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Method of laminating one or more materials with a base structure for use in a high vacuum electron tube and method of masking the base preparatory to lamination

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专利汇可以提供Method of laminating one or more materials with a base structure for use in a high vacuum electron tube and method of masking the base preparatory to lamination专利检索,专利查询,专利分析的服务。并且A method of making a structure for use in a black and white or color Kinescope or the like, the structure being called a multichannel array and including a perforated channel type electron multiplier with two perpendicular sets of insulated conductive strips extending over rows and columns of the multiplier holes. The strips have holes in registration with the multiplier holes. Conductive strips and glass insulating layers are deposited using a photoresist layer with or without a transparent photographic film. The photoresist is exposed to light through the multiplier holes.,下面是Method of laminating one or more materials with a base structure for use in a high vacuum electron tube and method of masking the base preparatory to lamination专利的具体信息内容。

  • 2. The method of claim 1, wherein said photoresist layer includes a negative photoresist, said added layer being frit, said heating step being performed to raise the temperature of said frit sufficiently high to form a glaze and remove said exposed areas and film.
  • 3. The invention as defined in claim 2, wherein a further transparent film layer is fixed to said one side of said base over said glazed frit and holes and a positive photoresist layer is formed on said further transparent layer, said positive photoresist layer being exposed to light in an increased cross sectional area over and extending around and beyond said holes approximately normal to the axes of said holes, said increased area being produced by directing light from said other side of said base through said holes and layers and positioning light reflecting lens means over said positive photoresist layer.
  • 4. The invention as defined in claim 3, including washing away said increased area photoresist layer around said holes and depositing an added conductive metal layer onto said further transparent film in said increased area and over the remaining photoresist portion.
  • 5. The invention as defined in claim 4, wherein said added layer has a thickness substantially less than that of said remaining photoresist layer portion.
  • 6. The invention as defined in claim 5, including heating said base, glaze, further transparent film, positive photoresist and metal layers to decompose said film and photoresist and cause said metal layer on said film over said holes and remaining photoresist to break off from said base and to leave said holes open and said metal bonded to said base in positions around said holes and spaced apart from said metal around adjacent holes.
  • 7. The invention as defined in claim 6, including forming a further dielectric layer over said metal layer and between said holes, and forming conductive electrode strips over said further dielectric layer.
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