Manufacture of solder ribbon
专利汇可以提供Manufacture of solder ribbon专利检索，专利查询，专利分析的服务。并且PURPOSE: To improve the wettability, corrosion resistance, etc., of a solder ribbon by forming a solder thin piece with a liquid rapid cooling method and performing a cold extrusion after performing a cold press by collecting the thin piece.
CONSTITUTION: The molten alloy (m) having the scheduled composition is prepared, poured into a crucible 1 and injected on the surface of the roll 3 which rotates at high speed to form a very thin and discontinuous solder piece. This thin solder piece is filled up in the container for cold press with its collection and solidified by being pressed with the pressure of a ram. Then, after extruding the solidified material and filling it up in the container for cold press, a solder ribbon is formed with its extrusion from the extruding hole of a die by adding a pressure. The Cu component added into the solder is attained to a very fine grain and uniformly dispersed and due to there being no segregation thereof the wettability, flowing property and corrosion resistance of the solder ribbon are improved.
COPYRIGHT: (C)1988,JPO&Japio，下面是Manufacture of solder ribbon专利的具体信息内容。
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