子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | HIGHLY CONDUCTING MATERIAL | US14900124 | 2014-06-18 | US20160141483A1 | 2016-05-19 | Jorma Virtanen; Veijo Kangas |
| The present invention concerns electrically conductive nanocomposites. More specifically the electrical conductance of graphitic material can be improved significantly by a molecular coating that has well defined repeating structure. Even superconductivity of these materials may be possible at technologically meaningful temperatures. | ||||||
| 162 | ELECTRIC WIRE AND CABLE | US14936121 | 2015-11-09 | US20160141073A1 | 2016-05-19 | Tamotsu KIBE; Hisao FURUICHI; Hiroshi OKIKAWA; Ryutaro KIKUCHI |
| An electric wire includes a conductor having a cross-sectional area of not less than 290 mm2 and not more than 360 mm2, an insulation provided so as to cover the outer periphery of the conductor, and a wire sheath provided so as to cover the outer periphery of the insulation. The amount of deflection is not less than 120 mm when, at 23° C., one end of the electric wire is fixed to a fixture table so that another end horizontally protrudes 400 mm from the fixture table and a weight of 2 kg is attached to the other end, and cracks and breaks do not occur when wound with a bending diameter of three times the diameter at −40° C. | ||||||
| 163 | Method for Producing An Electrical Contact Element For Preventing Tin Whisker Formation, and Contact Element | US14695780 | 2015-04-24 | US20150310956A1 | 2015-10-29 | Helge Schmidt |
| A method for producing an electrical contact element comprises the steps of providing a base material, and applying at least one electrically conductive contact layer to the base material. The contact layer has an outer surface which is elevated by roughness and which is suitable for receiving a lubricant. | ||||||
| 164 | Cell connector | US14084180 | 2013-11-19 | US09136039B2 | 2015-09-15 | Armin Diez; Hubertus Goesmann; Axelle Hauck; Christian Zachar |
| A cell connector for the electrically conductive connection of a first cell terminal of a first electrochemical cell and a second cell terminal of a second electrochemical cell of an electrochemical device is provided, the cell connector including a first contact region for connection to the first cell terminal and a second contact region for connection to the second cell terminal, where the cell connector allows a large relative displacement between the first contact region and the second contact region even under the influence of only small deformation forces. The cell connector can include a base body made of two or more material layers, at least two material layers being connected to one another in one piece along a fold line. | ||||||
| 165 | BONDING PAD STRUCTURE AND TOUCH PANEL | US14312693 | 2014-06-24 | US20150253897A1 | 2015-09-10 | Ray Liang; Zheng-Xiang Liu; Fei Teng |
| A bonding pad structure including a first sub-bonding pad and a second sub-bonding pad and a touch panel are provided. The first sub-bonding pad has a first connection terminal at an opposite side of a first end terminal. A width of the first connection terminal is greater than a width of the first end terminal. The first sub-bonding pad has a second connection terminal at an opposite side of a second end terminal. A width of the second connection terminal is greater than a width of the second end terminal. The first connection terminal is close to the second end terminal and the second connection terminal is close to the first end terminal. A first outline of the first sub-bonding pad and a second outline of the second sub-bonding pad are formed as a pair in a complementary manner to construct a configuration of the bonding pad structure. | ||||||
| 166 | TRANSFER METHOD FOR MANUFACTURING CONDUCTOR STRUCTURES BY MEANS OF NANO-INKS | US14706629 | 2015-05-07 | US20150245496A1 | 2015-08-27 | Ando WELLING |
| A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described. | ||||||
| 167 | METHOD FOR PRODUCING SILVER NANO-PARTICLES AND SILVER NANO-PARTICLES | US14419613 | 2013-07-31 | US20150217375A1 | 2015-08-06 | Yuki Iguchi; Kazuki Okamoto |
| The present invention provides a silver nano-particle production method which is safe and simple also in terms of scaled-up industrial-level production, in a so-called thermal decomposition method in which a silver-amine complex compound is thermally decomposed to form silver nano-particles. A method for producing silver nano-particles comprising: mixing an aliphatic hydrocarbon amine and a silver compound in the presence of an alcohol solvent having 3 or more carbon atoms to form a complex compound comprising the silver compound and the amine; and thermally decomposing the complex compound by heating to form silver nano-particles. | ||||||
| 168 | Metallic Material for Electronic Components and Method for Producing Same, and Connector Terminals, Connectors and Electronic Components Using Same | US14416922 | 2013-06-25 | US20150213918A1 | 2015-07-30 | Yoshitaka Shibuya; Kazuhiko Fukamachi; Atsushi Kodama |
| The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from the constituent element group A and one or two selected from a constituent element group B, namely, the group consisting of Sn and In; and an upper layer formed on the intermediate layer, the upper layer being constituted with one or two selected from the constituent element group B and one or two or more selected from a constituent element group C, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.40 μm; and the thickness of the upper layer is 0.02 μm or more and less than 1.00 μm. | ||||||
| 169 | ELECTRICALLY CONDUCTIVE SHEET MATERIAL | US14415754 | 2013-07-15 | US20150200405A1 | 2015-07-16 | Gunter Scharfenberger; Gerhard Schoepping; Birger Lange; Gerald Jarre; Michael Zaminer; Judith Haller |
| An electrically conductive sheet material having a base body with fibers, at least part of the fibers having carbon fibers, optionally having channels extending through the base body, capable of providing an electrically conductive and flexible sheet material which has a low electrical resistance and which can be produced on a large scale in the most simple, cost-effective and reproducible manner possible. | ||||||
| 170 | LOW RESISTANCE INSERT | US13964721 | 2013-08-12 | US20150041211A1 | 2015-02-12 | Kimberly DEBOCK; David James FABIAN; Brian Todd KLINGER |
| A conductive insert which provides a low resistance bond between low conductive materials. The insert includes a first surface and an oppositely facing second surface. A plurality of openings extends between the first surface and the second surface. At least one first projection extends from the first surface proximate respective first openings, the at least one first projections extend from the first surface in a direction away from the second surface. At least one second projection extends from the second surface proximate respective second openings, the at least one second projections extend from the second surface in a direction away from the first surface. The insert provides a stable, low resistance electrically conductive path between the conductive materials. | ||||||
| 171 | Heating Layer for Film Removal | US13911778 | 2013-06-06 | US20140363637A1 | 2014-12-11 | Daniel J Kovach; Gary E Georgeson; Robert J Miller; Jeffrey D Morgan; Diane C Rawlings |
| Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an “on-demand” de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer. | ||||||
| 172 | TOUCH SENSOR ELECTRODE WITH PATTERNED ELECTRICALLY ISOLATED REGIONS | US14368473 | 2013-02-11 | US20140347076A1 | 2014-11-27 | Roger W. Barton; Billy L. Weaver; Matthew W. Gorrell; Brock A. Hable |
| An electrode layer has a plurality of substantially parallel electrodes disposed along a first direction. At least one electrode has a length along the first direction and a width from a first edge to a second edge along a second direction transverse to the first direction. At least one electrode comprises across its width at least one edge section, at least one intermediate section, and at least one central section, wherein an intermediate section is disposed along the electrode width between an edge section and the central section. At least one electrode edge section and intermediate section includes a plurality of electrically isolated regions arranged in a pattern along the electrode length. An electrode conductive area of the edge section is less than an electrode conductive area of the intermediate section. | ||||||
| 173 | Electrode, and electronic device comprising same | US13878537 | 2011-12-29 | US08766097B2 | 2014-07-01 | Ji Young Hwang; In-Seok Hwang; Yong Goo Son; Min Choon Park; Sungjoon Min; Jiehyun Seong |
| The present invention relates to an electrode comprising an auxiliary electrode comprising a conductive pattern and a main electrode provided on at least a portion of the auxiliary electrode to be electrically connected to the auxiliary electrode, and a manufacturing method thereof. | ||||||
| 174 | Manufacturing and Applications of Metal Powders and Alloys | US14078871 | 2013-11-13 | US20140061549A1 | 2014-03-06 | Andrew Matheson |
| Disclosed is a process to reduce mixtures of at least one metal halide by molten metal reduction of the liquid phase metal halide in an alkali or alkaline earth metal to form a reaction product comprising at least one metal mixture and a halide salt coating, in which the at least one metal halide is in stoichiometric excess to the molten metal reductant and wherein the reductant is consumed in the reaction and does not need to be removed at the end of the reaction. | ||||||
| 175 | CIRCUIT ASSEMBLY | US13539553 | 2012-07-02 | US20140000958A1 | 2014-01-02 | Andrew J. Jozwiak |
| A circuit assembly that includes a planar lead frame formed of electrically conductive material having a first thickness. The lead frame is configured to define a routing plane and a plurality of coplanar sections in the routing plane. The circuit assembly also includes a top-side terminal formed of electrically conductive material having a second thickness independent of the first thickness. The top-side terminal is configured to be inserted into a hole defined in a section and form an electrical connection to the section, wherein the top-side terminal protrudes from the routing plane | ||||||
| 176 | MULTI-LAYER COATING FILMS | US13981189 | 2012-02-21 | US20130330561A1 | 2013-12-12 | Rudolf Schipfer; Roland Feola; Ulrike Kuttler |
| The invention relates to a process for the preparation of a multi-layer coating film on an electrically conductive substrate, comprising the steps of electrodepositing on an electrically conductive substrate, a first coating composition to form an uncured electrodeposition coating film, applying an aqueous primer-surfacer coating composition to form an uncured intermediate coating film, and then simultaneously heating the substrate coated with the said coating films and curing both the uncured electrodeposition coating film and the uncured intermediate coating film to form a cured film, wherein the curing agent B is a capped isocyanate where the capping agents are selected from the group consisting of aliphatic linear or branched diols, hydroxyalkyl(meth)acrylates and >NH functional heterocyclic aliphatic or aromatic compounds, to coating films made by this process, and to substrates covered with such coating films. | ||||||
| 177 | ELECTRODE, AND ELECTRONIC DEVICE COMPRISING SAME | US13878537 | 2011-12-29 | US20130192872A1 | 2013-08-01 | Ji Young Hwang; In-Seok Hwang; Yong Goo Son; Min Choon Park; Sungjoon Min; Jiehyun Seong |
| The present invention relates to an electrode comprising an auxiliary electrode comprising a conductive pattern and a main electrode provided on at least a portion of the auxiliary electrode to be electrically connected to the auxiliary electrode, and a manufacturing method thereof. | ||||||
| 178 | TRANSFER METHOD FOR MANUFACTURING CONDUCTOR STRUCTURES BY MEANS OF NANO-INKS | US13642006 | 2011-04-19 | US20130033840A1 | 2013-02-07 | Ando Welling |
| A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described. | ||||||
| 179 | METHOD FOR FABRICATING A THREE-DIMENSIONAL ULTRAFINE POLYMER CONDUCTING WIRE, OMNIDIRECTIONAL WIRING, AND ULTRAFINE POLYMER CONDUCTING WIRE FABRICATED USING THE METHOD | US13574093 | 2010-01-22 | US20120298401A1 | 2012-11-29 | Jung Ho Je; Ji Tae Kim; Seung Kwon Seol |
| Disclosed herein is a method for fabricating a three-dimensional ultrafine conducting polymer wire having a high aspect ratio by local chemical polymerization using a micropipette. The fabricating method includes the steps of: (a) disposing a lower end of the micropipette, filled with an aqueous monomer solution corresponding to a conducting polymer, over a surface of a substrate at an alignment point at which the ultrafine conducting polymer wire is to be formed; (b) bringing the lower end of the micropipette into contact with the surface of the substrate at the alignment point; (c) drawing the micropipette away from the surface of the substrate by a predetermined distance to form a meniscus of the aqueous monomer solution between the lower end of the micropipette and the surface of the substrate; and (d) moving the micropipette in a growth direction of the ultrafine conducting polymer wire at a constant speed such that the meniscus is grown into the ultrafine conducting polymer wire having a high aspect ratio by a polymerization reaction of the meniscus with oxygen in the air. | ||||||
| 180 | Electrical contact | US12699810 | 2010-02-03 | US08282430B2 | 2012-10-09 | Hang-Xiao He; Wei-Hong Liao; Ming-Chiang Chen |
| An electrical contact includes a soldering plate, first curved plate extended upwardly from one end of the soldering plate, a middle plate extended from the free end of the curved plate, a second curved plate extended upwardly from the free end of the soldering plate, a contact plate extended from the free end of the second curved plate, a vertical plate extended downwardly from each of opposite lateral edges of the contact plate and beyond a bottom surface of the middle plate, and a restricting plate extended inwardly from the vertical plate and positioned between the soldering plate and the middle plate. The movement of the contact plate and the middle plate are limited to resist a vertical force for preventing the electrical contact from permanent deformation in a vertical direction by the restricting plates. | ||||||
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