| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 41 | Semiconductor device and method of manufacturing the same | JP2008299290 | 2008-11-25 | JP2009141348A | 2009-06-25 | JEONG EUN-SOO |
| <P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a pyroelectricity switch transistor using a bimetal, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device includes: a metal film which is separated for a fixed space from a semiconductor substrate and in which two or more etching holes are formed; a lower metallic pattern and upper metallic pattern formed on the lower metallic pattern arranged in the separating space between the semiconductor substrate and the metal film; a pillar formed on the semiconductor substrate and supporting one side of the bottom surface of the lower metallic pattern; and a pad formed on the semiconductor substrate through an air layer corresponding to the lower metallic pattern. Thereby, a pyro-electric switch transistor using a bimetal having thermal expansion coefficients being mutually different is provided, such a transistor can be easily manufactured by an easy process, and an effect raising yield is performed. Moreover, a transistor of a new structure is developed, and cost reduction is achieved by shortening the process. <P>COPYRIGHT: (C)2009,JPO&INPIT | ||||||
| 42 | JPH04500045A - | JP50049990 | 1989-12-06 | JPH04500045A | 1992-01-09 | |
| 43 | Switch mechanism | JP29095589 | 1989-11-08 | JPH02201840A | 1990-08-10 | FUREDERITSUKU ERII DAIMUSUTORA |
| PURPOSE: To provide a switch mechanism having a high reliability for a long period by forming a movable contact in a V-letter form to be engaged with two immovable terminals for bridging a gap between the terminals. CONSTITUTION: A movable contact, that is a short-circuitting bar 1, is a V-shaped element of gold-plated silver alloy, and the short-circuitting bar 1 is applied to a plate spring 3. The plate spring 3 is a flat spring supported between two support posts 16, and both ends 3A of it are freely movable. In a normal switch-opened condition, the plate spring 3 is bent in such directions that both its center part and the short-circuitting bar 1 get apart from immovable contacts 10, 12 respectively connected to terminals 11, 13. A compression spring 4 compressed between the bent plate spring 3 and a support bracket 5. The plate spring 3 is held in the bent condition, and the spring 4 is held in a condition compressed by length of a stopper wire 2 comprising Ni-Cr-Al. This wire 2 is wound around a ceramic spool 6 installed on the movable contact 1 through the compression spring 4, and both ends of it are installed on contact terminals 7, 8. COPYRIGHT: (C)1990,JPO | ||||||
| 44 | Circuit breaker | JP4950381 | 1981-04-03 | JPS5717531A | 1982-01-29 | HATSUDORII KEI BAACHI |
| 45 | ELECTRICALLY CONTROLLED SWITCHING DEVICE INCLUDING SHAPE MEMORY ALLOY ELEMENT | US15097843 | 2016-04-13 | US20160307718A1 | 2016-10-20 | David Michael Geier; James Walter Broadwell; James Michael McCormick; Patrick Wellington Mills |
| An electrically controlled switching device includes a support, a first contact coupled to the support, a second contact coupled to the support, an SMA element operably connected with the second contact, a sensor positioned on or adjacent to the SMA element, and a controller in communication with the sensor. The SMA element is configured to transform between a first shape and a different second shape responsive to an electrical pulse heating the SMA element to a transformation temperature. The sensor is configured to detect a detected temperature of the SMA element. The controller is configured to control the electrical pulse heating the SMA element. The controller receives signals from the sensor indicative of the detected temperature of the SMA element. | ||||||
| 46 | Thermal-mechanical flexible overload sensor | US14553131 | 2014-11-25 | US09460880B2 | 2016-10-04 | Juan Ignacio Melecio Ramirez; Waldo Jesus Arcos Medina; Gabriela Isabel Rubio Barraza |
| An overload relay is provided for electrical equipment, such as a motor. The overload relay includes a set of electrical contacts, a trip mechanism and a single-arm, a set of monolithic compliant mechanism actuators. The trip mechanism has a normal position and a tripped position. The normal position allows electrical connection between the electrical contacts, and the tripped position interrupts electrical connection between the electrical contacts in response to detection of a high current condition. The single-arm actuator is formed of an electrically conductive material, and includes a compliant hinge and a single bar connected to the hinge. The single bar is electrically coupled to the line contact or the load contact. Under the high current condition, one of first and second ends of the single bar deflects relative to the compliant hinge to cause the trip mechanism to move into the tripped position. | ||||||
| 47 | HYDROGEN PRODUCING FUEL CARTRIDGE AND METHODS FOR PRODUCING HYDROGEN | US15014281 | 2016-02-03 | US20160164123A1 | 2016-06-09 | Peter David Hood; Henri Winand |
| In aspects of the disclosure, a fuel cartridge wherein the fuel is in a powdered form is admixed with inert materials such as alumina or other ceramics to improve thermal conductivity. Said cartridge having fuel zones, heating zones, and controllers to selectively heat fuel zones and thereby generate hydrogen via decomposition of fuel is disclosed. | ||||||
| 48 | THERMAL-MECHANICAL FLEXIBLE OVERLOAD SENSOR | US14553131 | 2014-11-25 | US20160148771A1 | 2016-05-26 | Juan Ignacio MELECIO RAMIREZ; Waldo Jesus ARCOS MEDINA; Gabriela Isabel RUBIO BARRAZA |
| An overload relay is provided for electrical equipment, such as a motor. The overload relay includes a set of electrical contacts, a trip mechanism and a single-arm, a set of monolithic compliant mechanism actuators. The trip mechanism has a normal position and a tripped position. The normal position allows electrical connection between the electrical contacts, and the tripped position interrupts electrical connection between the electrical contacts in response to detection of a high current condition. The single-arm actuator is formed of an electrically conductive material, and includes a compliant hinge and a single bar connected to the hinge. The single bar is electrically coupled to the line contact or the load contact. Under the high current condition, one of first and second ends of the single bar deflects relative to the compliant hinge to cause the trip mechanism to move into the tripped position. | ||||||
| 49 | Blade-type fuse | US14344979 | 2012-10-12 | US09336961B2 | 2016-05-10 | Arata Kawamoto; Syoichi Nomura; Eiji Shimochi; Goro Nakamura |
| In a blade-type fuse (10) according to the present invention one of an upper casing (20) and a lower casing (30) includes a fixing post (30K), the other casing includes a through-hole (20K) through which the fixing post (30K) is passed, and also the flat terminal portion (41) includes a through-hole (40K) through which the fixing post (30K) is passed. The flat terminal portion (41) is formed bilaterally symmetrically about a vertical line passing through a center of the blade-type fuse (10), and vertically symmetrically about a horizontal line passing through the center of the blade-type fuse (10). | ||||||
| 50 | FUSE UNIT | US14602561 | 2015-01-22 | US20150130584A1 | 2015-05-14 | Mitsuhiko TOTSUKA; Toshiko MASUDA |
| A fuse unit comprising a resin housing formed by insulator, a circuit body formed by conductor, molded integrally with the resin housing and branching and transferring electricity from a power source side to a load side, and a fusible body provided on the circuit body and fusing at overcurrent to the load side; the circuit body is formed by a block side circuit body connected to the power source side, and a block side terminal body connected to the load side, a block side first connection end to which one side of the fusible body is detachably connected is formed on the block side circuit body, and a block side second connection end to which the other side of the fusible body is detachably connected is formed on the block side terminal body. | ||||||
| 51 | BREAKER, SAFETY CIRCUIT WITH BREAKER AND SECONDARY BATTERY WITH BREAKER | US13901622 | 2013-05-24 | US20130323547A1 | 2013-12-05 | Masashi NAMIKAWA |
| A digging-into portion 91 formed in a fixed part 42 of a movable piece 4 digs into and fits with a protrusion 74a of a resin casing 71, and the movable piece 4 is firmly fixed to the resin casing 71. Thereby, the posture of the movable piece 4 relative to the resin casing 71 is stabilized, and the positional relation between the fixed contact and the movable contact is stabilized. | ||||||
| 52 | Methods for implementation of a switching function in a microscale device and for fabrication of a microscale switch | US11492671 | 2006-07-25 | US08420427B2 | 2013-04-16 | Shawn Jay Cunningham; Dana Richard DeReus; Subham Sett; John Gilbert |
| Methods for Implementation of a Switching Function in a Microscale Device and for Fabrication of a Microscale Switch. According to one embodiment, a method is provided for implementing a switching function in a microscale device. The method can include providing a stationary electrode and a stationary contact formed on a substrate. Further, a movable microcomponent suspended above the substrate can be provided. A voltage can be applied between the between a movable electrode of the microcomponent and the stationary electrode to electrostatically couple the movable electrode with the stationary electrode, whereby the movable component is deflected toward the substrate and a movable contact moves into contact with the stationary contact to permit an electrical signal to pass through the movable and stationary contacts. A current can be applied through the first electrothermal component to produce heating for generating force for moving the microcomponent. | ||||||
| 53 | MEMS device having electrothermal actuation and release and method for fabricating | US10291125 | 2002-11-08 | US08264054B2 | 2012-09-11 | Shawn Jay Cunningham; Dana Richard DeReus; Subham Sett; John Richard Gilbert |
| MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer. | ||||||
| 54 | MEMS actuators with stress releasing design | US12839708 | 2010-07-20 | US08115579B2 | 2012-02-14 | Stéphane Mènard; Nicolas Gonon |
| The micro-electromechanical (MEMS) actuator comprises a hot arm member and a cold arm member. The cold arm member comprises at least two longitudinally spaced-apart flexors. The actuators may also be constructed with at least one among the hot arm member and the cold arm member comprising at least one spring section. The stress in this improved MEMS actuator is more uniformly distributed, thereby reducing the mechanical creep and improving its reliability as well as its operation life. | ||||||
| 55 | MEMS actuators and switches | US11308358 | 2006-03-18 | US08115576B2 | 2012-02-14 | Jun Lu; Stephane Menard |
| MEMS structures employing movable conductive member and a number of current-carrying stationary contact terminals which advantageously permit higher current carrying capability that prior art devices in which currents flowed through movable conductive members. Current carrying capability in excess of 1.0 amp without the need for additional current limiting devices is realized thereby lowering overall system manufacturing costs for systems employing our structures. | ||||||
| 56 | Semiconductor device and method for fabricating the same | US12330666 | 2008-12-09 | US07973374B2 | 2011-07-05 | Eun-Soo Jeong |
| Embodiments relate to a semiconductor device and a method for fabricating the same. According to embodiments, a semiconductor device may include a metal film spaced from a semiconductor substrate at a predetermined interval and in which a plurality of etching holes are formed. A bottom metal pattern disposed on and/or over a space between the semiconductor substrate and metal film and top metal pattern formed on and/or over the bottom metal pattern may be provided. A pillar may be formed on and/or over the semiconductor substrate and may support one side of a low surface of the bottom metal pattern. A pad may be formed on and/or over the semiconductor substrate, and an air layer corresponding to the bottom metal pattern may be inserted therein. According to embodiments, a pyro-electric switch transistor using a bi-metal with different coefficients of thermal expansion may be provided. | ||||||
| 57 | MEMS ACTUATORS AND SWITCHES | US12839185 | 2010-07-19 | US20110012703A1 | 2011-01-20 | Stéphane Ménard; Jun Lu; Nicolas Gonon; Normand Lassonde |
| Micro-electromechanical systems (MEMS) actuators and switches exhibiting geometries and configurations providing superior operating characteristics and longer lifetimes. | ||||||
| 58 | MEMS thermal actuator and method of manufacture | US11705739 | 2007-02-14 | US07622783B2 | 2009-11-24 | Gregory A. Carlson; John S. Foster; Christopher S. Gudeman; Paul J. Rubel |
| A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap. | ||||||
| 59 | Hysteretic MEMS thermal device and method of manufacture | US11334438 | 2006-01-19 | US07548145B2 | 2009-06-16 | Paul J. Rubel |
| A MEMS hysteretic thermal device may have a cantilevered beam which bends about one or more points in at least two substantially different directions. In one exemplary embodiment, the MEMS hysteretic thermal device is made from a first segment coupled to an anchor point, and also coupled to a second segment by a joint. Heating two respective drive beams causes the first segment to bend in a direction substantially about the anchor point and the second segment to bend in a direction substantially about the joint. By cooling the first drive beam faster than the second drive beam, the motion of the MEMS thermal device may be hysteretic. The MEMS hysteretic thermal device may be used for example, as an electrical switch or as a valve or piston. | ||||||
| 60 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | US12330666 | 2008-12-09 | US20090146229A1 | 2009-06-11 | Eun-Soo Jeong |
| Embodiments relate to a semiconductor device and a method for fabricating the same. According to embodiments, a semiconductor device may include a metal film spaced from a semiconductor substrate at a predetermined interval and in which a plurality of etching holes are formed. A bottom metal pattern disposed on and/or over a space between the semiconductor substrate and metal film and top metal pattern formed on and/or over the bottom metal pattern may be provided. A pillar may be formed on and/or over the semiconductor substrate and may support one side of a low surface of the bottom metal pattern. A pad may be formed on and/or over the semiconductor substrate, and an air layer corresponding to the bottom metal pattern may be inserted therein. According to embodiments, a pyro-electric switch transistor using a bi-metal with different coefficients of thermal expansion may be provided. | ||||||
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