Radiation-curable pressure-sensitive adhesive composition
专利汇可以提供Radiation-curable pressure-sensitive adhesive composition专利检索，专利查询，专利分析的服务。并且PURPOSE: To obtain titled composition of high adhesivity and cohesivity, also with both characteristics adequately balanced each other, by incorporating a non-solvent type radiation-curable liquid oligomer with a specific amount of a tackifier having radiation-polymerizable unsaturated double bond.
CONSTITUTION: The objective composition can be obtained by incorporating (A) a virtually non-solvent type radiation-curable liquid oligomer [pref. with a molecular weight of 1,000W50,000 and a viscosity of 10
2 W10
5 cps at 30°C; e.g., an acrylic oligomer with its unsaturated double bond present in the side chain or at the terminal (for example, a polyester acrylate)] with (B) 1W4wt% of a tackifier having radiation-polymerizable unsaturated double bond [e.g., prepared by adding an unsaturated double bond-carrying monomer such as glycidyl (meth) acrylate to a resin having active hydrogen as a functional group (for example, gum rosin)]. When carrying out a radiation polymerization, it is recommended to apply an electron beam irradiation with a dose of 0.5W20Mrad.
USE: Pressure-sensitive adhesive tapes and sheets.
COPYRIGHT: (C)1984,JPO&Japio，下面是Radiation-curable pressure-sensitive adhesive composition专利的具体信息内容。
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