| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | MEMS ACTUATORS | EP04727485.7 | 2004-04-15 | EP1620349A2 | 2006-02-01 | M NARD, Stéphane; LASSONDE, Normand; VILLENEUVE, Jean-Claude |
| The MEMS cantilever actuator (10) is designed to be mounted on a substrate (12). The actuator (10) comprises an elongated hot arm member (20) having two spaced-apart portions (22), each provided at one end with a corresponding anchor pad (24) connected to the substrate (12). The portions (22) are connected together at a common end (26) that is opposite the anchor pads (24). It further comprises an elongated cold arm member (30) adjacent to and substantially parallel of the hot arm member (20), the cold arm member (30) having at one end an anchor pad (32) connected to the substrate (12), and a free end (34) that is opposite the anchor pad (32) thereof. A dielectric tether (40) is attached over the common end (26) of the portions (22) of the hot arm member (20) and the free end (34) of the cold arm member (30). This actuator (10) allows improving the performance, reliability and manufacturability of MEMS switches (100). | ||||||
| 142 | TRILAYERED BEAM MEMS DEVICE AND RELATED METHODS | EP02793902 | 2002-11-08 | EP1454349A4 | 2005-03-16 | CUNNINGHAM SHAWN J; TATIC-LUCIC SVETLANA |
| A method for fabricating a trilayered beam MEMS device includes depositing a sacrificial layer (310) on a substrate and depositing and removing a portion of a first conductive layer on the sacrificial layer (310) to form a first conductive microstructure (312); depositing a structural layer (322) on the first conductive microstructure (312); the sacrificial layer (310), and the substrate (300) and forming a via through the structural layer (322) to the first conductive microstructure (312); depositing a second conductive layer (336) on the structural layer (322) and in the via; forming a second conductive microstructure (324) by removing a portion of the second conductive layer (336), wherein the second conductive microstructure (324) electrically communicates with the first conductive microstructure (312) through the via; and removing a sufficient amount of the sacrificial layer (310) so as to separate the first conductive microstructure (312) from the substrate, wherein the structural layer (322) is supported by the substrate at a first end is freely suspended above the substrate at an opposing second end. | ||||||
| 143 | MIKROMECHANISCHER MANIPULATOR | EP90900053.0 | 1989-12-06 | EP0540510A1 | 1993-05-12 | BENECKE, Wolfgang |
| Un manipulateur micromécanique comprend un substrat (1), des éléments de chauffage et un bras manipulateur (2) dont le fonctionnement se fonde sur le principe de l'effet bilame. Les manipulateurs connus à effet bilame effectuent des mouvements perpendiculaires à la surface du substrat. Il arrive toutefois fréquemment que l'on souhaite disposer d'un manipulateur capable d'effectuer des mouvements dans le sens de la surface du substrat. Dans le manipulateur décrit, la surface du substrat oppose une résistance mécanique à une déviation du bras manipulateur, bombant celui-ci, réduisant sa longueur effective et entraînant ainsi un déplacement dans le sens de la surface du substrat. Ce bras manipulateur est utile pour entraîner des éléments mobiles dans le plan du substrat, tels que joints articulés et disques dentés. | ||||||
| 144 | TEMPERATURABHÄNGIGER SCHALTER MIT DISTANZRING | EP15171244.5 | 2015-06-09 | EP2958125B1 | 2016-11-30 | Mitschele, Rainer; Liehr, Hans-Christian |
| 145 | TEMPERATURSCHALTER SOWIE VERFAHREN ZUR JUSTIERUNG EINES TEMPERATURSCHALTERS | EP13750274.6 | 2013-07-30 | EP2880670B1 | 2016-05-25 | Reiter, Werner; Soukup, Peter Klaus; Reithofer, Josef |
| 146 | DOOR LOCKING DEVICE WITH INTEGRATED DOOR SENSING SWITCH | EP13716922.3 | 2013-04-02 | EP2834829B1 | 2016-03-02 | OTON, Leban |
| 147 | HYDROGEN PRODUCING FUEL CARTRIDGE AND METHODS FOR PRODUCING HYDROGEN | EP13764321 | 2013-03-11 | EP2827977A4 | 2015-11-25 | HOOD PETER; WINAND HENRI |
| In aspects of the disclosure, a fuel cartridge wherein the fuel is in a powdered form is admixed with inert materials such as alumina or other ceramics to improve thermal conductivity. Said cartridge having fuel zones, heating zones, and controllers to selectively heat fuel zones and thereby generate hydrogen via decomposition of fuel is disclosed. | ||||||
| 148 | MEMS ACTUATORS | EP04727485.7 | 2004-04-15 | EP1620349B1 | 2015-09-09 | MÉNARD, Stéphane; LASSONDE, Normand; VILLENEUVE, Jean-Claude |
| 149 | CHANGING THE STATE OF A SWITCH THROUGH THE APPLICATION OF POWER | EP11866905 | 2011-10-11 | EP2697811A4 | 2014-11-26 | BONAVIDES CLOVIS S |
| 150 | CHANGING THE STATE OF A SWITCH THROUGH THE APPLICATION OF POWER | EP11866905.0 | 2011-10-11 | EP2697811A1 | 2014-02-19 | BONAVIDES, Clovis S. |
| A switch includes a spring. The switch includes a collapsing element. The spring has a first spring state in which it is being held in tension by a restraining element and a second spring state in which it is not being held in tension because the restraining element has failed. The collapsing element is situated such that when sufficient power is applied to the collapsing element heat from the collapsing element will cause the restraining element to fail. The switch includes a first contact coupled to the spring. The switch includes a second contact coupled to the spring. The first contact and the second contact have a first 1-2 electrical connection state when the spring is in the first spring state. The first contact and the second contact have a second 1-2 electrical connection state different from the first 1-2 electrical connection state when the spring is in the second spring state. | ||||||
| 151 | MEMS ACTUATORS AND SWITCHES | EP08714663 | 2008-02-21 | EP2114819A4 | 2011-06-15 | MENARD STEPHANE; LU JUN; GONON NICOLAS; LASSONDE NORMAND |
| 152 | MEMS ACTUATORS AND SWITCHES | EP08733612.9 | 2008-03-17 | EP2126942A1 | 2009-12-02 | MÉNARD, Stéphane; LU, Jun; GONON, Nicolas |
| The microelectromechanical (MEMS) switches employ movable actuators wherein one can move perpendicular to an underlying substrate and one or more others can move in a direction substantially parallel to the underlying substrate. Methods of operating MEMS switches are also disclosed. The improvements can enhance the performance of MEMS switches and/or reduce their manufacturing costs. | ||||||
| 153 | MEMS ACTUATORS AND SWITCHES | EP08714663.5 | 2008-02-21 | EP2114819A1 | 2009-11-11 | MÉNARD, Stéphane; LU, Jun; GONON, Nicolas; LASSONDE, Normand |
| The MEMS actuator comprises a hot beam and a cold beam connected to a substrate. Portions of the hot beam are connected together at a common end. A dielectric tether is attached over the common end of the hot beam portions and a free end of the cold beam. The hot beam is configured to exhibit an asymmetric lengthening. This actuator has a better stress distribution compared to an actuator in which both hot beam portions do not have an asymmetric configuration. It also provides a more efficient actuation mechanism that can reduce stress along the structure and reduce the temperature of the hot beam portions during an actuation. | ||||||
| 154 | MICRO-ACUTUATOR AND LOCKING SWITCH | EP07837880.9 | 2007-09-07 | EP2067159A2 | 2009-06-10 | PARDO, Flavio |
| A micro-electromechanical actuator (100) employs metal for the hot arm (101) and silicon for at least the flexible portion of the cold arm (105). The cold arm (105) made of silicon is coupled to a metal wire (107) that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches. | ||||||
| 155 | Starter relay | EP06013057.2 | 2006-06-24 | EP1739702B1 | 2008-08-13 | Kobayasi, Masahide |
| 156 | MEMS device having standoff bumps and folded component | EP06126734.0 | 2002-11-08 | EP1760746A2 | 2007-03-07 | Dereus, Dana, R. |
According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.
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| 157 | Starter relay | EP06013057.2 | 2006-06-24 | EP1739702A1 | 2007-01-03 | Kobayasi, Masahide |
A starter relay (100) comprises a container (2) composed of an electrical insulating hard resin, a resistor (1) having a positive resistance temperature coefficient and housed in the container, and contact springs of feeding devices having conduction and resilience configured to press the resistor to establish connection with the resistor. The contact springs each include a body (5A,6A), two arms (5B1,5B2,6B1,6B2) extending from the body, and spaced press-fit contacts (5C1,5C2,6C1,6C2) extending from the arms to press the resistor. The press-fit contacts of one of the contact springs and the press-fit contacts of the other are arranged in crossed directions. Thus, a broken fragment of the resistor is not pinched between the contact springs even when the resistor pinched is broken.
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| 158 | MEMS DEVICE HAVING A TRILAYERED BEAM AND RELATED METHODS | EP02797085 | 2002-11-08 | EP1454333A4 | 2005-09-21 | CUNNINGHAM SHAWN J; DEREUS DANA R; SETT SUBHAM; TATIC-LUCIC SVETLANA |
| A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114). | ||||||
| 159 | MEMS DEVICE HAVING CONTACT AND STANDOFF BUMPS AND RELATED METHODS | EP02793903 | 2002-11-08 | EP1461816A4 | 2005-03-30 | DEREUS DANA R |
| According to one embodiment, a movable MEMS component (100) suspended over a substrate (102) is provided. The component (100) can include a structural layer (112) having a movable electrode (114) separated from a substrate (102) by a gap. The component (100) can also include at least one standoff bump (118) attached to the structural layer (112) and extending into the gap for preventing contact of the movable electrode (114) with conductive material when the component moves. | ||||||
| 160 | MEMS DEVICE HAVING CONTACT AND STANDOFF BUMPS AND RELATED METHODS | EP02793903.2 | 2002-11-08 | EP1461816A2 | 2004-09-29 | DEREUS, Dana, R. |
| According to one embodiment, a movable MEMS component (100) suspended over a substrate (102) is provided. The component (100) can include a structural layer (112) having a movable electrode (114) separated from a substrate (102) by a gap. The component (100) can also include at least one standoff bump (118) attached to the structural layer (112) and extending into the gap for preventing contact of the movable electrode (114) with conductive material when the component moves. | ||||||
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