子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 181 | METHOD OF MANUFACTURING DEVELOPER CONTAINER, DEVELOPER CONTAINER, DEVELOPING APPARATUS, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS | US14322091 | 2014-07-02 | US20150016829A1 | 2015-01-15 | Taku Watanabe; Masahito Kato; Go Shindo; Atsushi Toda; Katsuichi Abe; Motonari Ito; Akira Suzuki; Junichi Matsumura; Naoki Matsumaru |
| A method of manufacturing a developer container including a frame configured to define a developer containing portion, a first electrode, and a second electrode arranged on a surface of the frame and having a surface opposed to the first electrode, a developer amount in the developer containing portion being detected based on a capacitance between the first electrode and the second electrode, the method including: holding a conductive resin member constituting the second electrode on a mold configured to mold the frame, a surface of the conductive resin member being in contact with a surface of the mold configured to mold a surface of the frame on a side of the developer containing portion; injecting a resin to be formed into the frame, into the mold on which the conductive resin member is held; and curing the resin to form the frame to which the second electrode is fixed. | ||||||
| 182 | APPARATUS AND METHOD FOR MULTI-BEAM DIRECT ENGRAVING OF ELASTOMERIC PRINTING PLATES AND SLEEVES | US14201848 | 2014-03-08 | US20140327185A1 | 2014-11-06 | Wolfgang Sievers |
| Described herein are an apparatus and a method for direct engraving an elastomeric printing plate by multiple laser beams simultaneously. In one embodiment, an elastomeric printing plate or sleeve is positioned on an imaging drum for direct engraving. The imaging drum is rotatable around its longitudinal axis. Such rotation defines a circumferential direction, also called the transverse direction. The axis of rotation defines an axial direction, also called the longitudinal direction. The printing plate has an body and a surface made of an elastomer (made of polymer or rubber). A drive mechanism provides relative motion between a plurality of laser beams and the plate in both the transverse and longitudinal directions. | ||||||
| 183 | PROCESSING AND APPLICATION OF LIQUID EPOXY ADHESIVE FOR PRINTHEAD STRUCTURES INTERSTITIAL BONDING IN HIGH DENSITY PIEZO PRINTHEADS FABRICATION | US13854583 | 2013-04-01 | US20140292930A1 | 2014-10-02 | Yanjia Zuo; Pratima Gattu Naga Rao; Mandakini Kanungo; Hong Zhao; Mark A. Cellura; Robertha Caroline Howell; Santokh S. Badesha; John R. Andrews |
| A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight, swell, and/or oxidize when exposed to certain inks such as ultraviolet inks and pigmented inks. An embodiment of the present teachings can include processing of an adhesive including a processes a particular adhesive comprising a cresol novolac resin and a dicydiandiamide curing agent using a particular process, such that the resulting epoxy adhesive is suitable for printhead applications. | ||||||
| 184 | METHOD FOR MANUFACTURING LIQUID JETTING APPARATUS, METHOD FOR MANUFACTURING NOZZLE PLATE, AND LIQUID DROPLET JETTING APPARATUS | US13848785 | 2013-03-22 | US20140085380A1 | 2014-03-27 | Jin UNO |
| There is provided a method of manufacturing liquid jetting apparatus which includes a nozzle plate in which a nozzle configured to jet a liquid is formed, and a channel structure in which a liquid channel communicating with the nozzle is formed. The method of manufacturing liquid jetting apparatus includes, removing a part of a metal layer of a stacked body in which a resin layer and the metal layer are stacked without intervening an adhesive, to expose the resin layer partially, forming the nozzle in the resin layer such that, the nozzle opens in an area exposed through the metal layer, and joining the stacked body which is to be the nozzle plate in a case that the nozzle is formed, to the channel structure. | ||||||
| 185 | METHOD OF MANUFACTURING A BELT MEMBER AND THE BELT MEMBER | US13792991 | 2013-03-11 | US20130224484A1 | 2013-08-29 | Hiroshi Tominaga |
| A tube material is formed by continuously extruding a thermoplastic resin material in the shape of a cylinder that has a thickness of 100 μm and a circumferential length of 800 mm. After that, in a polishing process, the tube material is rubbed with a lapping tape of #2000 while being rotated in one direction at a fixed speed, so that circumferential stripes are formed on the outer circumferential surface of the tube material. Then, the circumferential stripes are thermally transferred by pressing the outer circumferential surface of the heated tube material against a mold surface that is finished in the shape of circumferential stripes by a thermal transfer process. | ||||||
| 186 | Use of Hydrogen-Oxygen Plasma for Forming Hydroxyl Functional Groups on a Polymer Surface | US13222120 | 2011-08-31 | US20130048601A1 | 2013-02-28 | Paul Dryer; David Bernard; David Rhine; Xiaoming Wu; Jing X. Sun; Gary Williams |
| A method for improving adhesion between polymeric materials is provided. The method includes treating a surface of a first polymeric material with plasma of oxygen gas and hydrogen-containing gas. The first polymeric material may be a fully cured polymeric material. A second polymeric material may then be deposited on the plasma treated surface of the first polymeric material. The second polymeric material may be an uncured polymeric material. This plasma treatment may be used in improving the adhesion between polymeric components of an inkjet printer. It provides good adhesion between the polymeric components of the inkjet printer even after long exposure to ink. | ||||||
| 187 | RESIN-MOLDED COMPONENT AND RESIN-MOLDING MOLD | US13521711 | 2011-01-12 | US20120295064A1 | 2012-11-22 | Kazuyuki Michiyama; Jun Naganuma |
| A resin-molded component includes a thin wall portion, and a rib-like projection configured to protrude from a back surface of the thin wall portion. The rib-like projection includes a plurality of plate-like projections arranged to be spaced from one another. Each of the plurality of plate-like projections is arranged such that an angle formed between a line connecting a point on a longer side of a bottom surface thereof to a gate provided in the thin wall portion and the longer side of the bottom surface thereof is within a range from 10 degrees to 80 degrees. | ||||||
| 188 | Printhead assembly incorporating plural printhead integrated circuits sealed to support member with polymer sealing film | US12785489 | 2010-05-24 | US08308273B2 | 2012-11-13 | Kia Silverbrook; David Charles Psaila; Garry Raymond Jackson; Akira Nakazawa; Jonathan Mark Bulman; Jan Waszczuk |
| A pagewidth printhead assembly includes a plurality of printhead integrated circuits linked end to end across a width of the pagewidth printhead assembly; a support molding to which the plurality of printhead integrated circuits are sealed, the support molding defining a plurality of ink channels; a plurality of etched channels provided on an underside of each printhead integrated circuit, each etched channel defining along a length thereof a plurality of ink inlets for receiving ink from one of the plurality of ink channels; and a polymer sealing film for sealing the printhead integrated circuits to the support molding, the polymer sealing film defining therethrough a plurality of openings. Each of the plurality of etched channels is divided into two or more separate channel sections separated by respective channel wall structures. Each opening of the polymer film is in fluid communication with ink inlets of two separate channel sections. | ||||||
| 189 | Bonding method, bonded structure, liquid droplet discharging head, and liquid droplet discharging apparatus | US12413846 | 2009-03-30 | US08262837B2 | 2012-09-11 | Yasuhide Matsuo |
| A bonding method includes a first process that includes plasmatizing a first gas including a raw gas containing a siloxane (Si—O) bond at a reduced-pressure atmosphere, substituting the first gas by a second gas mainly including an inert gas, and plasmatizing the second gas to form a first plasma polymerized film on at least a part of a base member so as to obtain a first bonded object including the base member and the plasma polymerized film and a second process that includes preparing a second bonded object that is to be bonded to the first bonded object and pressing the first and the second bonded objects against each other such that a surface of the first plasma polymerized film is closely contacted to a surface of the second bonded object to bond the objects together. | ||||||
| 190 | METHOD FOR MANUFACTURING LIQUID SUPPLY MEMBER AND METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD | US13509246 | 2010-11-05 | US20120222309A1 | 2012-09-06 | Osamu Morita |
| A method for manufacturing a liquid supply member that supplies a discharge port with liquid includes preparing a transparent member and an absorption member, at least one of both members having a groove for a supply path; bringing both members into contact; and forming the supply path by emitting laser beams simultaneously from a plurality of laser beam sources, toward a contact portion, which is provided in a vicinity of the groove and at which both members are in contact, to weld both members. Laser beams are emitted during the forming such that a total laser-beam irradiation amount per unit area for a first portion included in the contact portion and located in a vicinity of an end in a longitudinal direction of the groove is larger than that for part with a smallest irradiation amount of a second portion other than the first portion of the contact portion. | ||||||
| 191 | RESIN MOLDED ARTICLE, METHOD FOR MANUFACTURING THE SAME, AND PRINTER | US13324593 | 2011-12-13 | US20120156429A1 | 2012-06-21 | Yuta Moriya; Akira Nishi; Koki Kodaira |
| A molded article has an exterior surface, a non-exterior surface, and a projecting or recessed portion provided on at least one of the exterior surface and the non-exterior surface. A repeated pattern of projections and/or recesses or a texture face, which serves to disturb the flow of resin, is provided on the non-exterior surface. | ||||||
| 192 | Method of supplying ink to ink ejection nozzles | US12505510 | 2009-07-19 | US08087168B2 | 2012-01-03 | Kia Silverbrook; David Charles Psaila; Garry Raymond Jackson; Akira Nakazawa; Jonathan Mark Bulman; Jan Waszczuk |
| A method of supplying ink to ink ejection nozzles on a printhead for an inkjet printer with a print engine controller for controlling the printhead operation involving the provision a printhead IC having an array of the ink ejection nozzles formed on a substrate, the provision of circuitry for electrical connection to the print engine controller, the provision of a support member for supporting the printhead integrated circuit and the circuitry within the printer, the provision of a thermoplastic polymer sealing film, and securing the polymer film to a mounting surface of the support member by applying heat and pressure for a predetermined time, mounting the printhead integrated circuit and the circuitry to the support member via the polymer film and, electrically connecting the circuitry to the printhead integrated circuit. The mounting surface has ink feed channels formed in it and the polymer film is attached to the mounting surface between the ink feed channels and the printhead integrated circuits. The polymer film has an array of apertures such that the ejection nozzles are in fluid communication with the ink feed channels. | ||||||
| 193 | Method For Manufacturing Solid Ink Sticks With An Injection Molding Process | US13207530 | 2011-08-11 | US20110298155A1 | 2011-12-08 | Terry Alan Smith; Edward Francis Burress |
| A method manufactures solid ink sticks by forming a solid ink paste and injecting the paste into a mold having internal cavities. The solid ink paste can be formed by mixing liquid ink and solid ink in a barrel of an injection molding machine. The liquid ink is formed by melting solid ink particulates in the barrel with a heated conveyor and the solid ink particulates are maintained in a solid phase by cooling a portion of the barrel. Movement produced by the heated conveyor mixes the liquid ink and the solid ink in an area between the cooled portion of the barrel and the heated conveyor. | ||||||
| 194 | Bonded Housing and Fluid Ejector | US12616108 | 2009-11-10 | US20110109697A1 | 2011-05-12 | Steve Deming |
| A method of forming a fluid ejector includes positioning a fluid ejection module such that it is adjacent to a mounting frame, applying heat to a thermohardening glue that is between the fluid ejection module and the mounting frame, and curing the glue to secure the fluid ejection module to the mounting frame. The heat is applied with a heating element at least partially embedded in the glue. | ||||||
| 195 | Method of manufacturing liquid ejecting head | US12389507 | 2009-02-20 | US07862759B2 | 2011-01-04 | Hiroyuki Kamikura |
| A method of manufacturing a liquid ejecting head and a supply member having a plurality of liquid supply passages is provided. The supply member includes first and second supply members in which liquid supply passages are provided and filters provided between the first supply member and the second supply member. The method includes: preparing a connected filter formed of a plurality of filter element portions corresponding to the plurality of liquid supply passages and a connecting portion that connects the plurality of filter element portions; in a state where the filter element portions of the connected filter are held between the first supply member and the second supply member, charging molten resin from a position corresponding to the connecting portion of the connected filter to separate the connecting portion; and, during the charging, molding. | ||||||
| 196 | BASE MEMBER INCLUDING BONDING FILM, BONDING METHOD AND BONDED BODY | US12668108 | 2008-07-02 | US20100323192A1 | 2010-12-23 | Yasuhide Matsuo; Kenji Otsuka; Kazuo Higuchi; Kosuke Wakamatsu |
| A base member including a bonding film comprises a substrate; and the bonding film provided on the substrate. The base member is capable of bonding to an opposite substrate (object) through the bonding film. Such a bonding film contains a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. Further, the bonding film is formed by a plasma polymerization. Furthermore, in a case where energy is applied to at least a part region of the surface of the bonding film, the elimination groups existing on the surface and in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that the region develops a bonding property with respect to the opposite substrate. | ||||||
| 197 | Inkjet heads and methods of manufacturing inkjet heads | US11852951 | 2007-09-10 | US07824518B2 | 2010-11-02 | Atsuhisa Nakashima; Hiroto Sugahara |
| In order to manufacture an ink-jet head, a head body and a reservoir unit are formed first. Then, UV-cured resin is applied on the lower surface of the reservoir unit. Then, the head body is placed on a plane of a jig so that the plane abuts against the ink discharge surface. Then, the reservoir unit is positioned with respect to the head body and the jig so that an ink reservoir of the reservoir unit and ink flow channels of a flow channel unit are brought into communication and the both ends in the longitudinal direction of a reservoir base plate and the upper surfaces of walls oppose to each other, and the reservoir unit is laminated on upper surface of the flow channel unit via the UV-cured resin. Subsequently, the UV-cured resin is cured in a state in which the lower surface of the reservoir base plate abuts against the upper surfaces of the walls. | ||||||
| 198 | METHOD OF MANUFACTURING A BELT MEMBER AND THE BELT MEMBER | US12704756 | 2010-02-12 | US20100209647A1 | 2010-08-19 | Hiroshi Tominaga |
| A tube material is formed by continuously extruding a thermoplastic resin material in the shape of a cylinder that has a thickness of 100 μm and a circumferential length of 800 mm. After that, in a polishing process, the tube material is rubbed with a lapping tape of #2000 while being rotated in one direction at a fixed speed, so that circumferential stripes are formed on the outer circumferential surface of the tube material. Then, the circumferential stripes are thermally transferred by pressing the outer circumferential surface of the heated tube material against a mold surface that is finished in the shape of circumferential stripes by a thermal transfer process. | ||||||
| 199 | BONDING METHOD AND BONDED BODY | US12577314 | 2009-10-12 | US20100092767A1 | 2010-04-15 | Nobuhiro NAITO; Mitsuru SATO; Takatoshi YAMAMOTO; Minehiro IMAMURA |
| A bonding method includes applying a liquid material containing silicone materials to at least one of the first base member and the second base member so as to form a liquid film, drying the liquid film so as to obtain a bonding film on the at least one of the first base member and the second base member, heating the bonding film so as to cross-link the silicone materials contained in the bonding film to each other, and applying energy to the bonding film so as to develop adhesiveness around a surface of the bonding film so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed between the first base member and the second base member. | ||||||
| 200 | METHOD FOR ASSEMBLING A CARRIER FOR INTEGRATED CIRCUITS | US12193738 | 2008-08-19 | US20100045741A1 | 2010-02-25 | Stephen Richard O'Farrell; Jan Waszczuk; David Bernardi; Toby Desmond Oste; Mark Janos; William Granger |
| The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together. | ||||||
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