| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 41 | 树脂组合物、预浸料、覆金属箔层叠板及印刷布线板 | CN201380030928.8 | 2013-06-06 | CN104379668A | 2015-02-25 | 小林裕明; 十龟政伸; 野水健太郎; 马渕义则; 加藤祯启 |
| 本发明提供能够实现散热性、吸水性、铜箔剥离强度和吸湿耐热性优异的印刷布线板等的树脂组合物以及使用了该树脂组合物的预浸料、层叠板、覆金属箔层叠板以及印刷布线板等。本发明的树脂组合物至少含有环氧树脂(A)、氰酸酯化合物(B)和无机填料(C)，该无机填料(C)至少含有碳化硅粉体表面的至少一部分被无机氧化物处理而成的表面处理碳化硅(C-1)。 | ||||||
| 42 | 环氧树脂组合物、预浸料、纤维增强复合材料、电子电气设备用壳体 | CN201280010908.X | 2012-03-22 | CN103403054A | 2013-11-20 | 富冈正雄; 金子学; 萩原美雪 |
| 本发明提供能够获得固化性优异，具有优异的阻燃性并且耐热性优异的纤维增强复合材料的环氧树脂组合物和预浸料、以及使用所述预浸料而得到的纤维增强复合材料和电气电子设备用壳体。所述环氧树脂组合物含有下述成分：（A）成分：磷化合物；（B）成分：环氧树脂，其为1分子内具有3个以上环氧基的环氧树脂，不相当于所述（A）成分且不含有所述（A）成分；（C）成分：分子中不具有脲结构的环氧树脂固化剂；（D）成分：式（a）所示的二甲基脲化合物。式（a）中，R为氢原子、或者碳原子数为1～10中任一个的烷基。 | ||||||
| 43 | 热固化性树脂组合物以及使用其的预浸料坯及层叠板 | CN201210111455.1 | 2008-06-19 | CN102675598A | 2012-09-19 | 土川信次; 秋山雅则; 小竹智彦 |
| 本发明提供一种热固化性树脂组合物以及使用该热固化性树脂组合物的预浸料坯及层叠板，所述热固化性树脂组合物含有：(A)2取代次膦酸的金属盐、(B)分子中具有N-取代马来酰亚胺基的马来酰亚胺化合物、(C)6-取代胍胺化合物或双氰胺、及(D)1分子中具有至少2个环氧基的环氧树脂。将本发明的热固化性树脂组合物含浸或涂敷于基材而得到的预浸料坯及通过将该预浸料坯进行层叠成形而制造的层叠板，在铜箔粘接性、玻璃化转变温度、焊料耐热性、吸湿性、阻燃性、相对介电常数及介质损耗正切中均取得平衡，作为电子设备用印刷线路板是有用的。 | ||||||
| 44 | 纤维强化复合材料 | CN201080043278.7 | 2010-09-27 | CN102666683A | 2012-09-12 | 金子学; 石本智子; 宇佐美馨 |
| 使用包含环氧树脂(A)、氯化硼胺络合物(B)和纤维基材(C)的预浸料。优选相对于环氧树脂(A)中包含的环氧基的摩尔数，氯化硼胺络合物(B)中的硼的摩尔数比为4～7摩尔％嘛环氧树脂(A)包含具有唑烷酮环结构的二官能环氧树脂、双酚型环氧树脂和苯酚酚醛清漆型环氧树脂。 | ||||||
| 45 | 环氧树脂组合物、预浸料及纤维增强复合材料 | CN201080023743.0 | 2010-06-01 | CN102449018A | 2012-05-09 | 野原敦; 金子学; 富冈正雄 |
| 本发明提供：提供不含有卤素系阻燃材、红磷、磷酸酯而具有优异阻燃性的复合材料的环氧树脂组合物、以及使用上述环氧树脂组合物的预浸料及纤维增强复合材料。即，将包含下述式(a)表示的化合物(a)的含磷环氧树脂(A)、酚醛清漆型环氧树脂(C)、环氧树脂用固化剂(D)作为必须成分的环氧树脂组合物。含有上述环氧树脂组合物而成的预浸料。将上述预浸料进行固化得到的纤维增强复合材料。 | ||||||
| 46 | 环氧树脂组合物、预浸料坯、碳纤维增强复合材料及电子电气部件箱体 | CN201080010992.6 | 2010-02-04 | CN102341429A | 2012-02-01 | 前田祐希; 本田史郎; 川本史织 |
| 本发明提供一种具有优异的阻燃性、快速固化特性、耐热性及力学特性的碳纤维增强复合材料，另外，提供优选用于得到所述纤维增强复合材料的环氧树脂组合物、预浸料坯及碳纤维增强复合材料以及电子电气部件箱体。环氧树脂组合物的特征在于含有下述构成成分：[A]含有50质量％以上下述式(I)表示的化合物的环氧树脂、[B]有机氮化合物固化剂、[C]磷酸酯、[D]磷腈化合物。(式中，R1、R2、R3表示氢原子或甲基。另外，n表示1以上的整数)。 | ||||||
| 47 | PHOSPHORUS-CONTAINING COMPOUNDS USEFUL FOR MAKING HALOGEN-FREE, IGNITION-RESISTANT POLYMERS | PCT/US2012035933 | 2012-05-01 | WO2012161926A2 | 2012-11-29 | WORKU ANTENEH Z; MULLINS MICHAEL J |
| A process for making a phosphorus-containing compound comprising contacting: (A) and (B) is disclosed. The phosphorus-containing compound can then be used as flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers; and the use of such flame retardant-containing polymers to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products. | ||||||
| 48 | Resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same | US15163705 | 2016-05-25 | US10047205B2 | 2018-08-14 | Jeong Cheol Kim; Suk Won Kang; Dal Saem Jin; Il Seong; Seok Ju Park |
| The present invention relates to a prepreg which is manufactured by impregnating thermosetting resin composition and at least one thermoplastic additive into unidirectional carbon fiber, and to a resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same by differentiating a resin constituent, a resin equivalent weight, viscosity, gel time and glass transition temperature differing from those described in the prior art. | ||||||
| 49 | Provisioning work environments on personal mobile devices | US15401225 | 2017-01-09 | US10044734B2 | 2018-08-07 | Stephen Deasy; Craig Newell; Emil Sit; Paul Wisner; David Furodet; Viktor Gyuris; Robert Meyer; Fanny Strudel |
| A virtual business mobile device can be provisioned on a personal mobile device, by binding a mobile application for provisioning the business mobile device to a privileged component of a host operating system of the personal mobile device, wherein the binding enables a software virtualization layer and a management service component of the mobile application to execute in a privileged mode. The mobile application is then able to download a virtual phone image for the business mobile device and security-related policy settings relating to use of the business mobile device from a mobile management server, wherein the software virtualization layer is able to launch a virtual machine for the business mobile device based on the virtual phone image. Once the virtual phone image has been downloaded, the management service component initiates a periodic attempt to establish a connection with the mobile management server to comply with the downloaded security-related policy settings. | ||||||
| 50 | Composites and epoxy resins based on aryl substituted compounds | US15336503 | 2016-10-27 | US10040914B2 | 2018-08-07 | Larry Steven Corley; Robert Dale Farris; Carlton E. Ash |
| Compositions and methods for forming epoxy resin are provided, and compositions and methods for forming epoxy resin composites are provided. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component comprising a glycidyl ether of an aryl substituted phenolic compound, a curing agent component, and a substrate. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component and a curing agent component comprising an aryl substituted phenolic compound, and a substrate. | ||||||
| 51 | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | US15525442 | 2016-01-29 | US09999126B2 | 2018-06-12 | Takashi Kobayashi; Kentaro Takano |
| The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1): wherein n represents an integer of 1 or more; and an epoxy resin (B). | ||||||
| 52 | SILOXANE-MODIFIED CYCLOTRIPHOSPHAZENE HALOGEN-FREE FLAME RETARDANT, PREPARATION PROCESS AND USE THEREOF | US15475471 | 2017-03-31 | US20180112133A1 | 2018-04-26 | Yongzhen WANG; Yueshan HE; Zhongqiang YANG; Yongjing XU |
| The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products. | ||||||
| 53 | METHOD OF MANUFACTURING CURED RESIN FILM | US15500929 | 2015-09-30 | US20180111293A1 | 2018-04-26 | Jyou KONAGAWA; Masahumi KAWASAKI |
| [Problem] To provide a manufacturing method with which a cured resin film can be manufactured at high yield, and which effectively prevents the occurrence of defects such as wrinkles in the cured resin film.[Solution] Provided is a cured resin film manufacturing method comprising: a first step in which an undried resin film is formed on a support, the undried resin film comprising a heat curable resin composition containing a curable resin and a solvent; a second step in which a curable resin film having a loss of 0.5-7 wt % on heating is formed by drying the undried resin film which has been formed on the support by using a float method to convey the undried resin, which is in the state of having been formed on the support, in a drying device; a third step in which a cured resin film is formed by heat curing the curable resin film; and a fourth step in which the support is detached from the cured resin film. | ||||||
| 54 | SEMIPREG WITH THERMOPLASTIC TOUGHENED NOVOLAC-BASED EPOXY RESIN MATRIX | US15839467 | 2017-12-12 | US20180100044A1 | 2018-04-12 | Kathlyn Lizette Baron; Gordon Emmerson; Yen-Seine Wang |
| A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component. | ||||||
| 55 | Resin composition, prepreg, and laminated sheet | US15363395 | 2016-11-29 | US09902825B2 | 2018-02-27 | Yoshihiro Kato; Takaaki Ogashiwa; Hiroshi Takahashi; Tetsuro Miyahira |
| A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO3·yMg(OH)2·zH2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet. | ||||||
| 56 | Provisioning Work Environments on Personal Mobile Devices | US15401225 | 2017-01-09 | US20170374081A9 | 2017-12-28 | Stephen Deasy; Craig Newell; Emil Sit; Paul Wisner; David Furodet; Viktor Gyuris; Robert Meyer; Fanny Strudel |
| A virtual business mobile device can be provisioned on a personal mobile device, by binding a mobile application for provisioning the business mobile device to a privileged component of a host operating system of the personal mobile device, wherein the binding enables a software virtualization layer and a management service component of the mobile application to execute in a privileged mode. The mobile application is then able to download a virtual phone image for the business mobile device and security-related policy settings relating to use of the business mobile device from a mobile management server, wherein the software virtualization layer is able to launch a virtual machine for the business mobile device based on the virtual phone image. Once the virtual phone image has been downloaded, the management service component initiates a periodic attempt to establish a connection with the mobile management server to comply with the downloaded security-related policy settings. | ||||||
| 57 | COMPOSITE MATERIAL WITH THERMOPLASTIC TOUGHENED NOVOLAC-BASED EPOXY RESIN MATRIX | US15189994 | 2016-06-22 | US20170369662A1 | 2017-12-28 | Gordon Emmerson; Yen-Seine Wang; Jessica Leandro |
| Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component that includes a mixture of polyamide particles and polyimide particles. | ||||||
| 58 | RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | US15525442 | 2016-01-29 | US20170332487A1 | 2017-11-16 | Takashi KOBAYASHI; Kentaro TAKANO |
| The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1): wherein n represents an integer of 1 or more; and an epoxy resin (B). | ||||||
| 59 | Adduct Thermosetting Surfacing Film and Method of Forming the Same | US15655050 | 2017-07-20 | US20170313835A1 | 2017-11-02 | Qiang Wang; Ito Akihiro; Paul Kyle; Augusto Arakaki; Catalina Gutierrez |
| In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed. | ||||||
| 60 | HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE USING SAME | US15118204 | 2015-06-01 | US20170283609A1 | 2017-10-05 | Xianping Zeng; Liexiang He |
| Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance. | ||||||
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