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Semiconductor device having many fold iv characteristics

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专利汇可以提供Semiconductor device having many fold iv characteristics专利检索,专利查询,专利分析的服务。并且A semiconductor diode having multiple Voltage characteristics and its method of fabrication is disclosed. When a voltage is applied in the forward direction to the diode, at some threshold, the current switches to a higher value of current. A decrease of the voltage causes a decrease in the current and, after a reverse voltage applied, reverse current values of increasing magnitude are obtained until a threshold is reached. When the threshold is reached, the diode switches from a high value of reverse current to a lower value of reverse current. A decrease in the reverse voltage to zero, reduces the current to zero and, increasing the voltage in the forward direction starts the above-described cycle over again. By adjusting the forward and reverse voltages, switching may occur at values higher than the thresholds and a family of voltage-current characteristics is obtained. A typical device consists of n-conductivity type gallium arsenide into which a region of deep centers has been diffused. A typical deep center of oxygen. A semiconductor junction which is alloyed, diffused or of the Schottky barrier type is formed with the deep center region. Where the junction formed is of the alloyed type, for example, an indium-zinc alloy may be used. Finally, an ohmic contact of gold-tin is applied to the semiconductor body. Forward voltages in the neighborhood of 1 volt provide switching in the forward direction while reverse voltages of as little as 3 volts cause switching in the reverse direction. A diode fabrication technique is also disclosed.,下面是Semiconductor device having many fold iv characteristics专利的具体信息内容。

  • 2. A semiconductor diode according to claim 1 further including an ohmic contact electrically coupled to said substrate.
  • 3. A semiconductor diode according to claim 1 wherein said semiconductor substrate is doped gallium arsenide.
  • 4. A semiconductor diode according to claim 1 wherein said semiconductor substrate is doped silicon.
  • 5. A semiconductor diode according to claim 1 wherein said semiconductor substrate is doped with an n-conductivity type dopant.
  • 6. A semiconductor diode according to claim 1 wherein said semiconductor substrate is doped with a p-conductivity type dopant.
  • 7. A semiconductor diode according to claim 1 wherein said deep centers are materials selected from the group consisting of oxygen and metal ions.
  • 8. A semiconductor diode according to claim 1 wherein said deep center is oxygen.
  • 9. A semiconductor diode according to claim 1 wherein said semiconductor junction is defined by an alloyed region of conductive material in said region.
  • 10. A semiconductor diode according to claim 1 wherein said semiconductor junction is defined by a diffused region of dopant in said region.
  • 11. A semiconductor diode according to claim 1 wherein said semiconductor junction is defined by a Schottky barrier forming conductive material disposed in contacting relationship with the surface of said region.
  • 12. A semiconductor diode according to claim 2 further including means for applying a voltage to said diode sufficient to cause said diode to switch between high and low resistance conditions.
  • 13. A semiconductor diode according to claim 2 wherein said ohmic contact is a conductive material selected from the group consisting of metals and alloys of said metals.
  • 14. A semiconductor diode according to claim 5 wherein said n-conductivity type dopant is one selected from the group consisting of tellurium, tin, selenium and sulphur.
  • 15. A semiconductor diode according to claim 6 wherein said p-conductivity type dopant is one selected from the group consisting of zinc and cadmium.
  • 16. A semiconductor diode according to claim 7 wherein said metal ions are elements selected from the group consisting of gold, iron, cobalt, zinc, manganese, copper and nickel.
  • 17. A semiconductor diode according to claim 9 wherein said conductive material is one selected from the group consisting of zinc, cadmium, tin, tellurium, selenium containing alloys and sulphur containing alloys.
  • 18. A semiconductor diode according to claim 10 wherein said dopant is one selected from the group consisting of N-conductivity and p-conductivity type dopants.
  • 19. A semiconductor diode according to claim 11 wherein said Schottky barrier forming conductive material is one selected from the group consisting of platinum, gold, silver molybdenum and palladium.
  • 20. A semiconductor diode according to claim 12 wherein said means for applying a voltage includes means for applying a voltage in the forward direction to said diode until the current attained switches to a higher value of current.
  • 21. A semiconductor diode according to claim 12 wherein said means for applying a voltage includes means for applying a voltage in the reverse direction to said diode until the current attained switches to a lower value of current.
  • 22. A semiconductor diode which exhibits multiple current-voltage (IV) characteristics comprising: a doped semiconductor substrate, a region containing deep centers disposed in said substrate, the concentration of said deep centers being highest near said substrate surface, a semiconductor junction having a space charge region associated with it electrically coupled to said region and said highest concentration of deep centers being substantially coincident, an ohmic contact electrically connected to said substrate, and means connected to said junction and said ohmic contact to switch said diode between high and low resistance conditions.
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