子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 21 | Thermoset adhesive films | EP03009803.2 | 2003-05-12 | EP1362901B1 | 2006-03-15 | Nikolic, Nikola A.; Zhang, Ruzhi; Musa, Osama M.; Jin, Hwail; Wu, Bing; Shenfield, David |
| This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality. | ||||||
| 22 | Heat resistant, impact resistant, acrylic/epoxy adhesives | EP03025467.6 | 2003-11-06 | EP1431365A1 | 2004-06-23 | Gosiewski, Donald E.; Rice, Brian |
A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system. |
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| 23 | Heat resistant, impact resistant, acrylic/epoxy adhesives | EP03025467.6 | 2003-11-06 | EP1431365B1 | 2006-07-19 | Gosiewski, Donald E.; Rice, Brian |
| A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system. | ||||||
| 24 | Thermoset adhesive films | EP03009803.2 | 2003-05-12 | EP1362901A3 | 2004-05-26 | Nikolic, Nikola A.; Zhang, Ruzhi; Musa, Osama M.; Jin, Hwail; Wu, Bing; Shenfield, David |
This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality. |
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| 25 | Thermoset adhesive films | EP03009803.2 | 2003-05-12 | EP1362901A2 | 2003-11-19 | Nikolic, Nikola A.; Zhang, Ruzhi; Musa, Osama M.; Jin, Hwail; Wu, Bing; Shenfield, David |
This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality. |
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| 26 | 난연성 접착제 조성물 및 그것을 이용한 접착 시트,커버레이 필름 및 가요성 동장 적층판 | KR1020060033020 | 2006-04-12 | KR1020060108508A | 2006-10-18 | 나까니시,도루; 곤도,가즈노리; 호시다,시게히로; 아마노,다다시 |
| Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates. | ||||||
| 27 | 난연성 접착제 조성물 및 그것을 이용한 접착 시트,커버레이 필름 및 가요성 동장 적층판 | KR1020060033019 | 2006-04-12 | KR1020060108507A | 2006-10-18 | 나까니시,도루; 곤도,가즈노리; 호시다,시게히로; 아마노,다다시 |
| Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. | ||||||
| 28 | 열경화성 접착 필름 | KR1020030029801 | 2003-05-12 | KR1020040030203A | 2004-04-09 | 니콜릭니콜라에이.; 짱루즈; 무사오사마엠.; 진화일; 우빙; 셴필드데이빗 |
| PURPOSE: A thermosetting film adhesive used in semiconductor package is provided, to improve adhesive strength by using a polymer system which comprises a base polymer, an electron donor functional group and an electron acceptor functional group and contains no epoxy functional group. CONSTITUTION: The film adhesive comprises a polymer which has a molecular weight of 2,000-1,000,000 and contains no functional group of an electron donor and an electron acceptor; an independent electron donor compound; and an independent electron acceptor compound. Also the film adhesive comprises a polymer which has a molecular weight of 2,000-1,000,000 and contains a pendant electron acceptor functional group and/or a pendant electron donor functional group; optionally an independent electron donor compound; and optionally an independent electron acceptor compound. Preferably the polymer is prepared from an acryl monomer, a vinyl monomer or a conjugated diene monomer; the independent electron donor compound is selected from the group consisting of a vinyl ether, a vinyl silane and compound adhered to an aromatic ring and containing a C-C double bond conjugated with the unsaturated bond on the ring; and the independent electron acceptor compound is selected from the group consisting of fumarate, maleate, acrylate and maleimide. | ||||||
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