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序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
81 Tuning mechanism US79258947 1947-12-18 US2491341A 1949-12-13 TILLMAN JOHN E
82 半導体デバイス上のハイブリッド変圧器構造 JP2015543162 2013-11-21 JP6247308B2 2017-12-13 チィ・シュン・ロ; ジェ−シュン・ラン; マリオ・フランシスコ・ヴェレツ; ジョンヘ・キム
83 変換装置 JP2015233570 2015-11-30 JP2016116440A 2016-06-23 山岡 正拓; 山川 岳彦; 加藤 彰
【課題】従来技術では、電変換装置の出力電力を最大化できない。
【解決手段】一次巻線と一次巻線と磁気結合される二次巻線とを含むトランスと、スイッチ素子を含むブリッジ回路と、インダクタと、を備え、ブリッジ回路のスイッチ素子のオンオフ動作により、直流電圧が交流電圧に変換され、交流電圧が一次巻線に供給されることで、二次巻線に出力電圧が誘起され、インダクタは、スイッチ素子と一次巻線とをつなぐ経路に配置され、トランスのリーケージインダクタンス値とインダクタのインダクタンス値とを含む共振インダクタンス値Lrは、式1を満たす、電力変換装置。
【選択図】図1
84 Thin-layer superconductor component with adjustable inductance characteristic, including the preparation and the superconductor component of the superconductor component devices JP2007500258 2005-02-24 JP5181234B2 2013-04-10 ハメット,ジーン−フランスワ; ベルンステイン,ピエール; メチン,ローレンス; トウイトウ,ナビル; モウチェル,セヴェリネ
85 How to use the superconducting element laminar stacked as a variable inductance control method for a device and the device including the same element JP2007550817 2006-01-13 JP2008527732A 2008-07-24 トウイトウ,ナビル; ハメット,ジーン−フランスワ; ベルンステイン,ピエール; メチン,ローレンス; モウチェル,セヴェリネ
【課題】本発明は、薄層の超伝導素子を可変インダクタンスとして用いる方法,そのような使用を可能にするデバイス及びそのような素子のインダクタンスをコントロールする方法を提供することを課題とする。
【解決手段】超伝導性誘導性素子は、交互に積み重ねられた電気絶縁材料と超伝導性材料とにより成る積層体を有している。 この超伝導性誘導性素子のインダクタンスは、交流電流の一部としてそれを流れる電流の作用で変化し又は交流電流にスーパーインポーズされる直流電流をインジェクションすることにより変化する。
86 Thin-layer superconductor component with a tunable inductance characteristic, including the preparation and the superconductor component of the superconductor component devices JP2007500258 2005-02-24 JP2007525032A 2007-08-30 トウイトウ,ナビル; ハメット,ジーン−フランスワ; ベルンステイン,ピエール; メチン,ローレンス; モウチェル,セヴェリネ
【課題】 特に、同調可能な又は調整可能な特性を有する薄層型超伝導体,その超伝導体の製造方法及びそのような部品を有するデバイスを提供することを課題とする。
【解決手段】 その部品は、交互に積層された電気的絶縁材料の薄層と超伝導材料の薄層とにより成るスタックと、超伝導層の少なくとも二つの間に抵抗接続を構成するための同調手段とを有している。 この部品のインダクタンスは、その接続の抵抗を修正することにより調整することができる。
【選択図】図11
87 Variable inductance element JP23845299 1999-08-25 JP2001068344A 2001-03-16 IIDA NAOKI; KAWAGUCHI MASAHIKO
PROBLEM TO BE SOLVED: To provide a variable inductance element having a high Q factor and capable of finely adjusting the inductance value efficiently and reliably. SOLUTION: An inductor pattern 4 is formed on the upper surface of an insulating board 1. The pattern 4 is a laddershaped electrode comprising a V-shaped frame 4a and a plurality of horizontal bars 4b spanning two arms 41 and 42 of the frame 4a. The bars 4b are to be trimmed to adjust the inductance value. The bars 4b are arranged at substantially equal intervals. The arms 41 and 42 are arranged at substantially 45 deg. with respect to the bars 4b.
88 Variable inductance element JP22887999 1999-08-12 JP2001052927A 2001-02-23 IIDA NAOKI; KAWAGUCHI MASAHIKO
PROBLEM TO BE SOLVED: To raise a Q-value while an inductance is efficiently fine-adjusted by separating a specified island region from a conductor provided on the surface of an insulating substrate by trimming so that a zigzag inductor pattern is formed. SOLUTION: After the upper surface of an insulating substrate 1 is polished, a wide-area conductor pattern 2 is formed on it by a thin-film forming method. Then a laser beam is emitted to form an U-shape trimming groove 10 on a variable inductance element 9, and two island-like square regions 3 are separated from the conductor pattern 2 to form a zigzag inductor pattern 4. Here, a pattern width V of a part of the insulating substrate 1 of the inductor pattern 4 which extends parallel in its widthwise direction is equal to a pattern width H of a part which extends parallel in its lengthwise direction, with a distance D between legs of the U-shape trimming group 10 being set twice the pattern width V or longer. COPYRIGHT: (C)2001,JPO
89 Method of adjusting three layer structured spiral inductor JP12621391 1991-05-29 JPH04352305A 1992-12-07 INOUE JUN; BIZEN TATSUO; FUNADA YOU; HIROSHIMA TAKASHI
PURPOSE: To enable an inductance to be adjusted in the title three layer structured spiral inductor provided with an inductor conductive part held between two grounding electrodes inside an electrically insulating base. CONSTITUTION: One grounding electrode 6 formed on outer surface of a base 2 is removed until specific inductor can be gained using the exposed part of the through hole connecting part 12 electrically connected to the inner peripheral end 11 of a spiral inductor conductive part 8 as the starting point. COPYRIGHT: (C)1992,JPO&Japio
90 High frequency coil JP18487582 1982-10-20 JPS5974610A 1984-04-27 SERIZAWA MASABUMI; HAYASHI TSUNEO
PURPOSE:To obtain a high frequency coil which has a prescribed turns ratio by a method wherein a coil is stood on a ceramic circuit board composed of conductor layers and insulation layers laminated alternately and around the circumference of the coil on each conductor layer a conductor ring which has a partial break is provided coaxially with the coil and these rings are connected in series. CONSTITUTION:A multi-layer circuit board 1 in which a circuit has been already composed is composed of conductor layers 3 and insulation layers 4 laminated alternately on a ceramic board 2. Lands 9 are provided on the surface of the board 1 corresponding to the fitting of components and connection of wires and they are introduced to the wiring inside. A coil 5 is stood on the board 1 and the coil 5 is composed of only one winding which is used for tuning inductance or the like and wound on a coil bobbin 5a and it has a high Q and is relatively cheap. A conductor ring 6 is formed on the conductor layer 3 around the circumference of the coil 5 concentrically with the coil 5 and it has a shape of a ring with a partial break. The both ends of the break of the conductor ring 6 are lead out to the surface of the board 1 and terminal lands 7 are provided. Required number of layers of the conductor rings 6 are connected in series by connection pins 8 which connect between the lands 7 so that a high frequency coil with a prescribed turns ratio of the windings is obtained.
91 Inductor and manufacture thereof JP7802782 1982-05-10 JPS58196005A 1983-11-15 KANAMAKI TATSUO
PURPOSE:To adjust inductance automatically, by a method wherein a coil is molded by high-molecular material, a metal thin film is formed on part of the molding body, and the inductance is adjusted by varying area of the metal thin film. CONSTITUTION:A wire is wound in spiral thereby a coil 1 is formed. The coil 1 is molded by high-molecular material with little induction loss, such as polystyrene, into a molding body 2. During the molding process, flat part is formed on part of a side surface of the molding body 2. A metal thin film 3 is applied to surface of a ceramic substrate 4 by means of evaporation or sputtering, and the ceramic substrate 4 is bonded to the flat part of the molding body 2. Inductance of the coil 1 is adjusted by varying area of the metal thin film 3.
92 VARIABLE INDUCTOR AND WIRELESS COMMUNICATION DEVICE INCLUDING VARIABLE DEVICE FOR CONVERSION OF A BASEBAND SIGNAL TO A RADIO FREQUENCY (RF) RANGE EP16171193.2 2016-05-24 EP3110013B1 2018-12-12 GARDNER, Donald S.; ALAVI, Hossein
Embodiments of a variable inductor and a communication device are generally described herein. The variable inductor may comprise a signal wire and a control wire to receive a direct current (DC) control current. The variable inductor may further comprise a magnetic material integrated with the signal wire and the control wire. When a DC control current applied to the control wires takes a first current value, an inductance between an input node and an output node on the signal wire may take a first inductance value. When the DC control current takes a second current value, the inductance between the input node and the output node may take a second inductance value.
93 WIRELESS POWER TRANSMISSION SYSTEM EP11762250 2011-03-29 EP2555376A4 2017-11-08 KANNO HIROSHI
The wireless power transmission system of this invention transmits power over a resonant magnetic field. The system includes a power-transmitting resonator 105 and a power-receiving resonator 107, at least one of which is a series resonant circuit with an inductor including spiral wiring 201 and extended wires 213, 207a, 207b and 207c. The extended wire 213 connects a point 203 of the spiral wiring 201 to a power supplying structure, while the extended wires 207a, 207b and 207c connect other points of the spiral wiring 201 to the power supplying structure. Capacitors 209a, 209b and 209c and switches 211a, 211b and 211c are connected to the extended wires 207a, 207b and 207c, respectively. The series resonant circuit has its inductance varied according to which current path has been chosen by selectively turning ON one of the switches. A wiring portion 201a of the spiral wiring 201 has a low-resistance portion 2010, of which the wiring resistance per unit length at a resonant frequency is set to be lower than in at least a part of the rest of the spiral wiring.
94 THROUGH SUBSTRATE VIA INDUCTORS EP13770741.0 2013-09-09 EP2909845A2 2015-08-26 SHENOY, Ravindra V.; KIM, Jitae; LAI, Kwan-yu; LASITER, Jon Bradley; STEPHANOU, Philip Jason; KIDWELL, Donald William; GOUSEV, Evgeni Petrovich
This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized.
95 WIRELESS POWER TRANSMISSION SYSTEM EP11762250.6 2011-03-29 EP2555376A1 2013-02-06 KANNO, Hiroshi

The wireless power transmission system of this invention transmits power over a resonant magnetic field. The system includes a power-transmitting resonator 105 and a power-receiving resonator 107, at least one of which is a series resonant circuit with an inductor including spiral wiring 201 and extended wires 213, 207a, 207b and 207c. The extended wire 213 connects a point 203 of the spiral wiring 201 to a power supplying structure, while the extended wires 207a, 207b and 207c connect other points of the spiral wiring 201 to the power supplying structure. Capacitors 209a, 209b and 209c and switches 211a, 211b and 211c are connected to the extended wires 207a, 207b and 207c, respectively. The series resonant circuit has its inductance varied according to which current path has been chosen by selectively turning ON one of the switches. A wiring portion 201a of the spiral wiring 201 has a low-resistance portion 2010, of which the wiring resistance per unit length at a resonant frequency is set to be lower than in at least a part of the rest of the spiral wiring.

96 Solid-state inductor and method for producing the same EP03252479.5 2003-04-17 EP1357600A3 2005-12-07 Pan, Wei; Hsu, Sheng Teng; Zhuang, Wei Wei

A method for producing a solid-state inductor according to the present invention is a method for producing a solid-state inductor, comprising: forming a bottom electrode; forming a colossal magnetoresistance (CMR) thin film overlying the bottom electrode; forming a top electrode overlying the CMR thin film; and applying an electrical field treatment to the CMR thin film and, in response to the electrical field treatment, converting the CMR thin film into a CMR thin film inductor.

97 Solid-state inductor and method for producing the same EP03252479.5 2003-04-17 EP1357600A2 2003-10-29 Pan, Wei; Hsu, Sheng Teng; Zhuang, Wei Wei

A method for producing a solid-state inductor according to the present invention is a method for producing a solid-state inductor, comprising: forming a bottom electrode; forming a colossal magnetoresistance (CMR) thin film overlying the bottom electrode; forming a top electrode overlying the CMR thin film; and applying an electrical field treatment to the CMR thin film and, in response to the electrical field treatment, converting the CMR thin film into a CMR thin film inductor.

98 Variable inductance element EP00402278.6 2000-08-11 EP1076345A3 2001-03-07 Iida, Naoki, Murata Manufac. Co., Ltd.; Kawaguchi, Masahiko, Murata Manufac. Co., Ltd.

A meandering inductor pattern (4) is formed on the upper surface of an insulating substrate (1). The inductor pattern (4) is formed by irradiating a conductor pattern (2) with a laser beam to form U-shaped trimming grooves (10) in the conductor pattern (2) in such a manner that two island-shape rectangular sections (3) are separated from the conductor pattern.

99 Variable inductance element EP00402278.6 2000-08-11 EP1076345A2 2001-02-14 Iida, Naoki, Murata Manufac. Co., Ltd.; Kawaguchi, Masahiko, Murata Manufac. Co., Ltd.

A meandering inductor pattern (4) is formed on the upper surface of an insulating substrate (1). The inductor pattern (4) is formed by irradiating a conductor pattern (2) with a laser beam to form U-shaped trimming grooves (10) in the conductor pattern (2) in such a manner that two island-shape rectangular sections (3) are separated from the conductor pattern.

100 반도체 디바이스들 상의 하이브리드 변압기 구조 KR20187000745 2013-11-21 KR20180007009A 2018-01-19 LO CHI SHUN; LAN JE HSIUNG; VELEZ MARIO FRANCISCO; KIM JONGHAE
몇개의신규한특징들은다수의층들을갖는반도체다이내에형성되는하이브리드변압기에관한것이다. 하이브리드변압기는다이의제 1 층상에포지셔닝되는제 1 권선들의세트를포함한다. 제 1 층은다이의기판위에포지셔닝된다. 제 1 권선들의세트는제 1 포트및 제 2 포트를포함한다. 제 1 권선들의세트는제 1 인덕터로서동작하도록배열된다. 하이브리드변압기는다이의제 2 층상에포지셔닝되는제 2 권선들의세트를포함한다. 제 2 층은기판위에포지셔닝된다. 제 2 권선들의세트는제 3 포트, 제 4 포트및 제 5 포트를포함한다. 제 2 권선들의세트는제 2 인덕터및 제 3 인덕터로서동작하도록배열된다. 제 1 권선들의세트및 제 2 권선들의세트는수직커플링하이브리드변압기로서동작하도록배열된다.
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