Microwave hermetic transistor package专利检索-带状线电缆，导体和接线专利检索查询-专利查询网

Microwave hermetic transistor package

阅读：762发布：2023-01-05

专利汇可以提供Microwave hermetic transistor package专利检索，专利查询，专利分析的服务。并且A ceramic stripline structure having an input stripline and an output stripline is mounted upon an electrically and thermally conductive base structure for attachment to a heat sink. A hollow ceramic cylinder is bonded at one end to the base structure in surrounding relation to the stripline structure. The ceramic cylinder is slotted on opposite sides for passage of input and output strip conductive leads therethrough for connection to the input and output striplines within the package. The input and output strip conductive leads are hermetically sealed to the ceramic cylinder. A transistor die is mounted over the stripline structure and a Kovar metal cap is hermetically sealed over the end of the ceramic cylinder to provide a hermetically sealed all ceramic-to-metal transistor package.，下面是Microwave hermetic transistor package专利的具体信息内容。

权利要求

1. In a transistor package, an electrically conductive base structure for attachment to a heat sink structure, a hollow ceramic cylinder bonded at a first end to and upstanding from said conductive base structure, said ceramic cylinder being transversely slotted at circumferentially spaced points intermediate the length of said cylinder to define first and second elongated transverse slots through said cylinder, said cylinder having elongated first and second lip portions entirely encircling said respective first and second slots, input and output strip conductive leads passing through said respective transverse slots in said ceramic cylinder, and means hermetically sealing said strip leads to said lip portions of said ceramic cylinder.

2. The apparatus of claim 1 including a metalized ceramic mounting wafer bonded to said electrically conductive base structure, a solid dielectric filled stripline means bonded to a major face of said mounting wafer, said stripline means including an input conductor and an output conductor and a common conductor underlaying both said input and output conductors, said input and output conductors being spaced apart at their inner ends to define an elongated gap therebetween, an electrically conductive common terminal strip disposed in said gap and upstanding from said common conductor through an aperture in said solid dielectric fill of said stripline means, said input and output conductive leads being bonded at their inner ends to said input and output conductors, respectively, of said stripline means.

3. The apparatus of claim 1 including electrically conductive cover means hermetically sealed over and closing off the second end of said ceramic cylinder.

4. The apparatus of claim 1 wherein said means for hermetically sealing said strip leads to said ceramic cylinder includes metalized surface regions of said cylinder extending around said lips of said slots in said cylinder, and means for bonding said strip leads to said metalized lip region of said slots in said cylinder.

5. The apparatus of claim 3 therein said cover means for closing off the second end of said cylinder includes a metallic cap bonded to a metalized lip of said ceramic cylinder.

6. In a transistor package, an electrically conductive base structure for attachment to a heat sink structure, a hollow ceramic cylinder bonded at a first end to and upstanding from said conductive base structure, said ceramic cylinder being slotted at circumferentially spaced points, input and output strip conductive leads passing through said respective slots in said ceramic cylinder, means hermetically sealing said strip leads to said ceramic cylinder, said means for hermetically sealing said strip leads to said ceramic cylinder including, metallized surface regions of said cylinder extending around the lip of said slots in said cylinder, means for bonding said strip leads to said metallized lip region of said slots in said cylindEr, and at least one metallized strip disposed on and extending axially of said ceramic cylinder for electrically connecting said metallic cap to said electrically conductive base structure for operating said cap at the same dc potential as said base structure.

7. The apparatus of claim 2 wherein said solid dielectric filled stripline includes, a ceramic wafer having said input and output conductors metalized onto a major face thereof, said wafer having an elongated slot therethrough in the gap region thereof between the opposed inner ends of said metalized input and output conductors, said common conductor of said stripline means comprising a metalized layer on a second major face of said wafer which is opposed to and underlaying said first major face, and wherein said common conductor terminal strip is disposed in said elongated slot in said wafer.

8. The apparatus of claim 2 including transistor die means mounted overlaying said stripline means and having a collector electrode structure, and means for connecting said collector electrode structure of said die to said output strip conductor.

9. The apparatus of claim 1 wherein said base structure includes a shoulder portion extending around the periphery of said base structure, and wherein said first end of said ceramic cylinder is metalized and bonded to said shoulder portion of said base structure.

说明书全文

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Microwave hermetic transistor package

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