Ic assembling carrier
专利汇可以提供Ic assembling carrier专利检索，专利查询，专利分析的服务。并且PURPOSE:To obtain a low cost IC assembling carrier by integrating at least two key-shaped projections while corresponding to external circumference of printed wiring board and projected plate corresponding thereto to the upper surface of carrier loading a printed wiring board. CONSTITUTION:The circular grooves 15a splitted into two sections by etching are formed until these reach the rear side to a stainless carrier 11 in the thickness of about 0.5mm., a ?-shaped groove 15b projected to the inner side than the circle and a ?-shaped groove 15c including a part of circle are provided between these grooves 15a, and the center portion of circular grooves 15a is removed. Then, the area surrounded by the grooves 15b, 15c is pressed and this area is lifted and simultaneously a portion projected by the groove 15b is bent upward, forming the key-shaped projection 12 and projected plate 13 as the carrier. Thereafter, a glass fiber - epoxy printed wiring board 16 for clock is inserted between the unit 11 and projection 12 from the direction of projection 13 while it is inclined and the printed wiring board 16 is fixed by projections 12 and 13.，下面是Ic assembling carrier专利的具体信息内容。
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