Bonding method of wood
专利汇可以提供Bonding method of wood专利检索，专利查询，专利分析的服务。并且PURPOSE: To bond wooden materials regardless of uneveness in thickness and the precision of the surfaces of the wooden materials, by a method wherein the wooden materials are laminated on each other by using an aq. adhesive contg. a thermally expandable microsphere, and the laminate is heated on the way of curing.
CONSTITUTION: When wooden materials or composite materials with wooden material are bonded to each other, said materials are laminated on each other by using an aq. adhesive consisting of an aminoplast, a phenolic resin, PVAc or a copolymer emulsion thereof or a mixture thereof, to which 1W15wt% (based on the weight of the solid of the adhesive) thermally expandable microsphere is added. Then the laminate is cured under heating by a hot press, a high-frequency press, a low-frequency press or a microwave press. Since the materials can be bonded to each other regardless of uneveness in thickness and the precision of the surfaces of materials to be bonded, it is not required to consider so much the precision of the surfaces of the materials to be bonded, though usually it has been necessary to pay close attention to the precision of the surface.
COPYRIGHT: (C)1981,JPO&Japio，下面是Bonding method of wood专利的具体信息内容。
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