USE OF HARDENERS/DENSIFIERS IN CUTTING OR OTHERWISE REMOVING MATERIAL FROM INORGANIC SUBSTRATES |
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| 申请号 | US14600995 | 申请日 | 2015-01-20 | 公开(公告)号 | US20150202652A1 | 公开(公告)日 | 2015-07-23 |
| 申请人 | Arris Technologies, LLC; | 发明人 | Dal N. Hills; Kason Hills; | ||||
| 摘要 | A method for cutting or otherwise removing material from an inorganic substrate (e.g., a substrate formed from a cementitious material, such as concrete, or stone, etc.) includes applying an aqueous solution that includes a hardener/densifier to the inorganic substrate and/or to a removal element (e.g., a saw blade, an abrasive wheel, a grinding disk, etc.), the inorganic substrate or material removed from the inorganic substrate as the removal element removes material from the inorganic substrate. A system for removing material from an inorganic substrate includes a removal element and an aqueous solution that includes a hardener/densifier. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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