Conductive paste and glass article |
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| 申请号 | US15480641 | 申请日 | 2017-04-06 | 公开(公告)号 | US10029542B2 | 公开(公告)日 | 2018-07-24 |
| 申请人 | Murata Manufacturing Co., Ltd.; | 发明人 | Shinichi Tsugimoto; | ||||
| 摘要 | A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder is a mixed powder of an atomized powder prepared by an atomization method and a wet reduced powder prepared by a wet reduction method and the conductive powder contains the atomized powder in the range of 5 to 40 wt %. The atomized powder is 5.2 to 9 μm in average particle size and the content of a chlorine component mixed in the conductive powder is 42 ppm or less. The conductive paste is applied in the form of a line onto a glass substrate 1 and subjected to firing to form conductive films. This conductive paste can prevent glass substrates from undergoing color changes and prevent base layers for conductive films from having structural defects such as cracks. | ||||||
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| 说明书全文 | |||||||
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