| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 181 | Ceramic composition and ceramic circuit board | US28219 | 1993-03-09 | US5342674A | 1994-08-30 | Hirayoshi Tanei; Shoichi Iwanaga |
| A ceramic composition comprising 55-70 vol % of a borosilicate glass consisting of 65-88 wt % of SiO.sub.2, 5-25 wt % of B.sub.2 O.sub.3, 1-5 wt % of one or more of Li.sub.2 O, K.sub.2 O and Na.sub.2 O, and 0-5 wt % of Al.sub.2 O.sub.3, 5-30 vol % of alumina as filler, 5-35 vol % of cordierite and 0-20 vol % of quartz glass is provided for a ceramic circuit board for an electronic device such as an electronic computer. | ||||||
| 182 | Suppression of crystal growth in low dielectric inorganic composition using ultrafine alumina | US804069 | 1991-12-09 | US5316985A | 1994-05-31 | Jau-Ho Jean; Tapan K. Gupta |
| A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 5.0 and a TCE of 2.0-4.0 ppm/c. The composition is formed from a mixture comprising 25-50 weight percent of a low temperature glass selected from the group consisting of borosilicate glass, zinc borate glass and combinations thereof, 50-75 weight percent of a high temperature glass selected from the group consisting of high silica glass, titanium silicate glass and combinations thereof, and 1-10 weight percent of ceramic material having a particle size of less than about 3 microns. The mixture can be combined with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium. A preferred ceramic material is colloidal alumina. | ||||||
| 183 | Sealing glass composite | US812300 | 1991-12-23 | US5284706A | 1994-02-08 | Brien E. O'Donnelly |
| There is provided a sealing glass composite which has a desired coefficient of thermal expansion. The composite is made up of a glass matrix having a first coefficient of thermal expansion and a substantially spherical particulate additive with a second coefficient of thermal expansion dispersed within the matrix. Use of a substantially spherical particulate additive having a reduced surface area as compared to other shaped particulate additive minimizes the reaction between the additive and the glass matrix. The spherical particles also provide better flow at high loading factors and improved fracture toughness. | ||||||
| 184 | Aluminum borate devitrification inhibitor in low dielectric borosilicate glass | US949154 | 1992-09-23 | US5270268A | 1993-12-14 | Jau-Ho Jean; Tapan K. Gupta |
| A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 5.5 and a TCE of less than about 3.5 ppm/.degree.C. The composition comprises a mixture of finely divided particles of 20-80 vol. % borosilicate glass and 20-80 vol. % of Al.sub.x B.sub.y O.sub.z wherein x is in the range of 4 to 22, y is in the range of 2 to 5, and z is in the range of 9 to 36. The Al.sub.x B.sub.y O.sub.z inhibits the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium. | ||||||
| 185 | Method of coating superconductors with inorganic insulation | US171502 | 1988-03-10 | US5246729A | 1993-09-21 | Tapan K. Gupta; George J. Bich; William N. Lawless |
| The composite insulation coating consists of a mixture of glass and ceramic oxide(s), coated onto a wire by conventional wire enameling techniques followed by heat treatment at 600.degree.-850.degree. C. The enamel when initially applied, the "green" coat slurry, consists of four components: (1) the glass, (2) an inorganic filler (ceramic oxide powder, (3) an organic binder and (4) an organic solvent. The glasses can be selected from several commercial glasses (Corning 7570 and 7050) as well as Westinghouse glasses A-508, M 3072 and M 3073. None of these glasses contain lead or boron, allowing for nuclear applications. Suitable ceramic fillers are alumina, and the CeramPhysics, Inc. ceramics SC1C and SC1A. Organic binder materials and solvents are used. It is preferable that a copper wire to be coated with Ni, Inconel or Cr prior to coating with the subject insulation. For superconductors, the brittle nature of Nb.sub.3 Sn wire and the high reaction temperature (.about.700.degree. C.) required to form it preclude the use of standard organic insulation systems. The inorganic insulation with SC1C and SC1A ceramics, characterized by unusually high specific heats and thermal conductivities at cryogenic temperatures, offers the opportunity of providing increased enthalpy stabilization in a superconducting winding. The glass and ceramic is chosen so that the vitrification temperature of the composite coincides with the reaction temperature of 600.degree.-800 .degree. C. The most successful glasses meeting this criterion are A-508 and M3072. | ||||||
| 186 | Coating for protecting a carbon-carbon composite from oxidative degradation | US42090 | 1987-04-24 | US5225283A | 1993-07-06 | Roger Y. Leung; Bryan A. Weyneth |
| A process for forming a high temperature oxidation resistant coating on a carbon-carbon composite is disclosed and claimed. The process comprises applying a cyclosiloxane monomer blend containing a filler such as silicon carbide to a carbon-carbon composite, polymerizing and pyrolyzing said blend to form a filled black glass protective coating on the carbon-carbon composite. | ||||||
| 187 | Metaphosphate glass composition | US465403 | 1990-01-16 | US5196381A | 1993-03-23 | Yung-Haw Hu; Michael A. Saltzberg; Robert D. Shannon |
| A low-K crystallizable glass composition having a softening point of 550.degree.-800.degree. C., consisting essentially of mole % of:41-70% P.sub.2 O.sub.5 ;10-48% MgO, ZnO or mixtures thereof;2-20% Al.sub.2 O.sub.3, Cr.sub.2 O.sub.3 or mixtures thereof;0-10% alkali metal oxide(s);0-10% CaO, SrO, BaO or mixtures thereof;0-10% SiO.sub.2 ;0-20% B.sub.2 O.sub.3 ;0-10% ZrO.sub.2, TiO.sub.2 or mixtures thereof; and0-10% Fe.sub.2 O.sub.3, with the provisos that:(i) a=n(b+3c+d+e+2f+3g), wherein n=0.8-1.0, anda=mole % P.sub.2 O.sub.5 ;b=mole % MgO, ZnO or mixtures thereof;c=mole % Al.sub.2 O.sub.3, Cr.sub.2 O.sub.3 or mixtures thereof;d=mole % M.sub.2 O, where M=Na, K, Rb, Cse=mole % M'O, where M'=Ca, Sr, Baf=mole % ZrO.sub.2, TiO.sub.2 or mixtures thereof;g=mole % Fe.sub.2 O.sub.3, (where Ln is any of the rare earth elements), or mixtures thereof;(ii) the total amount of alkali oxides, CaO, SrO, and BaO does not exceed 10 mole %;(iii) the total amount of ZrO.sub.2, TiO.sub.2, and Fe.sub.2 O.sub.3 does not exceed 10 mole %. | ||||||
| 188 | Zirconia toughening of glass-ceramic materials | US626370 | 1991-02-26 | US5185215A | 1993-02-09 | Richard W. Adams, Jr.; David R. Clarke; Sarah H. Knickerbocker; Linda L. Rapp; Bernard Schwartz |
| A ceramic material suitable for packaging of large scale integrated circuit is produced by the process of forming a mixture of a powdered glass ceramic material which is a glassy precursor to cordierite ceramic material, formed by the steps which are as follows:a. Mix tetragonal phase material selected from the group consisting of zirconia or hafnia powder containing a stabilizing oxide compound selected from the group consisting of MgO, CaO and Y.sub.2 O.sub.3 and a glass frit powder or frit of a glassy precursor of cordierite glass ceramic to yield a suspension of solids. Preferably, a binder is included.b. Disperse the suspended solids to yield a dispersion of the zirconia or hafnia with the stabilizing oxide compound and the glassy precursor.c. Densify the dispersion of zirconia or hafnia with the stabilizing oxide compound and the glassy precursor by a sintering heat treatment at a temperature of about 840.degree. C. to melt the glassy precursor into a viscous fluid at a temperature below the melting point of the zirconia or hafnia powder particles to yield a densfied intermediate material with the zirconia or hafnia particles encapsulated in the molden glassy precursor.d. Crystallize the densified intermediate material into a polycrystalline composite by heating at 900.degree. C. to 950.degree. C.The process yields a ceramic material consisting of the tetragonal phase material encapsulated in crystalline cordierite glass ceramic material. | ||||||
| 189 | Process for fabricating a multilayer ceramic circuit board | US589215 | 1990-09-28 | US5176772A | 1993-01-05 | Shiro Ohtaki |
| A process for fabricating a multilayer ceramic circuit board which includes the steps of (i) providing a sintered ceramic substrate having optionally formed via holes already filled with a conductive paste or a conductive substance, (ii) optionally applying an insulating paste layer in a prescribed pattern on one side or each side of the ceramic substrate, (iii) then, providing a ceramic green tape and forming via holes in the green tape, (iv) applying a conductive paste to form a conductive pattern on one side of the green tape, (v) laminating the green tape to one side or each side of the ceramic substrate so that the conductive pattern of the green tape faces the substrate, (vi) optionally pressing and heating the laminate from step (v), and (vii) applying a conductive paste to form a conductive pattern on the other side of the green tape and filling the via holes of the green tape with a conductive paste, before or after step (v). | ||||||
| 190 | Low-temperature baked substrate | US303374 | 1989-01-30 | US5175130A | 1992-12-29 | Kazuo Kondo; Asao Morikawa |
| A substrate having a low dielectric constant for use with electronic devices consisting essentially of porous crystalline glass. The composition of the crystalline glass is represented by the formula X-Al.sub.2 O.sub.3 -SiO.sub.2, where X is one or more of the metal oxides ZnO, MgO, Li.sub.2 O, ZrO.sub.2, B.sub.2 O.sub.3, P.sub.2 O.sub.5, Y.sub.2 O.sub.3 and BaO. The crystalline glass may also include a filler material such as a ceramic powder or non-glass material. The substrate initially has a particle size of approximately 5 microns or less, which provides a high mechanical strength to the substrate even at high porosities. | ||||||
| 191 | Multi-layer coatings for reinforcements in high temperature composites | US453512 | 1989-12-20 | US5156912A | 1992-10-20 | D. Lukco; M. A. Tenhover |
| The subject invention relates to a coated reinforcement material comprising a SiC reinforcement having a coating of at least three layers, wherein the layers are alternately A-material layers of the general formula:Al.sub.x O.sub.y N.sub.zwherein x is up to about 60 atomic % of the coating;y is from about 20 atomic % to about 55 atomic % of the coating; andz is from about 5 atomic % to about 45 atomic % of the coating, with the proviso that x+y+z=100, and B-material layers comprising a metal alloy, such that the first and last layers of the coating are A-material layers. The invention further relates to a high strength, high temperature performance composite containing the above-specified coated reinforcement. | ||||||
| 192 | Process of oxidizing aliphatic hydrocarbons employing a molybdate catalyst composition | US505751 | 1990-04-06 | US5146031A | 1992-09-08 | Bijan Khazai; G. Edwin Vrieland; Craig B. Murchison; Ravi S. Dixit; Edwin D. Weihl |
| A process for the production of olefins and diolefins, such as 1,3-butadiene, comprising contacting an aliphatic hydrocarbon, such as butane, with a heterogeneous catalyst composition containing reactive oxygen under reaction conditions such that a more highly unsaturated aliphatic hydrocarbon is selectively formed in a high productivity. The catalyst is a composition comprising (a) a support component of magnesia and alumina and/or magnesium aluminate spinel, and (b) a catalyst component of magnesia, an oxide of molybdenum, a Group IA metal oxide promoter, and optionally vanadium oxide. Catalysts of high surface area and high attrition resistance are claimed. | ||||||
| 193 | Alumina-zirconia ceramic | US583663 | 1990-09-17 | USRE34028E | 1992-08-11 | William R. Manning |
| A ceramic consisting essentially of from 1 to 15 percent of glass and 99 to 85 percent of a mixture of particulate Al.sub.2 O.sub.3 and particulate ZrO.sub.2 is disclosed. ZrO.sub.2 is present in a sufficient amount, usually from 1/4 to 6 percent based on the weight of the ZrO.sub.2 and Al.sub.2 O.sub.3, to strengthen the ceramic significantly, by comparison with an otherwise identical ceramic where the particulate ZrO.sub.2 is replaced either by the glass or by particulate Al.sub.2 O.sub.3. The glass constitutes a vitreous phase bonding the particulates into a dense, gas impervious structure, and can be a calcium magnesium silicate glass containing from 45 to 80 percent of SiO.sub.2, from 8 to 55 percent of CaO and MgO, and not more than 15 percent of Al.sub.2 O.sub.3. | ||||||
| 194 | Glassy binder system for ceramic substrates, thick films and the like | US437788 | 1989-11-08 | US5126292A | 1992-06-30 | Douglas M. Mattox |
| A ceramic material for electronic circuit devices is sintered at less thanr equal to 1000.degree. C. temperature. A filler material such as quartz and a glassy binder RO-Al.sub.2 O.sub.3 -B.sub.2 O.sub.3 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, CaO, SrO, BaO, ZnO or CdO and the glassy binders form no more than 40 vol % of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications. | ||||||
| 195 | Glass-ceramic-bonded ceramic composites | US639196 | 1991-01-09 | US5112777A | 1992-05-12 | John F. MacDowell |
| This invention is particularly directed to the production of glass-ceramics specifically designed for bonding hard refractory particulate ceramics into dense, mechanically strong composite bodies. The inventive glass-ceramics are crystallized in situ from divalent metal borate glasses. The invention is particularly drawn to composite articles where Al.sub.2 O.sub.3 particles comprise the hard refractory ceramic and the inventive glasses react therewith to form an exceptionally strong bond therebetween accompanied with the development of divalent metal aluminoborate crystals. | ||||||
| 196 | Chemically stabilized cristobalite | US606079 | 1990-10-22 | US5096857A | 1992-03-17 | Yung-Haw Hu; Michael A. Saltzeberg |
| A crystalline composition having an X-ray diffraction pattern essentially the same as the high cristobalite form of silica comprising SiO.sub.2, Al.sub.2 O.sub.3 and a metal oxide (Me.sub.x O) in which Me is selected from Na, Ca, Sr and mixtures thereof. | ||||||
| 197 | Composite thermal barrier coating | US560926 | 1990-07-31 | US5080977A | 1992-01-14 | Isidor Zaplatynsky |
| A composite thermal barrier coating for a substrate has a first layer including a first ceramic material and a second layer including a second ceramic material impregnated with a glass, the glass being a ternary eutectic. The glass may consist of about 14.6 weight percent Al.sub.2 O.sub.3, about 23.3 weight percent CaO, and about 62.1 weight percent SiO.sub.2. The first and second ceramic materials may include yttria-stabilized zirconia. | ||||||
| 198 | Low dielectric constant ceramic materials | US195569 | 1988-05-17 | US5068210A | 1991-11-26 | John F. DiLazzaro; James L. McAlpin; Joanne R. Mark |
| A dense, sintered ceramic material having a low dielectric constant, a low firing temperature, and a low coefficient of thermal expansion is provided from a mixture of 0-30 wt. % alumina, 30-60 wt. % fused silica, and 30-70 wt. % of a glass comprised of PbO, B.sub.2 O.sub.3, and SiO.sub.2. The mixture has a minimum sintering temperature in the range of 800.degree.-900.degree. C., and can be formed by conventional manufacturing techniques. It is particularly useful for the fabrication of single or multilayer electronic circuit substrates. | ||||||
| 199 | Aluminum oxide ceramics having improved mechanical properties | US386549 | 1989-07-27 | US5053370A | 1991-10-01 | Philip L. Berneburg |
| A wear-resistant alumina material is disclosed, as is its preparation by liquid phase sintering a mixture of about 70 to 95 percent by weight of crystalline Al.sub.2 O.sub.3 particles and about 30 to 5 percent by weight of glass phase-forming components in a nitrogenizing atmosphere from which oxygen is substantially excluded. Generally, the resulting material has a 5 Kg Vickers hardness which is at least about 5 percent greater than the hardness of a corresponding alumina material sintered in air. | ||||||
| 200 | Surface strengthened composite ceramic material | US186998 | 1988-04-27 | US5047374A | 1991-09-10 | Patrick S. Nicholson; Fred F. Lange; Thomas Troczynski |
| A surface-strengthened composite ceramic material has a ceramic matrix and a refractory phase dispersed at least in and close to the surface of the matrix. The refractory phase includes beta-alumina particles in which larger cations producing a larger molar volume replace sufficient smaller cations in beta-alumina particles in and close to the surface of the composite ceramic material to cause compressive surface stresses which increase the surface strength of the composite ceramic material. The smaller cations are replaced by the larger cations after firing of the composite ceramic material. | ||||||
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