| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 121 | PLATE PALLET ALIGNMENT SYSTEM | US12045058 | 2008-03-10 | US20090224464A1 | 2009-09-10 | Pavel Korolik; Moshe Beres; Tamir Olpak; Shay Regev; Mark Silverman |
| A plate pallet alignment and loading apparatus (10) for originally packed plate pallet (13) into a printing plate imaging device (71) includes plate pallet adaptor (11) wherein the originally packed plate pallet (13) is placed on top; plate pallet position detectors (15, 21, 31) attach to the plate pallet adaptor (11); a pallet alignment and loading apparatus (10) loads the plates from the originally packed plate pallet (13) into the printing plate imaging device; interleaf removal system (16) separates separation paper sheets placed between the plates; and plate pallet position correction actuators (43, 44, 45) corrects the plate pallet position in respect to the plate loading system (14) in response to pallet position results read from the plate pallet position detectors. | ||||||
| 122 | CHANGING LIGHT ABSORPTION BY DISRUPTION OF CONJUGATION | US12020371 | 2008-03-24 | US20080193873A1 | 2008-08-14 | Richard H. Selinfreund |
| Copy-protected optical medium utilizing a composition comprising a transient optical state change security materials constrained to change the optical state light absorption at a wavelength of about 400 nm and an electron transfer agent. | ||||||
| 123 | Method of preparing negative-working radiation-sensitive elements | US11488588 | 2006-07-18 | US07175969B1 | 2007-02-13 | Kevin B. Ray; Heidi M. Munnelly; Ting Tao; Kevin D. Wieland; Scott A. Beckley; Jianbing Huang |
| A method of preparing negative-working, single-layer imageable elements improves their storage stability in a humid environment. The method includes enclosing the coated imageable elements in a water-impermeable sheet material that substantially inhibits the transfer of moisture to and from the imageable element. Such imageable elements include a radiation-sensitive composition that includes a radically polymerizable component, an initiator composition to provide radicals upon exposure to imaging radiation, a radiation absorbing compound, and a polymeric binder having poly(alkylene glycol) side chains. | ||||||
| 124 | Ink receptor sheet and it's process of use | US10276081 | 2001-05-02 | US07097298B2 | 2006-08-29 | Manfred Sondergeld; Volker Struewe |
| An ink receptor sheet for ink jet printing, an ink jet printing system including an ink receptor sheet and a transfer element, a process for preparing an image on permanent support by ink jet printing, and an imaged article made by such process. By incorporation of a photopolymerizable layer into an ink receptor sheet, the handling latitude during lamination and peeling steps of ink jet printing processes was enhanced and durable and resistant images made by such ink jet printing processes were provided. | ||||||
| 125 | Lithographic printing plate precursor, lithographic printing method and packaged body of lithographic printing plate precursors | US11339447 | 2006-01-26 | US20060166137A1 | 2006-07-27 | Tomoyoshi Mitsumoto; Yasuhito Oshima |
| (1) A packaged body of lithographic printing plate precursors, wherein an image-recording layer or a protective layer of the outermost surface layer contains an inorganic layered compound. (2) A lithographic printing plate precursor having a protective layer containing an inorganic layered compound, and an image-recording layer containing a binder polymer. (3) A lithographic printing plate precursor having a protective layer containing an inorganic layered compound, and an image-recording layer containing an infrared absorber and an iodonium compound. | ||||||
| 126 | Kit for making relief images | US11287919 | 2005-11-28 | US20060127805A1 | 2006-06-15 | M. Ali; David Brown; Elsie Fohrenkamm; Michael Heller |
| A kit for making a relief image that includes a film made of an infrared-imageable material and a separate imageable article comprising a photosensitive material disposed on a substrate. The film may be used to form a mask image that is opaque to a curing radiation by exposing the infrared-imageable material to infrared radiation. The mask image may then be transferred to the photosensitive material. The resulting assembly may be exposed to the curing radiation resulting in exposed and unexposed areas of the photosensitive material. Finally, the photosensitive material and mask image may be developed with a suitable developer to form a relief image. | ||||||
| 127 | Exposing systems providing post exposure baking and related methods | US10984524 | 2004-11-09 | US20050200818A1 | 2005-09-15 | Sung-Jae Ryu; Sang-Kap Kim; Young-Kyou Park; Yoon-Ho Eo |
| A system for photolithography may include an exposure chamber providing a first isolated environment, an exposure stage in the exposure chamber, a radiation source, an interface chamber providing a second isolated environment, a port, a post exposure bake heater in the interface chamber, and a wafer handler. The exposure stage may be configured to receive a wafer having photoresist thereon to be exposed, and the radiation source may be configured to provide exposing radiation to the wafer being exposed. The port may be configured to allow wafer transport between the first and second isolated environments of the exposure and interface chambers, and the post exposure bake heater may be configured to bake the wafer after exposure. The wafer handler may be configured to move the wafer from the interface chamber through the port into the exposure chamber before exposure, to move the wafer from the exposure chamber through the port to the interface chamber after exposure, and to move the wafer to the post exposure bake heater after moving the wafer from the exposure chamber. Moreover, at least one of a photoresist coating unit and/or a photoresist developing unit may be excluded from the first and second isolated environments of the exposure and interface chambers. Related methods are also discussed. | ||||||
| 128 | Method of joining a workpiece and a microstructure light exposure | US10503161 | 2003-01-31 | US20050164118A1 | 2005-07-28 | Claus Barholm -Hansen; Jacques Jonsmann |
| A method of joining a workpiece and a microstructure by light exposure, a microstructure obtainable by the method comprising a workpiece joined thereto, means thereto and use thereof; in particular a microstructure-forming composition comprising a light-sensitive, structure-forming material comprising one or more photo resist materials which are sensitive to preferably UV-light, and a light-absorbing material comprising one or more light-absorbing substances absorbing preferably IR light and being in an amount sufficient to produce heat upon exposure to said absorbed light; a microstructure-forming preparation comprising such composition; a method of producing a microstructure on a substrate; and a microstructure obtainable by the method; a method of joining a workpiece and a microstructure, a microstructure obtainable by the method comprising a workpiece joined thereto, e.g. for producing closed micro flow channels in a micro flow system; and use of such a microstructure, e.g. in lab-on-chip applications, in point-of-care systems, in high-through-put screening systems, preferably in systems for screening active compounds in fluids, in particular biological fluids. | ||||||
| 129 | Methods and apparatus for use in photopolymer plate manufacture | US10776897 | 2004-02-10 | US20040219458A1 | 2004-11-04 | Paul Mayo Holt; Maria Peneva Dincheva |
| The invention provides a photopolymer package for use in making a hand stamp plate, the package consisting of a sachet containing a photocurable liquid polymer, the walls of the sachet being formed of material capable of being released from the cured photopolymer. Methods for the formation of the package and the hand stamp plate are also provided. The invention eliminates the requirement for the use of a backing layer in the package and thereby offers significant advantages over the prior art in terms of cost and efficiency. The invention describes how that sachet can be inserted in a holding device to expose it to UV radiation to produce the printed surface. The invention describes a novel method for spraying the sachet with a liquid to enable it to be dry post-exposed in a new type of exposure unit. It describes how this exposure unit benefits from the simplicity of the sachet concept to require no movable upper lid. This unit combines the post exposure process with the exposure process without the requirement for a water bath. | ||||||
| 130 | Pattern forming method, image forming method, fine particle adsorption pattern forming method, conductive pattern forming method, pattern forming material and planographic printing plate | US10828472 | 2004-04-21 | US20040209203A1 | 2004-10-21 | Takeyoshi Kano; Koichi Kawamura |
| The invention provides a pattern forming method including providing a polymerization initiation layer which is obtained by fixing, by a cross-linking reaction, a polymer having functional groups having polymerization initiation ability and cross-linking groups at side chains, on a support, and forming a pattern including a preparation zone and a non-preparation zone of a graft polymer by preparing the graft polymer on the surface of the polymerization initiation layer using graft polymerization, by contacting a compound having a polymerizable group on the polymerization initiation layer and supplying energy imagewise; an image forming method which applies the pattern forming method; a pattern forming material; and a planographic printing plate. A fine particle adsorption pattern forming method and a conductive pattern forming method are also provided. | ||||||
| 131 | Semiconductor package and method of preparing same | US09789083 | 2001-02-20 | US06617674B2 | 2003-09-09 | Gregory Scott Becker; Geoffrey Bruce Gardner; Brian Robert Harkness; Louise Ann Malenfant; Satyendra Kumar Sarmah |
| A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention. | ||||||
| 132 | Packaged radiation sensitive coated workpiece process for making and method of storing same | US09802471 | 2001-03-09 | US20030019782A1 | 2003-01-30 | Marie Angelopoulos; Wu-Song Huang; Ranee Wai-Ling Kwong; David Robert Medeiros; Wayne Martin Moreau; Karen Elizabeth Petrillo; Herman Russell Wendt; Christopher Karl Magg |
| The present invention includes a packaged coated workpiece. The packaged coated workpiece has: (1) a workpiece coated with a resist film sensitive to optical radiation, particulates or chemical contaminants; (2) an inner barrier sealed to enclose the coated workpiece and optionally a first getter agent, to produce a sealed first enclosure; and (3) an outer barrier sealed to enclose the sealed first enclosure and optionally a second getter agent, provided that the packaged coated workpiece has at least one getter agent, to produce a packaged coated workpiece suitable for storage for a period of at least one week without substantial loss of sensitvity, resolution or performance. The present invention also includes a process for preparing a packaged coated workpiece and a method of increasing the storage time of a coated workpiece to at least one week without substantial loss of sensitivity, resolution or performance. | ||||||
| 133 | Semiconductor package and method of preparing same | US09789083 | 2001-02-20 | US20020158317A1 | 2002-10-31 | Gregory Scott Becker; Geoffrey Bruce Gardner; Brian Robert Harkness; Louise Ann Malenfant; Satyendra Kumar Sarmah |
| A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention. | ||||||
| 134 | Interleaving paper for radiation sensitive planographic printing plates | US09927182 | 2001-08-10 | US20020042021A1 | 2002-04-11 | Hiroshi Okano; Yasuhiko Kojima |
| An interleaving paper for laser exposable radiation sensitive planographic printing plate precursors having a radiation sensitive layer is disclosed. The interleaving paper has a stiffness of 100 g or higher and a stiffness per unit thickness of 2.0 g/nullm or higher. The interleaving paper can be easily removed by an automatic interleaving paper releasing machine. The printing plate precursor can be made efficiently, even when the interleaving paper is placed directly on the radiation sensitive layer of a laser exposable radiation sensitive planographic printing plate precursor that does not have a mat layer formed thereon. The interleaving paper can also be manufactured at a lower cost. Use of the interleaving paper makes it possible to reduce the distribution cost of the printing plate precursors. | ||||||
| 135 | Actinic radiation-reactive pressure-sensitive adhesive composition wherein adhesiveness is reduced upon irradiation | US632190 | 1990-12-21 | US5278199A | 1994-01-11 | Kazuo Ohkawa; Seiichi Saito |
| An actinic radiation-reactive pressure-sensitive adhesive composition can be cured in air at a high speed, without irritation and bad smell, and comprises1 a pressure-sensitive adhesive organic compound, and2 an actinic radiation-curable resin comprising (1) one or more polythiol compounds and (2) one or more polyene compounds each having at least two actinic radiation-reactive carbon-to-carbon double bonds in the molecule. | ||||||
| 136 | Laminating transparent or translucent materials using ionic dye-counter ion complexes | US220363 | 1988-07-11 | US4874450A | 1989-10-17 | Peter Gottschalk |
| A process for laminating two or more transparent or translucent substrates or one transparent and one opaque substrate together which comprises the steps of:coating a photohardenable composition on one surface of a first translucent substrate, said photohardenable composition comprising a free radical addition polymerizable or crosslinkable compound and a dye-counter ion complex, said complex being capable of absorbing actinic radiation and producing free radicals which initiate free radical polymerization or crosslinking of said compound, and preferably being photobleachable,applying a second translucent substrate to said photohardenable composition such that said photohardenable composition is interposed between said first translucent substrate and said second translucent substrate, andexposing said substrates to actinic radiation. | ||||||
| 137 | Method for producing a metallic pattern upon a substrate | US79865 | 1979-09-28 | US4288282A | 1981-09-08 | Lawrence E. Brown; James L. Bauer; Gerald W. Scheck |
| A metallic foil is laminated to a transparent substrate with a photopolymerizable adhesive. An outer layer of photoresist is used in etching a pattern in the foil. The etched foil itself is then used as a resist in the complete removal of the uncovered portions of the adhesive, leaving the transparency of the revealed substrate material totally unimpaired. Finally, the remaining adhesive is hardened by polymerization resulting from exposure to ultraviolet light passed through the substrate from the unlaminated side. | ||||||
| 138 | Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification | US60276 | 1979-07-25 | US4286047A | 1981-08-25 | Richard E. Bennett; Mary A. Hittner |
| "Release on demand" pressure-sensitive adhesives and tapes which are readily detackifiable by exposure to actinic radiation. The adhesive system has an oxirane ring-bearing component blended thereinto (or preferably reacted therewith) to achieve an adhesive epoxy equivalent value of 400-900, preferably 450-700. The adhesive system also includes an effective amount of ionic photoinitiator capable of promoting the polymerization of oxirane rings. | ||||||
| 139 | Magnetic core formed from laminations | US942155 | 1978-09-14 | US4217168A | 1980-08-12 | Peter C. Ridgway; Derek F. Case |
| A method of bonding laminations of a magnetic core is disclosed in which photo-resist material consisting of a co-polymer is applied as a film to a sheet of magnetic material to define lamination shapes to enable the laminations to be formed by etching. The film of photo-resist material on the laminations is then utilized to bond the laminations together in a stack. In order to permit the core to operate at temperatures higher than the softening temperature of the photo-resist material, the bonded stack is irradiated to cause changes to the bonding material such that the material does not soften at the operating temperature of the core. | ||||||
| 140 | Laminates useful as packaging materials and method for manufacture thereof | US733560 | 1976-10-18 | US4070398A | 1978-01-24 | Chen-i Lu |
| Heat-sealable laminates useful as packaging materials, for example, for the packaging of photographic processing chemicals, are comprised of a layer of metal foil, an outer heat-sealable layer of a radiation-cured and heat-fused polymeric composition, and a radiation-cured chemically-resistant polymeric interlayer between the foil and the outer layer. The laminates are manufactured by coating a metal foil with a radiation-curable composition that is capable of forming a chemically-resistant layer upon radiation curing, irradiating the coating to cure it, overcoating with a radiation-curable composition such as a vinyl plastisol that is capable of forming a heat-sealable layer upon radiation curing, irradiating the overcoat to cure it, and heating the laminate to fuse the overcoat layer. | ||||||
QQ群二维码
意见反馈
意见反馈