序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
1 触摸屏组件 CN200680007448.X 2006-03-06 CN101138059B 2014-01-29 西川和宏; 朝仓刚; 土田典明; 浜冈弘一
触摸屏(4)的上电极薄膜(1)的表面上具有:以其周边部分比触摸屏(4)向外伸展的状态粘贴的装饰片(5);在装饰片(5)上一体成形的、表面被装饰片(5)覆盖并且将触摸屏(4)的侧面围起来的触摸屏组件用壳体(6)。
2 电子通信设备和方法 CN200880131217.9 2008-07-21 CN102217017A 2011-10-12 S·J·迪米格
发明提供一种电子通信设备,例如便携式信息终端,并且在一些实施例中,便携式信息终端包括柔性膜和限定了至少一个孔的隔离层。柔性膜可以覆盖隔离层的至少一部分,并且限定了便携式信息终端的外表面。柔性膜包括至少一个接触面和邻近所述至少一个接触面的表面。当施加以启动至少一个开关时,所述至少一个接触面弯曲。
3 薄膜屏蔽 CN96120564.4 1996-11-12 CN1158550A 1997-09-03 小威廉P·阿尔贝特; 威廉C·伏勒尔; 杰理S·乔尔泽帕
一种装置(100)包括一个键盘薄膜(1600),键盘薄膜有一个覆盖在薄膜体(1602)的底表面的薄膜导体层(1608)。导体层覆盖薄膜触点区(217),并且利用一种粘合剂(1700)连接于地线。薄膜上接地的导体层提供了RF屏蔽,以减少穿过装置的键区的不希望有的RF能的耦合。
4 按钮开关和按钮开关用粘合带 CN201280044351.1 2012-09-12 CN103782361B 2016-04-20 木上裕贵; 橘俊光
发明的按钮开关具备将壳体的开口部密封的粘合带。在壳体内的底面上设置有固定触点部,在壳体内设置有活动触点部。粘合带具备支撑基材和粘合剂层。粘合带的粘合剂层与壳体的一部分和活动触点部的一部分接触。粘合带的支撑基材的厚度为25μm以上且100μm以下,支撑基材的加热后的纵向和横向尺寸变化率之差为±0.01%~±6%,并且支撑基材的拉伸强度为0.7N/mm以上。
5 按钮开关和按钮开关用粘合带 CN201280044351.1 2012-09-12 CN103782361A 2014-05-07 木上裕贵; 橘俊光
发明的按钮开关具备将壳体的开口部密封的粘合带。在壳体内的底面上设置有固定触点部,在壳体内设置有活动触点部。粘合带具备支撑基材和粘合剂层。粘合带的粘合剂层与壳体的一部分和活动触点部的一部分接触。粘合带的支撑基材的厚度为25μm以上且100μm以下,支撑基材的加热后的纵向和横向尺寸变化率之差为±0.01%~±6%,并且支撑基材的拉伸强度为0.7N/mm以上。
6 触摸屏组件 CN200680007448.X 2006-03-06 CN101138059A 2008-03-05 西川和宏; 朝仓刚; 土田典明; 浜冈弘一
触摸屏(4)的上电极薄膜(1)的表面上具有:以其周边部分比触摸屏(4)向外伸展的状态粘贴的装饰片(5);在装饰片(5)上一体成形的、表面被装饰片(5)覆盖并且将触摸屏(4)的侧面围起来的触摸屏组件用壳体(6)。
7 薄膜ボタンサーキット上、下シートの新型導電構造及び導電方法 JP2017500114 2015-02-04 JP2017515287A 2017-06-08 鈕李明
【課題】薄膜ボタンサーキット上、下シートの新型導電構造及び導電方法を提供する。【解決手段】薄膜ボタンサーキット上、下シートの新型導電構造及び導電方法で、上シート導電接触点11上には順番に第一上シート導電層12と第二上シート導電層13とをコーティングする。下シート導電接触点21上には順番に第一下シート導電層22と第二下シート導電層23とをコーティングする。第一上シート導電層12、第二上シート導電層13、第二下シート導電層23と第一下シート導電層22とは順番に積み重ね、厚みがバックグルー層30の厚みよりやや厚い複合導電層を形成する。本発明は低コストの多数回プリント方式により、上、下導電接触点を厚くし、複合導電層の厚みがバックグルー層30の厚みよりやや厚いことにより生じる微変形を利用し、第二上シート導電層13と第二下シート導電層23とをしっかりと一体に圧合し、こうしてボタンの導電を実現する。従来の技術に比べ、コストが低く、加工が便利で、作動の信頼性が高いという長所を備え、生産テストと組み立て技術を簡略化でき、生産効率を高めることができる。【選択図】図4
8 Thin film switch JP30799391 1991-11-22 JPH05109341A 1993-04-30 ARAN EMU BAAKU
PURPOSE: To improve a manufacturing yield, and reduce the treating processes of respective thin film layers significantly by providing an upper portion thin film whose down side surface is conductive, a bottom portion thin film whose up side surface is conductive, and an intermediate spacer. CONSTITUTION: A thin film switch 10 is equipped with an upper portion thin film 12 whose down side surface is conductive, a bottom portion thin film 14 whose up side surface is conductive, and an insulation intermediate annular spacer 20. The spacer 20 is arranged between the thin film 12 and the thin film 14, a large rectangular central opening portion is provided so as to specify the up side surface and the down side surface. Two (y) axis electrodes are formed on the up side surface of the spacer 20, two (x) axis electrodes are formed on the down side surface, and simultaneously an upper portion adhesive layer and a lower portion adhesive layer are respectively provide on and below the spacer 20 so as to fix the thin film 12, the spacer 20, and the thin film 14 together. Thereby, the respective electrodes and the surfaces of the thin films 12, 14 facing thereto can be brought into electric contact. Accordingly, the treating processes of the respective thin film layers are significantly reduced, and a manufacturing yield can be improved. COPYRIGHT: (C)1993,JPO
9 Key switch structure JP13970783 1983-07-30 JPS6032215A 1985-02-19 OOSAWA HIROSHI; KURASHIMA ISAO; KAWAI YOSHIO
In a keyswitch structure, a number of recesses are formed in a lower case, and a projection with a flat top surface is formed inside each of the recesses. The recesses communicate with each other by means of grooves formed on the lower case, and fixed contacts are provided on the projections. A pattern is formed on the under surface of a flexible substrate put on the lower case so that movable contacts, included in the pattern, face the fixed contacts. An elastic sheet with a number of buttons is put on the flexible substrate, and the flexible substrate and the elastic sheet are fixedly held between an upper case and the lower case. When any of the buttons of the elastic sheet is pushed, the elastic sheet and the flexible substrate are elastically deformed to bring the movable contacts into contact with the fixed contacts.
10 Sheet-like small-sized electronic apparatus JP3327482 1982-03-03 JPS58151620A 1983-09-08 HARA KAZUYA; TAKEUCHI EIICHI
PURPOSE:To make a case thin remarkably, and to improve its portability, by constituting an electronic apparatus of upper and lower cases having toughness, which are made to closely adhere and are laminated on an electronic parts constitution body, and a frame for supporting the electronic parts constitution body by surrounding it. CONSTITUTION:A semiconductor integrated circuit element 26 for executing the opertion by turning on and off a switch element operated from the outside, a liquid crystal display element 34 for executing the display by a signal from the element 26, and a solar battery 43 for applying driving voltage to the elements 26, 34 are arrayed and connected on a substrate 21, by which an electronic parts constitution body 11 is formed. It is constituted so that a sheet-like upper case 1 and lower case 2, having toughness, respectively are made to closely adhere and are laminated on the upper side and the lower side of the constitution body 11, and a frame 16 having toughness supports the constitution body 11 by surrounding it. The case 1 consists of an operating part 50 for operating the switch element, an upper face sheet 12 having a display window 53 opposed to the element 34, and an upper sheet 13 having a hole part 56 corresponding to the switch element. The case 2 consists of a lower face sheet 14 and a lower sheet 15.
11 누름 버튼 스위치 및 누름 버튼 스위치용 점착 테이프 KR1020147006554 2012-09-12 KR1020140074295A 2014-06-17 기가미히로키; 다치바나도시미츠
본 발명의 누름 버튼 스위치는 하우징의 개구부를 밀봉하는 점착 테이프를 구비한다. 하우징 내에서의 저면에는 고정 접점부가 설치되고, 하우징 내에 있어서 가동 접점부가 설치되어 있다. 점착 테이프는 지지 기재와 점착제층을 구비한다. 점착 테이프의 점착제층은 하우징의 일부 및 가동 접점부의 일부에 접촉되어 있다. 점착 테이프의 지지 기재의 두께는 25㎛ 이상 100㎛ 이하이고, 지지 기재는 가열 후의 종횡 치수 변화율의 차가 ±0.01% 내지 ±6%이고, 또한 인장 강도가 0.7N/mm 이상이다.
12 터치 패널 유닛 KR1020077019310 2006-03-06 KR1020070108879A 2007-11-13 니시카와,가즈히로; 아사쿠라,타케시; 츠치다,노리아키; 하마오카,코이치
A surface of an upper electrode film (1) of a touch panel (4) is provided with a design sheet (5), which is bonded on the sheet with its periphery extending further from the touch panel (4); and a touch panel unit case (6), which is integrally formed with the design sheet (5) with its surface covered with the design sheet (5), and surrounds a side plane of the touch panel (4).
13 고강도 터치패널과 그 제조방법 KR1020007003761 1998-10-09 KR1020010024454A 2001-03-26 하시모토다카오; 쿠스다야스지
본발명은, 가요성의투명필름(9)의일면에상부전극(111)을갖고다른면에하드코트층(12)을갖는상부전극시트(1)와유리기판(10)의일면에상기상부전극에대향하는하부전극(121)을갖는하부전극시트(2)가상기상부전극과상기상부전극에대향하는하부전극의사이에스페이서(13)를매개로간격을두어대향배치되고, 상기상부전극과상기상부전극에대향하는하부전극의주위가접착층(3)에서접착되는저항막방식의터치패널(8)에있어서, 투명필름과하드코트층이단부에서융착되고, 유리기판의측단면의표층부분이압축응력층(10a)으로되어있다.
14 키이 스위치 구조 KR1019840001972 1984-04-13 KR1019890001891B1 1989-05-30 구라시마이사오; 가와이요시오; 오오사와히로시
A number of recesses are formed in a lower case, and a projection with a flat top surface is formed inside each of the recesses. The recesses communicate with each other by grooves formed on the lower case, and fixed contacts are provided on the projections. A pattern is formed on the under surface of a flexible substrate put on the lower case so that movable contacts, included in the pattern, face the fixed contacts. An elastic sheet with a number of buttons is put on the flexible substrate, and the flexible substrate and the elastic sheet are fixedly held between an upper case and the lower case. The advantage is that it has reduced the number of components for improved production efficiency.
15 KEY STRUCTURE US15923281 2018-03-16 US20180277321A1 2018-09-27 Yu-Kuang CHEN
A key structure having a pressing area is provided. The key structure includes a first membrane and a second membrane. A first conductive layer and a first insulation layer are sequentially disposed on a surface of the first membrane. The first insulation layer has a first opening in the pressing area, so that a part of the first conductive layer is exposed from the first opening. The second membrane is disposed opposite to the first membrane. A second conductive layer and a second insulation layer are sequentially disposed on a surface of the second membrane facing the first membrane. The second insulation layer has a second opening, which is formed corresponding to the first opening, in the pressing area, so that a part of the second conductive layer is exposed from the second opening to face the first conductive layer in the first opening.
16 Grounding connections in a tactile switch assembly US14867336 2015-09-28 US09972454B1 2018-05-15 Sawyer I. Cohen; Tyler B. Cater; Ramachandran Chundru; Vivek Katiyar; Marwan Rammah; Ashutosh Y. Shukla
An electronic device includes a tactile switch assembly. The tactile switch assembly includes a tactile switch structure. A grounding structure can be included in an electrostatic discharge path in the tactile switch structure. The grounding structure can result in a shorter electrostatic discharge path that minimizes damage caused by an electrostatic discharge event. Additionally, different grounding connectors are disclosed that can attach to a grounded component in the electronic device and to a tactile switch bracket associated with the tactile switch assembly. The grounding connector provides a grounding connection to the tactile switch bracket.
17 Waterproof presskey structure and waterproof mobile phone utilizing same US15347810 2016-11-10 US09866659B2 2018-01-09 Ji-Dong Ma; Dong-Ming Chen
A waterproof presskey structure includes a shell, a button or presskey, and an elastic element. The elastic element and the shell can be assembled together with gum, the presskey is movably assembled to the shell and matches with the elastic element. The elastic element comprises a tubular structure having an elastic wall. The elastic wall is arched, and the elastic wall projects out towards within the tubular structure. For the arched elastic wall stretches under pressure from the button or presskey, an assembly of the elastic element and other parts is not affected, the elastic element cannot be separated from the shell due to the gum failing, and water resistance between the presskey and the shell is increased.
18 Switch structures for use on printed circuit boards US12150684 2008-04-29 US08111522B2 2012-02-07 Fletcher R. Rothkopf; Teodor Dabov; Richard Hung Minh Dinh; Jun Sun; Michael Rosenblatt
An electrical contact area on a printed circuit board (“PCB”), that would otherwise be subject to abrasion and possibly also corrosion, can be protected by covering it with another, more durable contact structure that is bonded to the first-mentioned contact area using an anistropic conductive adhesive (“ACA”). The more durable contact structure may include a member of PCB material or the like with electrically connected electrical contacts on its upper and lower surfaces. At least the upper one of these contacts (which is exposed for the service that involves possible abrasion and/or corrosion) may be given high durability by plating it with hard gold. The lower of these contacts is adhered to the main PCB via the above-mentioned ACA.
19 Switch structures for use on printed circuit boards US12150684 2008-04-29 US20090266699A1 2009-10-29 Fletcher R. Rothkopf; Teodor Dabov; Richard Hung Minh Dinh; Jun Sun; Michael Rosenblatt
An electrical contact area on a printed circuit board (“PCB”), that would otherwise be subject to abrasion and possibly also corrosion, can be protected by covering it with another, more durable contact structure that is bonded to the first-mentioned contact area using an anistropic conductive adhesive (“ACA”). The more durable contact structure may include a member of PCB material or the like with electrically connected electrical contacts on its upper and lower surfaces. At least the upper one of these contacts (which is exposed for the service that involves possible abrasion and/or corrosion) may be given high durability by plating it with hard gold. The lower of these contacts is adhered to the main PCB via the above-mentioned ACA.
20 Integrated electromechanical arrangement and method of production US10612397 2003-07-01 US07200009B2 2007-04-03 Katri Narhi; Roope Takala; Jari Nousiainen; Pentti Ahlgren; Pia Tanskanen
It is an object of the invention to provide a electromechanical structure comprising an input device and a printed wired board (3, 4), which structure is advantageous in terms of manufacturing and offers freedom to the layout design of the printed wired board, the user interface as well as the appearance of the device itself. It is also an object of the invention to provide a electromechanical structure that is compact and facilitates the customizability and upgradability with a new electronic functionality without any need for modifications to the main electronics of the device. This is achieved by integrating the electromechanical assembly with the mechanical cover part of the electronic device by using an injection moulding process to compose an integrated combination (113) which is detachable from the electronic device. More precisely the objects of the invention are achieved by combining the injection mould technologies with the printing of electronic wired boards.
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