Lead wireless integrated circuit package
专利汇可以提供Lead wireless integrated circuit package专利检索，专利查询，专利分析的服务。并且PURPOSE: To raise the reliability of solder-connected part, by connecting an integrated circuit and a wiring conductor on a base board to each other through solder filled in a perforated hole of the substrate.
CONSTITUTION: A plurality of independent wiring conductors 9a, 9b, which are to be external connection terminals, are provided on the surface of an insulating board 8. Conductor layers 9a', 9b' are provided on the inside surfaces of holes 10a, 10b perforated through the ends of the conductors 9a, 9b. The obverse and the reverse conductor layers are connected to each other. An integrated circuit chip 11 is placed on the board. The connection terminals of the chip 11 are connected to the wiring conductors 9a, 9b and coated with a resin 12 resistant to humidity and heat. Solder pieces 15a, 15b are filled in the perforated holes of the base board and connected to wiring conductors 14a, 14b on a printed circuit board 13. Firm soldering connection is thus effected. Since the solder pieces are sucked into the holes in the soldering, short-circuit defects are reduced and each solder-connected part does not snap.
COPYRIGHT: (C)1980,JPO&Japio，下面是Lead wireless integrated circuit package专利的具体信息内容。
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