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Manufacture of semiconductor device

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专利汇可以提供Manufacture of semiconductor device专利检索,专利查询,专利分析的服务。并且PURPOSE:To isolate between elements by forming a high density impurity layer on V-shaped groove surface on an Si substrate from a mask window, anisotropically etching it to form the further deep groove, thereby allowing the impurity layer to remain on the vertical surface and simply forming a channel cut layer with good controllability. CONSTITUTION:An Si3N4 mask 12 is covered on a p type Si substrate 11, which is then anisotropically etched, a V-shaped groove 14 is formed, B ions are implanted, the substrate is then heat treated to form a p type layer 15. Then, a further deep groove 16 is formed by reactive ion etching, and a p type channel cut layer 15' is allowed to remain on the vertical side face. Subsequently, a CVD SiO2 film 17 is accumulated in a sufficiently thick film, the entire surface is etched to the surface of the mask 12, and the mask 12 is then removed. Then, an element isolating layer 19 having the film 18 which is projected from the surface of the substrate 11 is obtained. Thereafter, an n-channel MOSFET can be obtained by an ordinary method. According to this method, the channel cut layer is formed partly of entirely on the side face of the convex element region simply and with good controllability to isolate the element, thereby improving the reliability of a semiconductor device.,下面是Manufacture of semiconductor device专利的具体信息内容。

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