加热介质，由此可以提高焊接速度，并保持与制管速度的平衡。 | ||||||
| 6 | 双层金属管的连续高速焊接方法以及实施该方法的焊接炉 | CN01806639.9 | 2001-03-16 | CN1418141A | 2003-05-14 | 野村幸人 |
| 本发明的目的是制造一种用于汽车闸管等的双层金属管，方法是将其在与制管速度相适应的一个过程中连续制造。本发明特征在于使用具有高热容量的高温还原熔盐作为加热介质，由此可以提高焊接速度，并保持与制管速度的平衡。 | ||||||
| 7 | Method and apparatus for fuse-bonding articles | EP86307128.8 | 1986-09-16 | EP0217588A1 | 1987-04-08 | Kondo, Kenshi |
A first article, such as a printed circuit board, to which a second article, such as an electric part, is previously and temporarily fixed with a fusible bonding agent, such as a solder paste or a solder preform, is heated by direct contact with a liquid heating medium, such as a fluorocarbon, having a boiling point higher than the melting point of the bonding agent, so that the bonding agent is fused. Cooling of the first therebetween. |
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| 8 | BRAZING TITANIUM ALUMINUM ALLOY COMPONENTS | US15370635 | 2016-12-06 | US20170197270A1 | 2017-07-13 | Quinlan Yee Shuck; Jacque Sue Bader |
| In some examples, the disclosure describes a technique that includes covering a joint surface of a first part including a titanium aluminum (TiAl) alloy with a braze material including aluminum, where covering the joint surface includes at least one of electroplating the braze material on the joint surface, hot dipping the braze material on the joint surface, or positioning a foil of the braze material adjacent to the joint surface, positioning a second part including a titanium alloy in contact with the first part to define a joint region, where the joint region includes the braze material interposed between the second part and the joint surface of the first part, and heating the joint region to at least partially melt the braze material to form a braze joint connecting the first part to the second part. | ||||||
| 9 | Process for remelting a contact surface metallization | US860313 | 1997-11-21 | US5845838A | 1998-12-08 | Jorg Gwiasda; Elke Zakel; Hans Hermann Oppermann; Achim Kloeser; Stefan Weiss |
| Process for remelting a contact surface metallization (13) applied to a strate (10) in an inert or reducing medium, wherein the medium (18) is formed as alcoholic medium whose boiling point is the same as or above the melting point of the contact surface metallization (13), the medium (18) is applied to the contact surface metallization (13) applied to a contact surface (11, 12) of the substrate (10) outside the inert or reducing medium in such a way that the contact surface metallization (13) is screened with respect to the environment, and the medium (18) is tempered to a temperature which is the same as or higher than the melting point of the contact surface metallization (13). | ||||||
| 10 | Method for surface mount solder joints | US881872 | 1992-05-12 | US5310574A | 1994-05-10 | Damian J. Holtmann |
| A method and apparatus for the forming of a solder deposit on an SMD pad on a printed circuit or hybrid board. This formed solder deposit is in a defined three-dimensional well having the proper profile and a defined solder gap. The solder before forming can be solid solder or a solder paste. By the placement of a mesh on the surface of the circuit board with the solder in place on the pads, applying a slight positive pressure on a rigid or elastic surface on the other side of the mesh, and subjecting this system to a temperature just low enough to reflow the solder by means of a heat transfer fluid, then cooling the board to solidify the solder, a product results having the above properties. The duration of the application of heat and pressure is made so brief, that the laminate structure of the board and the coating thereon remain substantially unaffected. A circuit board with the solder so formed thereon. | ||||||
| 11 | Apparatus for solder coating printed circuit boards | US31120672 | 1972-12-01 | US3893409A | 1975-07-08 | ROTE EVERETT ARTHUR |
| Apparatus for obtaining a thick, uniform coating of solder on selected areas of a printed circuit board in which the circuit board, after being exposed to a spray of liquid solder, is immersed in a pool of hot liquid wax or oil, and then vibrated in an orbital motion for a time sufficient to produce flowability of the solder. The orbital motion may be circular or elliptical and may be continued while the circuit board is being withdrawn from the pool. The temperature of the pool of liquid is substantially above the melting temperature of the solder, and the liquid solder for the spray is continuously circulating.
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| 12 | Method of soldering the cooling body of automobile radiators | US3631588D | 1970-04-15 | US3631588A | 1972-01-04 | BAROZZI DAH A; CALIN VALENTIN; ZSIGMOND PETER |
| The invention is a new method for the manufacture of motor car radiators, regarding the soldering operation of the cooling body, consisting of cooling pipes and fins of aluminum, copper, brass or steel with an easily melting alloy.
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| 13 | Product for surface mount solder joints | US42202 | 1993-04-02 | US5403671A | 1995-04-04 | Damian J. Holzmann |
| A printed circuit or hybrid circuit board with a formed solder deposit on a surface mount device (SMD) pad thereon, as well as for the formed solder deposit itself. This formed solder deposit is in a defined three-dimensional well having the proper profile and a defined solder gap. The solder before forming can be solid solder or a solder paste. By the placement of a mesh on the surface of the circuit board with the solder in place on the pads, applying a slight positive pressure on a rigid or elastic surface on the other side of the mesh or on the mesh itself, and subjecting this system to a temperature just low enough to reflow the solder by means of a heat transfer fluid, then cooling the board to solidify the solder, a product results having the above properties. The duration of the application of heat and pressure is made so brief, that the laminate structure of the board and the coating thereon remain substantially unaffected. | ||||||
| 14 | Method of solder reflow assembly | US141100 | 1980-04-17 | US4334646A | 1982-06-15 | Henry J. Campbell |
| A solder reflow assembly technique wherein a substrate with solder pattern is immersed in a hot bath; after reflow of the solder, elements having a solder pattern therein are individually positioned on the substrate solder pattern; and the elements are aligned on the substrate by the surface tension created by the capillary action of the molten solder. | ||||||
| 15 | Process for the soldering of the cooler assembly to automobile radiators | US612804 | 1975-09-12 | US4037774A | 1977-07-26 | Dan Alexandru Barozzi; Valentin Calin; Zsigmond Peter |
| An improved method is disclosed for the soldering together of the cooling assembly of automobile radiators wherein aluminum fins, a first part of the cooling assembly, are etched in a solution consisting essentially of 10 to 14% sodium hydroxide, 4 to 7% zinc cyanide, 20 to 30% technical urea with the balance water for a period of 15 to 30 seconds at a temperature of 32 .degree. to 60.degree. C prior to undergoing treatment with a protective coating and eventual soldering to cooling pipes made of copper, brass, steel or aluminum, the remainder of the cooling assembly. | ||||||
| 16 | Silver soldering apparatus and method | US85307359 | 1959-11-16 | US3080648A | 1963-03-12 | THOMAS BOYD F |
| 17 | Process of making all-metal honeycomb laminate | US60632556 | 1956-08-27 | US3009241A | 1961-11-21 | GIOVANNUCCI JULIUS L |
| 18 | Brazing of thin metal structures | US23208438 | 1938-09-28 | US2191631A | 1940-02-27 | SHUTTS LEROY W; ROSENBERG PHILIP S |
| 19 | BONDING MEMBER AND BONDING METHOD | US15786964 | 2017-10-18 | US20180036798A1 | 2018-02-08 | Seitaro Washizuka |
| A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder. | ||||||
| 20 | Method for continuous high-speed welding of double-ply metal tubes and welding furnace for performing the same | US10246345 | 2002-09-17 | US06808103B2 | 2004-10-26 | Yukito Nomura |
| The present invention is a method and apparatus for making a double-ply metal tube such as those used for automobile brake tubes by producing the tube continuously in a single process. The present invention is characterized by using a high-temperature reducing molten salt with high heat capacity as the heating medium, whereby the welding speed can be increased and the balance with the tube-making speed can be kept. | ||||||
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