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序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
101 Power supply control system EP12180906.5 2012-08-17 EP2560273A3 2016-05-25 Proca, Amuliu, Bogdan; Irwin, Philip

A power supply control system for a power supply having a first half-bridge leg and a second half-bridge leg. In the control system, a first plurality of drive signals are configured to operate a half-bridge as a forward leg while a second plurality of drive signals are configured to operate a half-bridge as a backward leg. A switch element is intermediate the first and second plurality of drive signals and the first and the second half-bridge legs, the switch element being adapted to operate the first half-bridge as a forward leg and the second half-bridge as a backward leg in a first operating mode, the switch element being further adapted to operate the first half-bridge as a backward leg and the second half-bridge as a forward leg in a second operating mode.

102 SINGLE-CHIP MULTI-DOMAIN GALVANIC ISOLATION DEVICE AND METHOD EP13778241 2013-04-17 EP2839583A4 2016-01-20 MOGHE YASHODHAN VIJAY; TERRY ANDREW
103 Übertrager für ein Gerät der Hochfrequenztechnik, der direkt auf einer Leiterplatte angeordnet ist EP05011071.7 2005-05-23 EP1598839B1 2015-12-23 Epple, Ralf
104 NETWORK APPARATUS AND COMMUNICATION MODULE EP11803361.2 2011-03-16 EP2523199B1 2015-07-01 KOJIMA, Toshiyuki; ASANO, Megumu
On a circuit board (20) adapted to transmit a signal, a pulse transformer (12A) is provided on a path used for transmitting the signal of the circuit board (20). A shield member (15) is provided on the circuit board (20) for preventing noise, which is generated due to noise current flowing in a noise line pattern (16), from entering the pulse transformer (12A). The shield member (15) covers a surface portion (upper surface (26) and side surface (27)) of at least one pulse transformer that intersects concentric circles (30) whose central axis is axis A extending along the direction in which the noise current flows.
105 SINGLE-CHIP MULTI-DOMAIN GALVANIC ISOLATION DEVICE AND METHOD EP13778241.3 2013-04-17 EP2839583A1 2015-02-25 MOGHE, Yashodhan, Vijay; TERRY, Andrew
An integrated circuit, including: at least three integrated circuit portions mutually spaced on a single electrically insulating die, the integrated circuit portions being mutually galvanically isolated; and signal coupling structures on the die to allow communication of signals between the integrated circuit portions while maintaining the galvanic isolation therebetween.
106 INTEGRATED TRANSFORMER WITH MULTIPLE TRANSFORMATION RATIOS EP10768722.0 2010-10-12 EP2489048B1 2014-12-31 CORDIER, Christophe; FRANCOIS, Thomas; TESSON, Olivier
107 Power supply control system EP12180906.5 2012-08-17 EP2560273A2 2013-02-20 Proca, Amuliu, Bogdan; Irwin, Philip

A power supply control system for a power supply having a first half-bridge leg and a second half-bridge leg. In the control system, a first plurality of drive signals are configured to operate a half-bridge as a forward leg while a second plurality of drive signals are configured to operate a half-bridge as a backward leg. A switch element is intermediate the first and second plurality of drive signals and the first and the second half-bridge legs, the switch element being adapted to operate the first half-bridge as a forward leg and the second half-bridge as a backward leg in a first operating mode, the switch element being further adapted to operate the first half-bridge as a backward leg and the second half-bridge as a forward leg in a second operating mode.

108 Transformateur d'ondes millimétriques à fort coefficient de transformation et à faibles pertes d'insertion EP10164168.6 2010-05-27 EP2256752B1 2012-05-23 Belot, Didier; Leite, Bernardo; Kerherve, Eric; Begueret, Jean-Baptiste
109 TRANSFORMATEUR DE PUISSANCE POUR SIGNAUX RADIOFREQUENCES EP09735922.8 2009-04-14 EP2274753A1 2011-01-19 BERTRAM, Pierre; RICHARDEAU, Charles
The present invention relates to a power transformer for radiofrequency signals. The transformer is made in a low‑cost multilayer printed circuit card (201) comprising at least successively the following stacked layers: a first conducting layer, a first dielectric substrate layer, a second conducting layer, a second dielectric substrate layer, and a third conducting layer, the primary winding being formed by a turn printed in the second conducting layer, the secondary winding (103) being formed by a first turn printed in the first conducting layer, this first turn being linked to a second turn printed in the third conducting layer, the turns of the secondary winding being placed opposite the turn of the primary, the card being clamped above and below by two plates of ferromagnetic material. Capacitive components connected between winding(s) and an exposed conductive part can improve the performance of the proposed transformer.
110 PLANAR TRANSFORMER WITH BOARDS EP08737894.9 2008-04-17 EP2150964A1 2010-02-10 SCHIENE, Wolfgang; GREUEL, Georg; BLEUKX, Marc Maria Alex; SCHICHL, Roman Siegfried
Transformers (1) for transforming primary signals into secondary signals comprise primary and secondary parts that comprise boards (11-14, 21-23) with turns. By introducing distances larger than zero between for example any pair of neighboring boards (11-14, 21-23), parasitic capacitances of the transformers (1) are reduced, and the secondary signals may comprise relatively fast / high voltage pulses having rise times > 1 kV/μsec. To reduce proximity effects and any resulting losses, the primary and secondary boards (11-14, 21-23) may be stacked in interleaved ways. Such sandwich constructions reduce leakage inductances. In a particular direction, distances between subsequent primary boards (11-14, 21-23) and distances between subsequent combinations of primary and secondary boards (11-14, 21-23) are to be increased to further reduce capacitive losses in that particular direction. Relatively low voltage differences may be present between relatively close boards (11-14, 21-23), and relatively high voltage differences may be present between boards (11-14, 21-23) that are relatively far away from each other.
111 MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME EP05853280 2005-12-07 EP1861857A4 2009-09-02 WHITTAKER RONALD W; GUERRA JOE D; MARCOCI CIPRIAN
Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.
112 Inverter Transformer EP01105325.3 2001-03-07 EP1137017B1 2005-05-11 Suzuki, Shinichi, Hamatsu Manufacturing Unit
113 Electrical device and method of producing the same EP03028380.8 2003-12-10 EP1429352A1 2004-06-16

To form a center tap (CT), at least two coils must be formed. This increases the number of steps in the winding process and decreases the workability. To prevent this, a conductor having a plurality of plate portions that are connected to each other at one vertex of a rectangular shape is formed. The conductor is wound on a winding shaft, thus forming two coils.

114 TRANSFORMER WITH COMPENSATION TRANSMISSION LINE EP00928151.0 2000-04-12 EP1166440B1 2003-10-01 MENNA, Rudolph; MIGUELEZ, Philip
115 Operating techniques for coreless printed-circuit-board (PCB) transformers EP99300789.7 1999-02-03 EP0935263A3 1999-12-15 Hui, Shu Yuen Ron, Dep. of Electr. Engineering; Tang, Sai Chun

Optimal operating techniques are disclosed for using coreless printed-circuit-board (PCB) transformers under (1) minimum input power conditions and (2) maximum energy efficiency conditions. The coreless PCB transformers should be operated at or near the 'maximum impedance frequency' (MIF) in order to reduce input power requirement. For maximum energy efficiency, the transformers should be at or near the "maximum efficiency frequency" (MEF) which is below the MIF. The operating principle has been confirmed by measurement and simulation. The proposed operating techniques can be applied to coreless PCB transformers in many circuits that have to meet stringent height requirements, for example to isolate the gates of power MOSFET and IGBT devices from the input power supply.

116 HIGH FREQUENCY TRANSFORMER EP96942997 1996-12-27 EP0875908A4 1999-03-10 HU SUZHEN
A high frequency transformer includes a ring core made of noncrystalline magnetic material, a core protection case made of conductive material and enveloping said ring core, and a high voltage winding cross-wrapping said core protection case with enamel-insulated wire. A ring opening is provided along the peripheral direction on the top wall of the core protection case, and a plurality of conductor outlets are arranged respectively along the peripheral direction at both sides of the opening, the conductor outlets at both sides of the opening are electrically connected respectively to form two output ends, then a low voltage winding of the high frequency transformer is constituted by the two output ends and the core protection case. A low voltage winding or multiturn winding with centre tap can be fabricated if the core protection case has two layers or multi-layers. The high frequency transformer manufactured in such way has small size, light weight, and is suitable for being produced in batches. The magnetic-coupled degree between the high and the low voltage windings can be improved.
117 HIGH FREQUENCY TRANSFORMER EP96942997.6 1996-12-27 EP0875908A1 1998-11-04 Hu, Suzhen

A high-frequency transformer, comprises: a ring core made of amorphous magnetic material; a core protection box made of conductive material and enclosing the ring core; and a high-voltage winding, consisting of enamel-insulated wire wound on the core protection box. Wherein, on the ring top wall of the core protection box there is a ring gap in the peripheral direction, and at inner fringe and outer fringe of the ring gap, a plurality of leading wires are respectively arranged in the peripheral direction. The leading wires at inner fringe and outer fringe of the ring gap are electrically-connected together respectively and form two terminals. The core protection box and the two terminals constitute low-voltage winding of the high-frequency transformer. If the low-voltage winding comprises two or more core protection boxes, it can have a central tap or have multi-turn. A thus fabricated high-frequency transformer has a smaller size, a lighter weight and is more apt to industrial batch manufacture. Further, the magnetic coupling between the high-voltage winding and the low-voltage winding can be increased.

118 Noise-limiting transformer apparatus and method for making EP97309027.7 1997-11-11 EP0849747A1 1998-06-24 Jin, Sungho; Van Dover, Robert Bruce; Nemchik, Joseph Michael; Zhu, Wei

Embodiments of the invention include a transformer device (10) having a saturation region for limiting ingress noise and other noise. The transformer comprises a magnetic core (28), an input coil (32) and an output coil (34) arranged so that the output signal caused by the magnetic linkage between the input and output coils through the magnetic core is based on the magnitude of the input signal. According to an embodiment of the invention, the magnetic core includes a saturation region (42) that limits the output signal regardless of the magnitude of the input signal once the saturation region reaches its saturation magnetization state. The saturation region comprises a reduced saturation magnetization level caused by a geometrically constricted region of the magnetic core or, alternatively, by a modified, magnetic-equivalent region having properties similar to a geometrically constricted region.

119 LOW-PROFILE PLANAR TRANSFORMER FOR USE IN OFF-LINE SWITCHING POWER SUPPLIES EP91907531.7 1991-03-18 EP0476114B1 1996-02-28 ESTROV, Alexander
A low-profile planar type transformer having a unique bobbin design and a minimum of other pieces. The transformer is assembled by simply stacking all of the pieces, other than core pieces, in a sandwich-like-laminate and placing two appropriately shaped ferrite core pieces around the stack. In the preferred embodiment, the stack consists of the following layers, in the listed order: (a) a first thin dielectric spacer; (b) a first planar member (e.g., a PC board) containing a first winding; (c) two thin dielectric insulators; (d) a first nylon bobbin member; (e) a second planar member containing a second winding; (f) a third thin dielectric insulator; (g) a third planar member containing a third bobbin member; (h) a second nylon bobbin member; (i) two thin dielectric insulators; (j) a fourth planar member containing a fourth winding, and (k) a seventh thin dielectric insulator. Two E-shaped ferrite cores are placed around the stack, with the center arm of the 'E' going through a hole in the middle of the stack, to magnetically couple the current in the second planar member's windings to the windings of the first and third planar member.
120 Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure EP94302198.0 1994-03-28 EP0618595A1 1994-10-05 Roshen, Waseem Ahmed; Daum, Wolfgang; Korman, Charles Steven

A magnetic or electromagnetic circuit component includes an embedded magnetic material (e.g., ferromagnetic) in an HDI structure with alternating dielectric and metal or winding layers. In one embodiment, the ferromagnetic material is situated in a substrate well, or cavity, with or without an adhesive. Alternatively, the ferromagnetic material is co-fired with the ceramic substrate and then machined to achieve a required core shape. An electroplating process is employed to construct the metal layers, such process including differential plating for varying the thickness of metal layers and/or other portions of the circuit. Laser ablation or any other suitable technique is employed to make through-holes for insertion of the posts of a ferromagnetic core plate used to complete a magnetic circuit, if required. Advantageously, a magnetic or electromagnetic component may have a height of less than about 0.1 inch. Furthermore, such magnetic or electromagnetic circuit components allow for very low inductance interconnections between these components and other circuit elements. Moreover, in a power supply, for example, not only can the complete power supply be built using HDI technology, but power density is increased at relatively low cost and at a high level of reproducibility.

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