| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 一种铜管焊接方法 | CN201610644173.6 | 2016-08-08 | CN106180959A | 2016-12-07 | 刘绪军; 顾柳青; 董爱芳 |
| 本发明公开了一种铜管焊接方法，具有以下步骤：a、将需要焊接的两根铜管固定在焊接夹具工装上；b、对铜管管口进打磨去除管口毛刺处理；c、另截取20-30mm长的相近合金牌号铜管作为连接衬管；d、将连接衬管两端分别插入需要焊接的铜管管口内，对接的铜管管口两端间距为3～5mm之间；e、准备好银基焊条、焊粉、压力稳定的丙烷气和氧气；f、将焊粉预熔到焊条上，然后将焊条和焊粉进行一次性熔化并均匀渗透至对接好的管口上焊接牢固；g、焊接完后，将铜管自然冷却十秒钟以上，再用湿毛巾来擦拭冷却并用金相砂纸进行抛光处理。本发明操作简便，安全低成本，可实现铜管无限长度的连接，最终达到降本增效的目的。 | ||||||
| 2 | 用于制造电子设备用的密封壳体的方法 | CN201380054602.9 | 2013-08-27 | CN104885582A | 2015-09-02 | H·布鲁尼尔; H·金德; S·M·O·L·施耐德 |
| 本发明涉及一种用于制造壳体(100......125)的方法，该壳体具有密封封闭的用于电子设备(3)的至少一个容纳腔(12，19，20)，所述容纳腔包括该壳体(100......125)内腔的至少一部分。在此，制造/提供一个具有至少一个开口的玻璃制的空心体(2)，通过至少一个开口装入至少一个电子设备(3)且通过使壳体(100......125)熔融来密封地封闭容纳腔(12，19，20)或者借助激光射线将至少一个开口封闭。另外本发明涉及一种具有至少部分地密封封闭的硅制的壳体(100......125)的装置，所述壳体特别是根据所述方法制成。 | ||||||
| 3 | 无铅黄铜的焊接方法 | CN201310724694.9 | 2013-12-24 | CN104722901A | 2015-06-24 | 姜志华; 施景祥; 康进兴; 叶松玮; 魏嘉民; 王俊杰 |
| 本发明是有关于一种无铅黄铜的焊接方法，包含：提供无铅黄铜基材，该无铅黄铜基材具有待焊区域及间隙；研磨步骤，研磨该无铅黄铜基材的该待焊区域以去除位于该待焊区域的表面氧化物；清洁步骤，清洁该无铅黄铜基材的该待焊区域以去除杂质与污染物；固定步骤，以夹具固定该无铅黄铜基材；以及焊接步骤，沿该间隙进行焊接而形成有焊道，且该焊道并无发生脱锌的现象。本发明提供的技术方案可以避免焊后无铅黄铜发生脱锌(dezincification)的现象，确保无铅黄铜基材所制成的制品的使用安全。 | ||||||
| 4 | Method for producing a hermetic housing for an electronic device | US14424511 | 2013-08-27 | US09572273B2 | 2017-02-14 | Heinz Blunier; Hannes Kind; Sandro M. O. L. Schneider |
| A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method. | ||||||
| 5 | METHOD FOR PRODUCING A HERMETIC HOUSING FOR AN ELECTRONIC DEVICE | US14424511 | 2013-08-27 | US20150208539A1 | 2015-07-23 | Heinz Blunier; Hannes Kind; Sandro M.O.L. Schneider |
| A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method. | ||||||
| 6 | METHOD FOR PRODUCING A HERMETIC HOUSING FOR AN ELECTRONIC DEVICE | US15398317 | 2017-01-04 | US20170118856A1 | 2017-04-27 | Heinz BLUNIER; Hannes KIND; Sandro M.O.L. SCHNEIDER |
| A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method. | ||||||
| 7 | 電子デバイス用の密閉型ハウジングの生産方法 | JP2015528985 | 2013-08-27 | JP2015535788A | 2015-12-17 | ブルニアー ハインツ; キント ハンネス; エム．オー．エル．シュナイダー サンドロ |
| 本発明は、電子部品(3)用の少なくとも1つの密封された収容空間(12、19、20)を伴うハウジング(100〜125)の生産方法において、前記収容空間がハウジング(100〜125)の内部の少なくとも一部分を構成している方法に関する。この方法では、ガラス製でかつ少なくとも1つの開口部を有する中空体(2)が生産/提供され、少なくとも1つの開口部を通して少なくとも1つの電子デバイス(3)が導入され、収容空間(12、19、20)が、ハウジング(100〜125)を溶融させることにより密封されるか、または少なくとも1つの開口部がレーザー放射を用いて封止される。本発明はさらに、ケイ素製の少なくとも部分的に密封されたハウジング(100〜125)、詳細には、上述の方法にしたがって生産されたハウジングを伴うデバイスにも関する。【選択図】図6 | ||||||
| 8 | VERFAHREN ZUR HERSTELLUNG EINES HERMETISCHEN GEHÄUSES FÜR EIN ELEKTRONISCHES GERÄT | EP16179698.2 | 2013-08-27 | EP3242538A1 | 2017-11-08 | Blunier, Heinz; Kind, Hannes; Schneider, Sandro M.O.L. |
Es wird ein Verfahren zur Herstellung eines Gehäuses (100..125) mit zumindest einem, zumindest einen Teil eines Innenraumes des Gehäuses (100..125) umfassenden hermetisch abgeschlossenen Aufnahmeraum (12, 19, 20) für ein elektronisches Gerät (3) angegeben. Dabei wird ein mindestens eine Öffnung aufweisender Hohlkörper (2) aus Glas hergestellt/bereitgestellt, zumindest ein elektronisches Geräts (3) durch die zumindest eine Öffnung eingebracht und der Aufnahmeraum (12, 19, 20) durch Verschmelzen des Gehäuses (100..125) hermetisch verschlossen oder die zumindest einen Öffnung mittels Laserstrahlung verschlossen. Weiterhin wird eine Vorrichtung mit einem zumindest zum Teil hermetisch abgeschlossenen Gehäuse (100..125) aus Silizium angegeben, das insbesondere nach dem genannten Verfahren hergestellt ist.
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| 9 | Welding flux and welding method | EP14160610.3 | 2014-03-18 | EP2921252A1 | 2015-09-23 | SESEKE-KOYRO, Ulrich; BECKER, Andreas |
A flux is provided which comprises CaF2, MgF2 and Li3AlF6, and which contains additionally at least one fluoride selected from the group consisting of SrF2 and BaF2. The flux or a flux composition which comprises the flux and certain additives, e.g. a liquid carrier and/or a binder, is especially suitable to be used in a method for welding parts of aluminum or aluminum alloy, especially using a fuel/oxygen flame to provide heat. A preferred fuel is acetylene. |
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| 10 | VERFAHREN ZUR HERSTELLUNG EINES HERMETISCHEN GEHÄUSES FÜR EIN ELEKTRONISCHES GERÄT | EP13753621.5 | 2013-08-27 | EP2891393B1 | 2017-08-02 | BLUNIER, Heinz; KIND, Hannes; SCHNEIDER, Sandro M.O.L. |
| 11 | VERFAHREN ZUR HERSTELLUNG EINES HERMETISCHEN GEHÄUSES FÜR EIN ELEKTRONISCHES GERÄT | EP13753621.5 | 2013-08-27 | EP2891393A2 | 2015-07-08 | BLUNIER, Heinz; KIND, Hannes; SCHNEIDER, Sandro M.O.L. |
| The invention relates to a method for producing a housing (100-125) with at least one hermetically sealed receiving space (12, 19, 20) for an electronic component (3), said receiving space comprising at least a part of the interior of the housing (100-125). In the method, a hollow body (2) made of glass and having at least one opening is produced/provided, at least one electronic device (3) is introduced through the at least one opening, and the receiving space (12, 19, 20) is hermetically sealed by melting the housing (100-125), or the at least one opening is sealed by means of laser radiation. The invention further relates to a device with an at least partially hermetically sealed housing (100-125) made of silicon, particularly a housing produced according to the above-mentioned method. | ||||||
| 12 | 전자 장치에 대한 밀폐 하우징 제조 방법 | KR1020157007980 | 2013-08-27 | KR1020150052151A | 2015-05-13 | 브뤼니에하인츠; 킨트하네스; 슈나이더산드로엠.오.엘. |
| 본발명은전자부품(3)에대한적어도하나의밀봉된수용공간(12, 19, 20)을구비한하우징(100-125)을제조하는방법에관한것이고, 상기수용공간이하우징(100-125) 내부적어도일 부분에구비된다. 상기방법으로, 유리로만들고적어도하나의개구부를구비한중공체(2)가제조/제공되고, 적어도하나의전자장치(3)가적어도하나의개구부를통해도입되고, 수용공간(12, 19, 20)이하우징(100-125)을용융시킴으로써밀봉되거나, 적어도하나의개구부가레이저방사로밀봉된다. 본발명은추가적으로적어도부분적으로밀봉된, 실리콘으로만든하우징(100-125), 특히상기언급된방법에따라제조된하우징을구비하는장치에관한것이다. | ||||||
| 13 | 알루미늄 재질의 연결 포터를 알루미늄 재질의 방열기 헤드 파이프에 용접하는 방법 | KR1020170044076 | 2017-04-05 | KR101871954B1 | 2018-07-02 | 이종보 |
| 본발명은지그(10)를준비하는단계; 관통공(5)이형성되는헤드파이프(4)가좌우각각에마련되는방열기(1)를준비하되, 헤드파이프(4)의관통공(5)이지그(10)의가동단(16) 하방으로일정간격이격된상태로방열기(1)를고정하는단계; 알루미늄재질의연결포터(6) 일측부위에알루미늄재질의용접링(7)을삽입하고, 용접링(7)이삽입된연결포터(6)의일단부위를방열기(1)의관통공(5)에강제삽입하는단계; 지그(10)의가동단(16)을수직하방으로이동시켜감지센서(15)를작동시킴과동시에일단부위가방열기(1)의관통공(4)에강제삽입된연결포터(6)의타단부위를가동단(16)의고정홈(17)에고정하는단계; 연결포터(6)의타단부위를고정하고있는가동단(16)의일측부위를토치(30)로서일정시간가열하는단계; 토치(30)로부터전달되는열에의해용접링(7)이용융되면, 가동단(16)이△h만큼낙하하여차단핀(18)이감지센서(15)의작동을차단시켜토치(30)의작동을중단시키는단계;를포함하는알루미늄재질의연결포터를알루미늄재질의방열기헤드파이프에용접하는방법을제공한다. | ||||||
| 14 | 가스 누출 방지 장치 | KR1020160070663 | 2016-06-08 | KR1020170138639A | 2017-12-18 | 우정욱; 장경호 |
| 가스누출방지장치를제공한다. 가스누출방지장치는파이프의용접부위를감싸상기파이프의내부공간을밀폐시키는밀폐부, 및상기용접부위를감싸는밀폐부의길이를결정하고, 상기용접부위중 일부를노출시키는거리유지부를포함한다. | ||||||
| 15 | METHOD FOR PRODUCING A HERMETIC HOUSING FOR AN ELECTRONIC DEVICE | PCT/EP2013067686 | 2013-08-27 | WO2014033111A2 | 2014-03-06 | BLUNIER HEINZ; KIND HANNES; SCHNEIDER SANDRO M O L |
| The invention relates to a method for producing a housing (100-125) with at least one hermetically sealed receiving space (12, 19, 20) for an electronic component (3), said receiving space comprising at least a part of the interior of the housing (100-125). In the method, a hollow body (2) made of glass and having at least one opening is produced/provided, at least one electronic device (3) is introduced through the at least one opening, and the receiving space (12, 19, 20) is hermetically sealed by melting the housing (100-125), or the at least one opening is sealed by means of laser radiation. The invention further relates to a device with an at least partially hermetically sealed housing (100-125) made of silicon, particularly a housing produced according to the above-mentioned method. | ||||||
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