子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 阻燃粘合剂组合物，和使用该组合物的粘合片材、覆盖膜和软质敷铜层压材料 | CN200610079383.1 | 2006-04-12 | CN1865382B | 2011-05-04 | 中西畅; 近藤和纪; 星田繁宏; 天野正 |
| 本发明提供一种阻燃粘合剂组合物，包括(A)无卤环氧树脂，(B)热塑性树脂和/或合成橡胶，(C)固化剂，(D)含氮的多磷酸盐化合物，和(E)固化促进剂。还提供一种粘合片材，其具有包含上述组合物的层，和用于覆盖该含有该组合物的层的保护层；一种覆盖膜，其具有电绝缘膜，和在该膜顶上的包括上述组合物的层；一种软质敷铜层压材料，其具有电绝缘膜，和在该膜顶上的包括上述组合物的层，和铜箔；一种粘结两个基材的方法，其包括将上述粘合片材夹在两个基材之间，并固化该粘合片材的步骤。进一步提供了一种制备粘合片材的方法，一种制备覆盖膜的方法和一种制备软质敷铜层压材料的方法。该无卤的粘合剂组合物通过固化生产出一种固化产品，其显示出极好的阻燃性和抗迁移特性。该组合物能够用于生产粘合片材、覆盖膜和软质敷铜层压材料。该粘合片材能够用在粘结两个基材的方法中。 | ||||||
| 2 | 阻燃粘合剂组合物，和使用该组合物的粘合片材、覆盖膜和软质敷铜层压材料 | CN200610079383.1 | 2006-04-12 | CN1865382A | 2006-11-22 | 中西畅; 近藤和纪; 星田繁宏; 天野正 |
| 本发明提供一种阻燃粘合剂组合物，包括(A)无卤环氧树脂，(B)热塑性树脂和/或合成橡胶，(C)固化剂，(D)含氮的多磷酸盐化合物，和(E)固化促进剂。还提供一种粘合片材，其具有包含上述组合物的层，和用于覆盖该含有该组合物的层的保护层；一种覆盖膜，其具有电绝缘膜，和在该膜顶上的包括上述组合物的层；一种软质敷铜层压材料，其具有电绝缘膜，和在该膜顶上的包括上述组合物的层，和铜箔；一种粘结两个基材的方法，其包括将上述粘合片材夹在两个基材之间，并固化该粘合片材的步骤。进一步提供了一种制备粘合片材的方法，一种制备覆盖膜的方法和一种制备软质敷铜层压材料的方法。该无卤的粘合剂组合物通过固化生产出一种固化产品，其显示出极好的阻燃性和抗迁移特性。该组合物能够用于生产粘合片材、覆盖膜和软质敷铜层压材料。该粘合片材能够用在粘结两个基材的方法中。 | ||||||
| 3 | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same | US11401870 | 2006-04-12 | US07524563B2 | 2009-04-28 | Toru Nakanishi; Kazunori Kondo; Shigehiro Hoshida; Tadashi Amano |
| Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. | ||||||
| 4 | Heat resistant, impact resistant, acrylic/epoxy adhesives | US10326300 | 2002-12-19 | US06949602B2 | 2005-09-27 | Donald E. Gosiewski; Brian Rice |
| A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system. | ||||||
| 5 | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same | US11401870 | 2006-04-12 | US20060234044A1 | 2006-10-19 | Toru Nakanishi; Kazunori Kondo; Shigehiro Hoshida; Tadashi Amano |
| Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. | ||||||
| 6 | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same | US11401854 | 2006-04-12 | US20060234043A1 | 2006-10-19 | Toru Nakanishi; Kazunori Kondo; Shigehiro Hoshida; Tadashi Amano |
| Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates. | ||||||
| 7 | Heat resistant, impact resistant, acrylic/epoxy adhesives | US10326300 | 2002-12-19 | US20040118514A1 | 2004-06-24 | Donald E. Gosiewski; Brian Rice |
| A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system. | ||||||
| 8 | Thermoset adhesive films | US10146387 | 2002-05-14 | US20030232926A1 | 2003-12-18 | Nikola A. Nikolic; Ruzhi Zhang; Osama M. Musa; Hwail Jin; Bing Wu; David Shenfield |
| This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality. | ||||||
| 9 | Heat-resistant and impact-resistant acrylic/epoxy adhesive | JP2003421328 | 2003-12-18 | JP2004197102A | 2004-07-15 | GOSIEWSKI DONALD E; RICE BRIAN |
| PROBLEM TO BE SOLVED: To provide an adhesive which is excellent in heat resistance and impact resistance. SOLUTION: This heat-resistant and impact-resistant adhesive comprises at least one acryl-based monomer, at least one epoxy-based monomer/resin, at least one bi-functional monomer which is chemically reactive with the acryl-based monomer and the epoxy-based monomer/resin, at least one impact resistance improver and a catalyst. COPYRIGHT: (C)2004,JPO&NCIPI | ||||||
| 10 | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same | US11401854 | 2006-04-12 | US07524394B2 | 2009-04-28 | Toru Nakanishi; Kazunori Kondo; Shigehiro Hoshida; Tadashi Amano |
| Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates. | ||||||
| 11 | Thermoset adhesive films | US11248490 | 2005-10-12 | US07326754B2 | 2008-02-05 | Nikola A. Nikolic; Ruzhi Zhang; Osama M. Musa; Hwail Jin; Bing Wu; David Shenfield |
| This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality. | ||||||
| 12 | Thermoset adhesive films | US11248490 | 2005-10-12 | US20060030672A1 | 2006-02-09 | Nikola Nikolic; Ruzhi Zhang; Osama Musa; Hwail Jin; Bing Wu |
| This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality. | ||||||
| 13 | Thermoset adhesive films | US11044374 | 2005-01-27 | US20050137340A1 | 2005-06-23 | Nikola Nikolic; Ruzhi Zhang; Osama Musa; Hwail Jin; Bing Wu; David Shenfield |
| This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality. | ||||||
| 14 | Multi-phase structural adhesives | US10867652 | 2004-06-15 | US20050022929A1 | 2005-02-03 | Rainer Schoenfeld; Hubert Schumann |
| Hot-curing structural adhesives with multiphase polymer morphology, wherein the binder matrix of the cured chemically reactive adhesive displays (a) a continuous phase containing a polymer P1 having a glass transition temperature of over 100° C.; (b) a heterodisperse phase consisting of individual continuous domains of a thermoplastic or elastomeric polymer P2 having a glass transition temperature of below −30° C. and an average particle size of between 0.5 and 50 μm, which itself contains separate phases of another thermoplastic or elastomeric polymer P3 having a glass transition temperature of below −30° C. and a size of between 1 nm and 100 nm, parts of which can be in aggregated form as larger agglomerates; and (c) another heterodisperse phase embedded in the continuous phase and consisting of domains of the polymer P3, at least parts of which have an average particle size of between 1 nm and 50 nm, wherein P3 is not identical to P2; are suitable as high-strength, impact resistant structural adhesives, for internal stiffeners for cavities in automobile construction and for the production of reinforcing coatings for thin-wall sheet components. | ||||||
| 15 | Thermosetting adhesive film | JP2003132918 | 2003-05-12 | JP4028431B2 | 2007-12-26 | エム．ムサ オサマ; シェンフィールド デイビッド; エー．ニコリック ニコラ; ウ ビン; ザン ルジー; ジン ワイル |
| This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality. | ||||||
| 16 | Flame retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper clad laminate plate, using the same | JP2005283648 | 2005-09-29 | JP2006342319A | 2006-12-21 | NAKANISHI NOBORU; KONDO KAZUNORI; HOSHIDA SHIGEHIRO; AMANO TADASHI |
| <P>PROBLEM TO BE SOLVED: To provide a halogen-free adhesive composition yielding a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties, to provide an adhesive sheet, a cover lay film, and a flexible copper-clad laminate plate, using the composition, and to provide a method of bonding two substrates, using the adhesive sheet. <P>SOLUTION: The flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator is provided. Also provided are an adhesive sheet having a layer including the composition, and a protective layer for covering the layer including the composition; a cover lay film having an electrically insulating film, and a layer including the composition, provided on top of the film; a flexible copper-clad laminate plate having an electrically insulating film, a layer including the composition, provided on top of the film, and a copper foil; and a method of bonding two substrates, including the steps of sandwiching the adhesive sheet between two substrates and curing the adhesive sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT | ||||||
| 17 | Flame-retardant adhesive composition, and the adhesive sheet using the same, a cover lay film and flexible copper-clad laminate | JP2005283648 | 2005-09-29 | JP4672505B2 | 2011-04-20 | 暢 中西; 正 天野; 繁宏 星田; 和紀 近藤 |
| Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates. | ||||||
| 18 | Thermosetting adhesive film | JP2003132918 | 2003-05-12 | JP2004161990A | 2004-06-10 | NIKOLIC NIKOLA A; ZHANG RUZHI; MUSA OSAMA M; JIN HWAIL; WU BING; SHENFIELD DAVID |
| <P>PROBLEM TO BE SOLVED: To provide a film adhesive used for mounting of a semiconductor and capable of rapidly being cured. <P>SOLUTION: The present invention provides a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound and curing agents for the polymer system. The polymer system comprises a base polymer and an electron donor and an electron acceptor functional group. The electron donor and the electron acceptor functional group can be pendant from the base polymer or can be interdispersed with the base polymer as independent compounds. <P>COPYRIGHT: (C)2004,JPO | ||||||
| 19 | MEHRPHASIGE STRUKTURKLEBSTOFFE | EP02795189.6 | 2002-12-13 | EP1456321B1 | 2007-04-18 | SCHÖNFELD, Rainer; SCHENKEL, Hubert |
| The invention relates to thermo-curable structural adhesives having multi-phase polymer morphology characterized in that the binding agent matrix of the cured reaction adhesive contains: (a) a continuous phase consisting of an optionally cross-linked polymer P1 having a glass transition temperature of higher than 100 °C, preferably higher than 120 °C; (b) a heterodisperse phase consisting of individual continuous areas of a thermoplastic or elastomeric polymer P2 having a glass transition temperature of lower than -30 °C and an average particle size ranging from 0.5 to 50 νm that, itself, contains separated phases of another thermoplastic or elastomeric polymer P3 having a glass transition temperature of lower than -30 °C and a size ranging from 1 νm to 100 νm, which can aggregated, in part, to from large agglomerates, and (c) an additional heterodisperse phase, which is embedded in the continuous phase and consists of areas of a thermoplastic or elastomeric polymer P3 having a glass transition temperature of lower than 30 °C that have, at least in part, an average particle size ranging from 1 νm to 50 νm, whereby P3 is not identical to P2. These multi-phase structural adhesives are suited for use a high-strength and shock-resistant structural adhesive in vehicle manufacturing, aircraft construction or railway vehicle manufacturing as well as for inner reinforcements of cavities in vehicle manufacturing and for producing reinforcing coatings for thin-walled metal sheets or plastic components. | ||||||
| 20 | MEHRPHASIGE STRUKTURKLEBSTOFFE | EP02795189.6 | 2002-12-13 | EP1456321A1 | 2004-09-15 | SCHÖNFELD, Rainer; SCHENKEL, Hubert |
| The invention relates to thermo-curable structural adhesives having multi-phase polymer morphology characterized in that the binding agent matrix of the cured reaction adhesive contains: (a) a continuous phase consisting of an optionally cross-linked polymer P1 having a glass transition temperature of higher than 100 °C, preferably higher than 120 °C; (b) a heterodisperse phase consisting of individual continuous areas of a thermoplastic or elastomeric polymer P2 having a glass transition temperature of lower than -30 °C and an average particle size ranging from 0.5 to 50 νm that, itself, contains separated phases of another thermoplastic or elastomeric polymer P3 having a glass transition temperature of lower than -30 °C and a size ranging from 1 νm to 100 νm, which can aggregated, in part, to from large agglomerates, and (c) an additional heterodisperse phase, which is embedded in the continuous phase and consists of areas of a thermoplastic or elastomeric polymer P3 having a glass transition temperature of lower than 30 °C that have, at least in part, an average particle size ranging from 1 νm to 50 νm, whereby P3 is not identical to P2. These multi-phase structural adhesives are suited for use a high-strength and shock-resistant structural adhesive in vehicle manufacturing, aircraft construction or railway vehicle manufacturing as well as for inner reinforcements of cavities in vehicle manufacturing and for producing reinforcing coatings for thin-walled metal sheets or plastic components. | ||||||
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