LOW TEMPERATURE HIGH RELIABILITY TIN ALLOY FOR SOLDERING |
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| 申请号 | PCT/GB2015052036 | 申请日 | 2015-07-15 | 公开(公告)号 | WO2016012754A3 | 公开(公告)日 | 2016-05-06 |
| 申请人 | ALPHA METALS; SETNA ROHAN P; | 发明人 | CHOUDHURY PRITHA; DE AVILA RIBAS MORGANA; MUKHERJEE SUTAPA; SARKAR SIULI; PANDHER RANJIT; BHATKAL RAVINDRA; SINGH BAWA; | ||||
| 摘要 | A lead-free, antimony-free solder alloy comprising: (a) from 1 to 4 wt.% silver (b) from 0.5 to 6 wt.% bismuth (c) from 3.55 to 15 wt.% indium (d) 3 wt.% or less of copper (e) optionally one or more of the following elements 0 to 1 wt.% nickel 0 to 1 wt.% of titanium 0 to 1 wt.% manganese 0 to 1 wt.% of rare earths, such as cerium 0 to 1 wt.% of chromium 0 to 1 wt.% germanium 0 to 1 wt.% of gallium 0 to 1 wt.% of cobalt 0 to 1 wt.% of iron 0 to 1 wt.% of aluminum 0 to 1 wt.% of phosphorus 0 to 1 wt.% of gold 0 to 1 wt.% of tellurium 0 to 1 wt.% of selenium 0 to 1 wt.% of calcium 0 to 1 wt.% of vanadium 0 to 1 wt.% of molybdenum 0 to 1 wt.% of platinum 0 to 1 wt.% of magnesium (f) the balance tin, together with any unavoidable impurities. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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