Nano-patterned devices and their method of manufacture are described. In one embodiment, a method for forming a device includes: electrochemically etching a first material layer comprising a first material disposed on a substrate, wherein electrochemically etching the first material layer comprises applying to the first material layer an electrochemical potential that changes according to a sequence; and forming a pattern of a second material on the substrate during the electrochemical etch, wherein the pattern relates to the sequence.

　レアアースをはじめ、研磨剤や砥粒を一切使用せず、またフッ化水素等の取り扱いが難しく、環境負荷の大きな溶液を一切使用せず、光学ガラス材料などの固体酸化物を、加工変質層を導入することなく加工することが可能な固体酸化物の加工方法及びその装置を提供する。　水１の存在下で、酸素を介して１種又は以上の元素が結合した固体酸化物を被加工物とし、水分子が解離して固体酸化物を構成する酸素元素と他の元素のバックボンドを切って吸着し、加水分解による分解生成物の生成を助ける触媒物質を加工基準面（３）として用い、水の存在下で、被加工物（５）と加工基準面とを接触若しくは極接近させて配し、加工基準面の電位をＨ2及びＯ2 が発生しない範囲とし、被加工物と加工基準面とを相対運動させて、分解生成物を被加工物表面から除去する。

A method for processing metal plated leadframes, the method comprising the steps of: placing Zn/Cr alloy layer on said plated leadframes; masking discrete portions of said leadframes, so as to expose wire connectable portions; simultaneously immersing the leadframes in an electrolytic fluid and applying a current across said leadframes; and consequently stripping the Zn/Cr layer from the wire connectable portions, so as to expose a plated metal surface of said leadframe.

Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

電解加工方法は、配線金属の加工を抑制しつつ、拡散バリア層を優先的に加工できるようにして、ＣＭＰを省略したり、ＣＭＰにおける加工圧力を軽減したりできるようにする。電解加工方法は、炭酸プロピレン等の有機溶媒に、ヘキサフルオロりん酸リチウム等の電解質を溶かし、必要に応じて複素環式化合物からなるインヒビターを添加した電解液（４８）に基板（Ｗ）の表面を接触させ、基板（Ｗ）の表面に、例えば有機溶媒の分解電圧未満の値に制御した正電位を印加して該表面の電解加工を行う。

An elevator load bearing member assembly includes at least one traction enhancing surface (46) on a jacket (44). In one example, a mechanical removal process is used to strip away at least some of an amide-rich layer from the surface (46) after the jacket has been extruded onto tension members (42). In another example, a chemical removal process is used. Another disclosed example includes disrupting the surface.

The invention provides a cylindrical electrochemical cell which includes a first electrode and a second electrode which is a counter electrode to the first electrode, and an electrolyte. The first electrode includes a polyanion-based electrode active material.

An electrolytic processing apparatus (50) has feed electrodes (74) to feed a current to a substrate (W), an ion exchanger (76) brought into contact with the substrate (W), and process electrodes (72) to perform an electrolytic process on the substrate (W). The electrolytic processing apparatus (50) has an electrolytic processing liquid source to supply an electrolytic processing liquid between the substrate (W) and the ion exchanger (76), and a regeneration liquid supply source to supply a regeneration liquid to a regeneration liquid chambers (90a, 90b). The electrolytic processing apparatus (50) includes regeneration electrodes (84) spaced from the process electrodes (72). The feed electrode (74) has a potential higher than the process electrode (72) and the same polarity as the process electrode (72). The process electrode (72) has a potential higher than the regeneration electrode (84).

本発明は、例えば銅膜等の導電性材料を、低面圧かつ高レートで、例えばピットの発生を効果的に防止しつつ、確実に加工できるようにした複合加工装置に関する。本発明の複合加工装置は、基板（Ｗ）を保持する基板ホルダ（４２）と、基板の表面を機械的作用を含む加工方法で加工する機械的加工部（８２）と、イオン交換体（９２）を備えた加工電極（８６）を有し、イオン交換体（９２）を基板（Ｗ）に接触させつつ加工電極（８６）と基板（Ｗ）の間に電圧を印加して基板（Ｗ）を加工する電解加工部（８４）とを個別に備えた加工テーブル（４６）と、基板（Ｗ）と加工電極（８６）の間、及び基板（Ｗ）と機械的加工部（８２）の間に液体を供給する液体供給部（９４）と、基板（Ｗ）と加工テーブル（４６）とを相対移動させる駆動部を備えている。

This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that can come close to a workpiece, a feeding electrode for feeding electricity to the workpiece, an ion exchanger disposed in the space between the workpiece and the processing and the feeding electrodes, a fluid supply section for supplying a fluid between the workpiece and the ion exchanger, and a power source, wherein the processing electrode and/or the feeding electrode is electrically divided into a plurality of parts, and the power source applies a voltage to each of the divided electrode parts and can control voltage and/or electric current independently for each of the divided electrode parts.

There is provided an electrolytic processing apparatus and method that can effect processing of a substrate with high processing precision and can produce an intended form of processed substrate with high accuracy of form. The electrolytic processing apparatus includes: a holder (30) for holding a substrate (W); a processing electrode (32) that can come close to the substrate; a feeding electrode (34) for feeding electricity to the substrate; an ion exchanger (40) disposed in the space between the substrate and the processing electrode, or the substrate and the feeding electrode; a fluid supply section (70) for supplying a fluid into the space; a power source (68) for applying a voltage between the processing electrode and the feeding electrode; a drive sections (44, 56 and 60) for allowing the substrate and the processing electrode, facing each other, to make a relative movement; and a numerical controller (72) for effecting a numerical control of the drive sections.

The present invention relates to a method for removing powder from a component or part produced by metal additive manufacturing systems based on powder beds. The method comprising the steps; to manufacture a part by additive manufacturing, said part having at least one internal cavity with at least one external opening. Said internal cavity is at least partly filled with powder, said powder in said internal cavity having grains agglomerated or connected to each other; to evacuate gas from said internal cavity; to add liquid electrolyte to said internal cavity; to use an electrochemical process for separating connected powder grains in said cavity.

Methods and systems for plating a nickel alloy member are described. Methods include submerging a member in a salt solution and establishing a voltage between an electrode and the member such that the member is at a higher electrical potential (positive voltage) relative to the electrode, leading to electrochemical etching of the surface. Following the electrochemical etching, and without removing the member from the salt solution, a second voltage of reverse polarity can be established across the salt solution between the surface and the electrode, leading to electroplating of the surface.

　処理液に含まれる被処理イオンを用いて所定の処理を行う電解処理装置は、処理液を挟むように配置された直接電極及び対向電極と、処理液に電界を形成する間接電極と、間接電極に対して、電源との接続と、直接電極又は対向電極との接続とを切り替えるスイッチと、を有し、当該スイッチは、間接電極と電源とを接続して電圧を印加し、当該スイッチは、間接電極と電源との接続を切断し、当該間接電極と直接電極又は対向電極とを接続する。