Machine for cleaning semiconductive wafers专利检索-集成电路卡集成电路专利检索查询-专利查询网

Machine for cleaning semiconductive wafers

阅读：567发布：2023-12-18

专利汇可以提供Machine for cleaning semiconductive wafers专利检索，专利查询，专利分析的服务。并且An automatic production machine useful in the fabrication of integrated circuits for coating semiconductive wafers and microelectric substrates with photosensitive films. The machine is provided with a multi-deck spinner including a motor-driven turntable having a vertical stack of vacuum chucks mounted thereabove. The chucks are supported one above the other and are cantilevered from two parallel pipes extending upwardly from the rim of the turntable. Each chuck serves as a deck for supporting a wafer to be coated by centrifugal action. One pipe functions as a vacuum line manifold communicating with a pattern of grooves formed on the upper face of each chuck to hold the wafer thereto. The other pipe functions as a treatment line manifold to supply gas or a cleaning solvent to a port on the undersurface of each chuck, whereby the gas or solvent is dispensed onto the exposed surface of the wafer on the chuck therebelow.，下面是Machine for cleaning semiconductive wafers专利的具体信息内容。

权利要求

1. A machine for treating wafers and micro-electronic substrates in the fabrication of integrated circuits, transistors and diodes, said machine comprising: A. a spinner assembly including a turntable having a vertical stack of vacuum chucks mounted thereabove, each chuck including a vacuum duct leading to grooves in the upper face thereof to hold a wafer thereto, and a treatment duct leading to a port in the under face thereof for dispensing gas and cleaning solvent onto the wafer on the chuck therebelow, and B. a motor system to drive said spinner assembly.

2. A machine as set forth in claim 1, wherein said chucks are cantilevered from a pair of pipes extending upwardly from the rim of said turntable, one pipe serving as a vacuum line manifold, and having holes communicating with the vacuum ducts of said chucks, said second pipe serving as a treatment line manifold having holes communicating with the treatment ducts of said chucks.

3. A machine as set forth in claim 1, wherein each chuck is provided with a pattern of grooves defined by a spiral groove on the upper face thereof, interrupted by radial grooves.

4. A machine as set forth in claim 2, wherein each chuck is constituted by a circular platform for supporting a wafer to be coated, the center of said platform being in line with the axis of rotation of the turntable, said platform having a rectangular apron provided with bores through which said pipes extend.

5. A machine as set forth in claim 2, wherein said assembly is provided with a cover plate maching said turntable and having a hollow shaft coupled by a rotary seal to a solvent or gas source, said hollow shaft being coupled by a duct extending through said plate to said treatment pipe.

6. A machine as set forth in claim 2, wherein said turntable is provided with a hollow spindle coupled by a rotary seal to a vacuum pump, said hollow spindle being coupled by a duct passing through said turntable to said vacuum manifold pipe.

7. A machine as set forth in claim 1, wherein said motor system includes a motor having a flywheel mounted on the shaft thereof, a clutch for operatively coupling said flywheel to said turntable, and a motor control circuit to operate said motor at a speed above normal speed before the clutch is activated.

8. A machine as set forth in claim 7, further including a brake interposed between said clutch and said turntable.

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Machine for cleaning semiconductive wafers

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