Manufacturing of composite hybrid integrated circuit
专利汇可以提供Manufacturing of composite hybrid integrated circuit专利检索，专利查询，专利分析的服务。并且PURPOSE:To enhance the cost performance of a beam lead for a composite hybrid integrated circuit by forming a multilayer external connection lead wires of the integrated circuit formed on a substrate at the end insulator of the substrate and selectively removing the film between the substrate and the end to isolate the lead wire from the substrate and removing the end of the substrate. CONSTITUTION:A glass layer 2 is formed on an alumina substrate 1, a heating resistor 3, a conductive lead wire bonding layer 3 and a conductor lead wire 5 are formed thereon, anc coated with a protective film 6. A snap wire 11 is formed in parallel with the end surface of the resistor 3 on the back surface of the substrate 1. Then, a resist 7 is coated on the portion except the end of the lead wire 5, and only the bonding layer 4 is selectively etched to isolate the end of the lead wire from the substrate to remove the resist 7. Thereafter, when the substrate 1 and the glass layer 2 are destroyed along the snap line, a beam lead wire projected from the end of the substrate can be obtained. Thus, the beam lead wire extended from the end of the substrate is formed at the substrate to connect the hybrid integrated circuit.，下面是Manufacturing of composite hybrid integrated circuit专利的具体信息内容。
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